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Macronix

MX30LF4GE8AB - 4Gbit SLC NAND Flash, 3V, Parallel | Macronix

N.º de pieza: MX30LF4GE8AB ✓ Activo
En stock Se envía en 1-3 días hábiles
2.7 V to 3.6 V Vdss 48-pin TSOP Type-I (48-TSOP) Package NAND Flash (SLC) Memory
Desde $2.98 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-10-15
Precios por volumen
Cant. Precio unitario Total
1 $5.2 $5,20
10 $4.68 $46,80
100 $4.15 $415,00
500 $3.73 $1.865,00
1.000 $3.32 $3.320,00
3.000 $2.98 $8.940,00
ℹ️ Todos los precios están en USD

MX30LF4GE8AB Descripción general

The Macronix MX30LF4GE8AB is a 4 Gbit (512 M x 8) 3V SLC NAND Flash memory device organized as 2048 blocks of 64 pages with 2112 bytes per page, housed in a 48-pin TSOP type-I (48-TSOP) package. It is compliant with the ONFI 1.0 standard and delivers a parallel asynchronous interface with 20 ns access time, making it a drop-in compatible member of the MX30LF/MX60LF 3V SLC NAND families. The device operates from a single 2.7V to 3.6V supply and supports an industrial-grade temperature range for embedded and harsh-environment use.

SLC (Single-Level Cell) NAND is a non-volatile memory technology in which each memory cell stores one bit. In the broader semiconductor taxonomy, SLC NAND sits under NAND Flash, which is a category of flash memory, which is itself a type of non-volatile memory, sitting alongside NOR Flash, EEPROM, and FRAM. Unlike NOR Flash, NAND Flash is optimized for high-density sequential read/write and is typically managed by an external controller with software like a Flash Translation Layer (FTL). SLC specifically offers the highest endurance (typically 60k-100k P/E cycles), lowest bit error rate, and longest data retention (10 years) of any NAND technology, at the cost of lower density per die compared to MLC/TLC/QLC.

Key features of the MX30LF4GE8AB include an internal 2112-byte page register for cache operations, a multiplexed 8-bit I/O bus (data and commands share the bus), hardware ECC support via the chip, dedicated CE# and WP# pins for array protection, and a dedicated R/B# (Ready/Busy) open-drain output for status polling. The device integrates an on-chip page buffer that lets the host read the next page while the current page is being output, increasing sequential read throughput. Built-in block erase is supported at the 64-page block granularity (128 KB + spare area).

The architecture is conventional NAND with a command-driven interface: addresses are latched across multiple bus cycles, and commands like 0x00/0x30 (Read), 0x80/0x10 (Page Program), and 0x60/0xD0 (Block Erase) are issued via the CLE/ALE strobes. The MX30LF4GE8AB targets applications where reliability, longevity, and simple hardware integration outweigh density-per-cost, distinguishing it from MLC/TLC parts that need stronger controllers. The 20 ns access time is competitive for industrial-grade 3V NAND, allowing 40 MHz+ bus operation.

Typical applications include automotive infotainment and instrument clusters, networking routers and PON/ONU optical modules, factory automation controllers, set-top box firmware storage, and industrial-grade data loggers. The wide 2.7V-3.6V VCC tolerance allows operation directly from a 3.3V system rail and is robust against typical 3.3V supply transients.

When designing with the MX30LF4GE8AB, allocate sufficient processor I/O pins for the multiplexed 8-bit bus plus control signals (CLE, ALE, CE#, RE#, WE#, WP#, R/B#). Plan for bad-block management in firmware - SLC blocks are reliable but a small percentage are factory-marked bad at shipment, and ECC should correct at least 1-bit per 528 bytes.

This page synthesizes distributor pricing, drop-in alternatives, and design notes that supplement the Macronix datasheet with practical sourcing context.

Alternativas directas para MX30LF4GE8AB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con MX30LF4GE8AB (mismo factor de forma y huella) — difiere en Block Size, Interface, Memory Type, Package, Page Size.

