MX30UF4GE8AB - 4Gb 1.8V SLC NAND Flash, VFBGA-63 | Macronix
N.º de pieza: MX30UF4GE8AB ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4.2 | $4,20 |
| 10 | $3.85 | $38,50 |
| 100 | $3.4 | $340,00 |
| 500 | $2.95 | $1.475,00 |
| 1.000 | $2.6 | $2.600,00 |
MX30UF4GE8AB Descripción general
An SLC NAND Flash is a non-volatile memory that stores one bit per cell, providing higher endurance (typically 100k P/E cycles), faster write speeds and longer data retention than MLC/TLC NAND. SLC NAND belongs to the NAND flash memory category, which is part of the broader non-volatile memory class within semiconductor memory ICs. SLC is widely used in industrial, automotive, networking and IoT applications where MLC/TLC reliability is insufficient.
Key features include a 1.8 V single supply operation, 512M x 8 organization, x8 I/O bus, ONFI 1.0 parameter page support with CRC verification, internal data move (copy-back) operation, and multi-plane program/erase architecture for higher throughput. The device supports standard NAND command sets and is drop-in compatible with the broader ONFI 1.0 ecosystem used by other 1.8 V SLC NAND families.
The MX30UF family is implemented in a robust 1.8 V process, with an operating voltage range of 1.7 V to 1.95 V and an extended temperature grade typically rated -40C to +85C for industrial use. The internal ECC-friendly interface and dedicated hardware read/write commands simplify firmware integration.
Typical applications include industrial embedded Linux boot storage, automotive infotainment and telematics code/data storage, networking equipment firmware, IoT gateways with local data logging, and consumer STB/PND systems. The SLC endurance profile makes the device especially suitable for write-intensive logging in surveillance, point-of-sale and metering.
When designing with this device, follow standard NAND layout practices: keep the 8-bit data bus length-matched, place 0.1 uF + 10 uF decoupling close to VCC and VCCQ, and route the R/B# pin with a pull-up. A controller must implement ECC and bad block management, as per ONFI 1.0.
This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet.
Alternativas directas para MX30UF4GE8AB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MX30UF2GE8AB-XKI
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MX30UF1GE8AB-XKI
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MX30LF4GE8AB-XKI
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MX30LF2GE8AB-XKI
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MX30LF1GE8AB-XKI
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MX30UF4GE8AB Valores máximos y características eléctricas
| Tipo de memoria | SLC NAND Flash (Non-volatile) |
| Density | 4 Gbit (512M x 8) |
| Operating Voltage (VCC) | 1.7 V to 1.95 V (1.8 V typical) |
| Interfaz | ONFI 1.0 parallel NAND, x8 I/O |
| Bus Width | 8-bit |
| Program/Erase Endurance | Up to 100,000 cycles (SLC) |
| Data Retention | 10 years typical |
| Encapsulado | VFBGA-63 (9 x 11 mm, 0.80 mm pitch, 1.0 mm height) |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Tipo de montaje | Surface Mount |
| Compliance | ONFI 1.0, RoHS |
| Bad Block Management | Required by host (per ONFI 1.0) |
| ECC Requirement | Host ECC recommended (ONFI 1.0) |
Guía de configuración de pines de MX30UF4GE8AB vfbga-63 (9 x 11 mm, 0.80 mm pitch, 1.0 mm height)
Configuración de pines para MX30UF4GE8AB (encapsulado vfbga-63 (9 x 11 mm, 0.80 mm pitch, 1.0 mm height)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MX30UF4GE8AB.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MX30UF4GE8AB es adecuado para 6 aplicacións: Industrial Embedded Linux Boot Storage, Automotive Infotainment and Telematics, Networking Equipment Firmware and Logs, IoT Gateway Local Data Logging, Set-Top Box and Portable Navigation Device, Surveillance and POS Logging.
Industrial Embedded Linux Boot Storage
The MX30UF4GE8AB provides 4 Gbit of 1.8 V SLC NAND for industrial Linux rootfs and bootloader storage where predictable latency and high endurance are mandatory. The 1.7-1.95 V VCC aligns directly with the 1.8 V NAND controller rail of typical industrial SoCs, eliminating level shifters. SLC endurance of up to 100k P/E cycles supports years of journaled filesystem writes, while the ONFI 1.0 command set lets the host run standard MTD and UBI drivers without vendor lock-in. The VFBGA-63 footprint fits compact SoM designs.
Recomendado
Automotive Infotainment and Telematics
Automotive infotainment head units and telematics control units (TCUs) require non-volatile storage for navigation maps, firmware, and event logs that survives temperature swings and constant write activity. The MX30UF4GE8AB's 1.8 V operation and SLC endurance profile are well-suited for these in-vehicle systems operating from -40C to +85C. The 512M x 8 organization provides ample space for compressed map data and rolling DTC logs. ONFI 1.0 compliance lets automotive Tier-1 vendors reuse existing NAND management stacks without proprietary glue code.
Recomendado
Networking Equipment Firmware and Logs
Routers, switches and industrial gateways use