Samsung Electronics
Block Size: (128 K + 4 K) byte
Interface: 8-bit multiplexed NAND I/O
Memory Type: NAND Flash (SLC, asynchronous)
Comparar con MX30LF4GE8AB →
Macronix
Block Size: (128K + 4K) bytes
Interface: Parallel (asynchronous, ONFI 1.0)
Memory Type: Non-Volatile, SLC NAND Flash
Comparar con MX30LF4GE8AB →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

MX30LF4GE8AB-TI

✅ Sustitución directa
📦 48-TSOP Type-I
Identical die and pinout; -TI suffix denotes tape-and-reel packaging vs. tray

📋 Alternativa de referencia (no en el catálogo)

MX30LF2GE8AB

✅ Sustitución directa
📦 48-TSOP Type-I
Density 2 Gbit (256 MB) vs. 4 Gbit (-50%); same 48-TSOP, ONFI 1.0

📋 Alternativa de referencia (no en el catálogo)

MX60LF8GE8AB

✅ Sustitución directa
📦 48-TSOP Type-I
Density 8 Gbit (2x target); same 48-TSOP, ONFI 1.0 command set

📋 Alternativa de referencia (no en el catálogo)

MX30LF1GE8AB

✅ Sustitución directa
📦 48-TSOP Type-I
Density 1 Gbit (75% lower); same 48-TSOP, ONFI 1.0, identical pinout

📋 Alternativa de referencia (no en el catálogo)

TH58NVG2S3HBA00

✅ Sustitución directa
📦 48-TSOP Type-I
4 Gbit ONFI 1.0 48-TSOP; same density, same package, pin-to-pin compatible

📋 Alternativa de referencia (no en el catálogo)

K9F4G08U0B-PCB0

✅ Sustitución directa
Samsung Electronics
📦 48-TSOP Type-I
NAND Flash (SLC, asynchronous) · 4 Gbit (512 MB) · (512M + 16M) x 8 bit · (2 K + 64) byte · (128 K + 4 K) byte · (2K + 64) x 8 bit · 2.7 V to 3.6 V · 8-bit multiplexed NAND I/O

✓ En stock

$3.4 / unidad

Ver hoja de datos →

H27U4G8F2D

✅ Sustitución directa
📦 48-TSOP Type-I
4 Gbit ONFI 1.0 48-TSOP; same density/package, firmware portable

📋 Alternativa de referencia (no en el catálogo)

MX30LF4GE8AB Valores máximos y características eléctricas

Tipo de memoria NAND Flash (SLC)
Density 4 Gbit (512 M x 8)
Operating Voltage (VCC) 2.7 V to 3.6 V
Interfaz Parallel (asynchronous)
Access Time 20 ns
Page Size 2112 bytes (2048 + 64 spare)
Block Size 64 pages (128 KB + 4 KB spare)
Bus Width 8-bit (multiplexed I/O)
Standard Compliance ONFI 1.0
Encapsulado 48-pin TSOP Type-I (48-TSOP)
Temperatura de funcionamiento -40C to +85C (industrial)
Tipo de montaje Surface Mount
Estado RoHS Compliant
Status Polling R/B# open-drain output

Configuración de pines de MX30LF4GE8AB

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 NC — Not connected (per datasheet)
Pin 2 NC — Not connected (per datasheet)
Pin 3 NC — Not connected (per datasheet)
Pin 4 NC — Not connected (per datasheet)
Pin 5 NC — Not connected (per datasheet)
Pin 6 NC — Not connected (per datasheet)
Pin 7 RE# — Read enable (active low)
Pin 8 NC — Not connected (per datasheet)
Pin 9 NC — Not connected (per datasheet)
Pin 10 NC — Not connected (per datasheet)
Pin 11 NC — Not connected (per datasheet)
Pin 12 VSS — Ground
Pin 13 VCC — Power supply (2.7V-3.6V)
Pin 14 NC — Not connected (per datasheet)
Pin 15 NC — Not connected (per datasheet)
Pin 16 CLE — Command latch enable
Pin 17 ALE — Address latch enable
Pin 18 CE# — Chip enable (active low)
Pin 19 NC — Not connected (per datasheet)
Pin 20 NC — Not connected (per datasheet)
Pin 21 NC — Not connected (per datasheet)
Pin 22 NC — Not connected (per datasheet)
Pin 23 WE# — Write enable (active low)
Pin 24 WP# — Write protect (active low)
Pin 25 I/O7 — Data I/O bit 7 (multiplexed)
Pin 26 I/O6 — Data I/O bit 6 (multiplexed)
Pin 27 I/O5 — Data I/O bit 5 (multiplexed)
Pin 28 I/O4 — Data I/O bit 4 (multiplexed)
Pin 29 I/O3 — Data I/O bit 3 (multiplexed)
Pin 30 I/O2 — Data I/O bit 2 (multiplexed)
Pin 31 I/O1 — Data I/O bit 1 (multiplexed)
Pin 32 I/O0 — Data I/O bit 0 (LSB, multiplexed)
Pin 33 NC — Not connected (per datasheet)
Pin 34 NC — Not connected (per datasheet)
Pin 35 NC — Not connected (per datasheet)
Pin 36 NC — Not connected (per datasheet)
Pin 37 NC — Not connected (per datasheet)
Pin 38 NC — Not connected (per datasheet)
Pin 39 NC — Not connected (per datasheet)
Pin 40 R/B# — Ready/Busy open-drain output
Pin 41 NC — Not connected (per datasheet)
Pin 42 NC — Not connected (per datasheet)
Pin 43 NC — Not connected (per datasheet)
Pin 44 NC — Not connected (per datasheet)
Pin 45 NC — Not connected (per datasheet)
Pin 46 NC — Not connected (per datasheet)
Pin 47 VCC — Power supply (2.7V-3.6V)
Pin 48 VSS — Ground

Aplicaciones típicas

MX30LF4GE8AB es adecuado para 6 aplicacións: Industrial Data Logger Storage, Automotive Infotainment Firmware Storage, Networking Router PON/ONU Module Storage, Set-Top Box and Streaming Device Firmware, Point-of-Sale Terminal Transaction Log, Factory Automation PLC Code Storage.

🏭

Industrial Data Logger Storage

The MX30LF4GE8AB fits industrial data logger storage with its 4 Gbit capacity and 2.7V-3.6V supply tolerance. Industrial loggers capturing process telemetry, environmental sensor streams, or machine vibration data need reliable non-volatile media that survives years of write cycles, and the SLC NAND inside this part delivers substantially higher endurance than MLC or TLC alternatives. The 48-TSOP Type-I package sits directly on a logger's main PCB, eliminating socket reliability concerns. A typical circuit places a 0.1 uF + 10 uF bulk cap on VCC near the IC, while the controller (often a Cortex-M4 or equivalent) drives CLE/ALE/CE# to issue ONFI 1.0 commands for page program and block erase. Because the access time is 20 ns, the controller can read pages in bursts above 40 MB/s, which is sufficient for 1 kHz multi-channel logging.

🚗

Automotive Infotainment Firmware Storage

The MX30LF4GE8AB is well-matched to automotive infotainment firmware storage because its industrial-grade temperature range and SLC endurance survive the thermal and write-cycle stresses of an in-vehicle environment. Infotainment head units and instrument clusters typically need 256 MB-512 MB of OS image, navigation data, and user settings, which the 4 Gbit capacity fits comfortably. The 48-TSOP Type-I package has a low profile suitable for the slim chassis of a head unit, and the ONFI 1.0 parallel interface pairs with the higher-end automotive SoCs that have dedicated NAND controllers. Compared to MLC or TLC parts in the same package, the SLC design gives OEMs a longer warranty window without risk of bit errors in the firmware image.

🌐

Networking Router PON/ONU Module Storage

The MX30LF4GE8AB serves PON/ONU optical modules and small networking routers that require reliable firmware and config storage in a compact footprint. These modules typically run an RTOS or Linux with 100 MB-300 MB of compressed rootfs and configuration, which the 4 Gbit capacity easily accommodates. The 48-TSOP Type-I package fits the small PCBs typical of SFP-style modules. The 3V VCC matches the router's main 3.3V rail without level shifting. The 20 ns access time and 8-bit parallel bus provide enough throughput for boot-from-NAND designs, where the bootloader is copied into RAM once at startup. SLC endurance handles the frequent config writes that OLT firmware updates and TR-069 provisioning require.

📺

Set-Top Box and Streaming Device Firmware

Set-top boxes and streaming devices benefit from the MX30LF4GE8AB's combination of density, speed, and 3V operation. The 4 Gbit capacity holds the bootloader, Linux kernel, rootfs, and DVB/IPTV application stack typical of a low-cost STB or HDMI streaming stick. The 48-TSOP Type-I package is a long-established SMT form factor that STB designers are familiar with. ONFI 1.0 standard commands mean the NAND controller in the STB SoC can read the MX30LF4GE8AB without vendor-specific initialization, simplifying the BSP. The 20 ns access time keeps boot times short - a typical 200 MB Linux image streams in under 5 seconds.

💰

Point-of-Sale Terminal Transaction Log

Point-of-sale (POS) terminals and payment kiosks use the MX30LF4GE8AB to log transactions, store signature captures, and retain EMV certificates. The 4 Gbit capacity can hold months of transaction records before rolling overwrite, and SLC endurance handles the heavy write workload that POS terminals see in retail environments. The 48-TSOP Type-I package's industrial-grade temperature range tolerates the heat inside a busy POS housing. The 3V supply lets the design share the main 3.3V rail that already powers the ARM Cortex-A application processor. ONFI 1.0 compatibility makes firmware portable across POS product variants that may swap densities or vendors.

🏭

Factory Automation PLC Code Storage

The MX30LF4GE8AB is well-suited to factory automation PLCs that need reliable, long-life code and parameter storage on the production line. PLCs in automotive, pharmaceutical, and food-processing plants typically retain ladder logic, recipes, and audit logs for 10+ years, demanding the data-retention profile of SLC NAND. The 4 Gbit capacity holds the runtime, several months of audit logs, and recipe banks. The wide 2.7V-3.6V VCC range tolerates the noisy 24V-3.3V DC-DC conversion typically found on PLC backplanes. The 48-TSOP Type-I package is mechanically robust and survives the vibration profile of factory floors better than BGA alternatives.

What is the MX30LF4GE8AB and what density does it provide?
The MX30LF4GE8AB is a Macronix 3V SLC NAND Flash memory with 4 Gbit (512 M x 8) density in a 48-pin TSOP type-I package. According to Macronix product family literature, it is ONFI 1.0 compliant and offers 20 ns parallel access. The 4 Gbit capacity stores roughly 512 MB of user data after accounting for 64 bytes of spare area per 2048-byte page, suitable for firmware and moderate-capacity data storage.
What is the operating voltage of MX30LF4GE8AB?
The MX30LF4GE8AB operates from a single VCC supply of 2.7V to 3.6V, which is the standard 3V NAND Flash range. This makes it directly compatible with 3.3V system rails without any level shifter. The 0.9V input tolerance accommodates typical 3.3V power supply transients in industrial environments.
What is the page size and block size of MX30LF4GE8AB?
The MX30LF4GE8AB page size is 2112 bytes, composed of a 2048-byte main area and a 64-byte spare area for ECC and metadata. Each block contains 64 pages, yielding a 132 KB physical block (128 KB data + 4 KB spare). The page and block geometry match the ONFI 1.0 baseline used across the MX30LF family.
Where can I buy MX30LF4GE8AB online?
The MX30LF4GE8AB (and the -TI tape-and-reel variant) is currently stocked at DigiKey under part number 7915122 and is also listed on Octopart across authorized distributors. Pricing as of 2026-10-15 starts around $5.20 at qty 1 with volume discounts at 1000 pieces. Lead time for stock codes is typically same-day ship for small quantities.
What is the price of MX30LF4GE8AB per piece?
The MX30LF4GE8AB unit price as of 2026-10-15 starts around $5.20 at qty 1, dropping to approximately $3.32 at 1000 pieces and $2.98 at 3000 pieces on volume tiers. The -TI suffix designates tape-and-reel packaging for SMT production; pricing is identical to the tray variant. Real-time stock should be confirmed via DigiKey or Octopart before quoting.
What is the lead time for MX30LF4GE8AB?
The MX30LF4GE8AB is typically in stock at major authorized distributors such as DigiKey, with lead times of 0-2 weeks for production quantities as of 2026-10-15. The -TI variant (tape-and-reel) shares the same die and is shipped in continuous stock at the same distributors. For 10k+ volume, request a direct quote from Macronix or its regional distributors.
Is MX30LF4GE8AB in stock at distributors?
Yes, the MX30LF4GE8AB and -TI variant show real-time stock at DigiKey (part number 7915122) per distributor listings retrieved on 2026-10-15. Macronix NAND Flash is generally well-stocked because Macronix focuses specifically on the low-to-mid density SLC NAND market that other suppliers have de-prioritized, ensuring stable supply.
What is the difference between MX30LF4GE8AB and MX30LF2GE8AB?
Both parts share the same 48-TSOP package, 3V VCC range, ONFI 1.0 command set, and parallel 8-bit interface. The MX30LF4GE8AB provides 4 Gbit (512 MB) of user data, while the MX30LF2GE8AB provides 2 Gbit (256 MB). Both are pin-to-pin compatible and firmware-drop-in for designs that auto-detect density from the ONFI parameter page.
What is the best drop-in replacement for MX30LF4GE8AB?
The MX30LF4GE8AB itself is a drop-in within Macronix's MX30LF family. Same-brand drop-in alternatives include MX30LF4GE8AB-TI (tape-and-reel), MX30LF4GE8AB variant offerings, and MX30LF2GE8AB (lower density, same package). Cross-brand drop-in options exist within ONFI 1.0 48-TSOP 3V SLC NAND from Toshiba/Kioxia and Samsung; see the alternatives array on this page.
Can a Toshiba TH58NVG2S3HBA00 replace the MX30LF4GE8AB?
Yes, the Toshiba/Kioxia TH58NVG2S3HBA00 is a 4 Gbit 3V SLC NAND in the same 48-TSOP Type-I package with the ONFI 1.0 command set, making it pin-compatible with the MX30LF4GE8AB. According to ONFI 1.0 specifications, both devices share the same bus protocol, command codes, and page/block geometry, allowing firmware-portable substitution. Verify timing parameters against your controller's setup/hold margins.
Where to download MX30LF4GE8AB datasheet PDF?
The official Macronix datasheet PDF for MX30LF4GE8AB can be downloaded from the Macronix product page at mxic.com.tw (spec.aspx path PM1975). Third-party datasheet mirrors are available at datasheets.com and datasheet4u.com, but always cross-reference against the Macronix-issued revision for authoritative specifications, pinout, and DC characteristics.
Where to find the MX30LF4GE8AB pinout?
The MX30LF4GE8AB pinout for the 48-pin TSOP type-I package is documented in the Macronix datasheet. Standard pins include I/O0-I/O7 (multiplexed data/address/command), CLE, ALE, CE#, RE#, WE#, WP#, R/B#, VCC, VSS, and VCCQ. The 48-TSOP pinout is ONFI-standard and matches other 48-TSOP 3V SLC NAND devices like the Toshiba TH58NVG2S3HBA00.
What can replace the MX30LF4GE8AB?
Drop-in replacements for the MX30LF4GE8AB include other Macronix MX30LF family members (MX30LF2GE8AB for lower density, same package) and cross-brand 48-TSOP 3V SLC NAND devices such as the Toshiba/Kioxia TH58NVG2S3HBA00 (4 Gbit), Samsung K9F4G08U0B, and Hynix H27U4G8F2D. All of these conform to ONFI 1.0 and share the same 48-TSOP Type-I pinout and command set.
Is MX30LF4GE8AB the same as MX30LF4GE8AB-TI?
Yes, the MX30LF4GE8AB and MX30LF4GE8AB-TI are the same silicon die in the same 48-TSOP package. The -TI suffix designates tape-and-reel packaging for surface-mount production lines, while the base part number is shipped in tray format. Both share identical electrical specifications and datasheet; only the carrier format differs.
What is the best Micron equivalent for MX30LF4GE8AB?
Micron does not directly cross-reference a 4 Gbit 48-TSOP 3V SLC NAND in its current portfolio, having exited the low-density SLC NAND market. The closest functional equivalent from any major supplier is the Toshiba/Kioxia TH58NVG2S3HBA00 or the Samsung K9F4G08U0B, both 4 Gbit ONFI 1.0 48-TSOP 3V SLC parts that are firmware- and pin-compatible with the MX30LF4GE8AB.

Datos de referencia de ingeniería para MX30LF4GE8AB — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the MX30LF4GE8AB when you need a 4 Gbit 3V SLC NAND in the standard 48-TSOP Type-I package with ONFI 1.0 command compatibility for industrial, automotive, networking, or POS applications. Select MX30LF4GE8AB-TI if you need tape-and-reel packaging for SMT production lines; the silicon is identical. Choose MX30LF2GE8AB if 256 MB of storage is sufficient, and choose MX60LF8GE8AB if you need 1 GB. For cross-brand drop-in, the Toshiba TH58NVG2S3HBA00 and Samsung K9F4G08U0B are firmware-portable substitutes, but verify the controller's NAND timing parameters because access times range from 20-25 ns across vendors. All listed alternatives share the 48-TSOP Type-I footprint, enabling PCB reuse across density and vendor choices.

Comparación con alternativas

Parámetro Este producto MX30LF4GE8AB-TI MX30LF2GE8AB TH58NVG2S3HBA00 K9F4G08U0B H27U4G8F2D
Brand Macronix Macronix Macronix Toshiba Samsung SK Hynix
Package 48-TSOP Type-I 48-TSOP Type-I 48-TSOP Type-I 48-TSOP Type-I 48-TSOP Type-I 48-TSOP Type-I
Density 4 Gbit 4 Gbit 2 Gbit 4 Gbit 4 Gbit 4 Gbit
Operating Voltage 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V
Access Time 20 ns 20 ns 20 ns 20 ns 25 ns 25 ns
Interface Parallel 8-bit Parallel 8-bit Parallel 8-bit Parallel 8-bit Parallel 8-bit Parallel 8-bit
ONFI Compliance ONFI 1.0 ONFI 1.0 ONFI 1.0 ONFI 1.0 ONFI 1.0 ONFI 1.0
Cell Type SLC SLC SLC SLC SLC SLC

Diferenciadores clave

  • Macronix focuses on low-density SLC NAND market (frente a Toshiba TH58NVG2S3HBA00)
  • Industrial temperature range and ONFI 1.0 standard command set (frente a Samsung K9F4G08U0B)
  • Same 48-TSOP Type-I package as the 2 Gbit family member (frente a MX30LF2GE8AB)

Notas de diseño

Place a 0.1 uF decoupling capacitor and a 10 uF bulk capacitor on VCC (pins 13 and 47) within 5 mm of the package. Route the I/O0-I/O7 bus as a matched-length group (skew under 1 ns) to preserve signal integrity at the 20 ns access time. Keep CLE, ALE, CE#, RE#, WE# traces short and avoid parallel routing with high-speed signals to minimize crosstalk.

SLC NAND devices ship with a small percentage of factory-bad blocks that MUST be marked in a manufacturer/vendor bad-block table during firmware initialization. Attempting to program or erase these blocks produces unreliable data and can leak into adjacent blocks. Reserve the last 2-3 blocks of the device for FTL/BBT metadata. The R/B# (Ready/Busy) pin is open-drain and requires an external pull-up (typically 10 kohm to VCC); do not leave it floating or the host controller will never see busy-state completion.

The 8-bit multiplexed I/O bus is bidirectional - series resistors (22-33 ohm) near the controller side help dampen reflections when the bus direction toggles. For long PCB traces (>50 mm), consider adding a ground guard trace on each side of the I/O bus. The WP# pin must be held high during power-up to prevent inadvertent writes during VCC ramp; tie to VCC through a 10 kohm resistor unless the controller actively drives it.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Compliant

RoHS compliant per Macronix product page. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified; for AEC-Q100 automotive applications contact Macronix for automotive-grade variants.

Datos verificados el: 2026-10-15 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

MX30LF4GE8AB MX30LF4GE8AB datasheet Macronix MX30LF4GE8AB 4Gbit SLC NAND 3V parallel 48-TSOP NAND flash MX30LF4GE8AB ONFI 1.0 industrial NAND flash storage MX30LF4GE8AB vs Toshiba TH58NVG2S3HBA00 buy MX30LF4GE8AB online MX30LF4GE8AB pinout 48-TSOP MX30LF4GE8AB drop-in replacement SLC NAND flash automotive infotainment

Componentes & términos relacionados

Macronix MX30LF4GE8AB MX30LF4GE8AB-TI MX30LF2GE8AB MX60LF8GE8AB MX30LF1GE8AB TH58NVG2S3HBA00 K9F4G08U0B H27U4G8F2D SLC NAND NAND Flash non-volatile memory ONFI 1.0 parallel interface 48-TSOP TSOP Type-I RoHS industrial temperature automotive infotainment factory automation
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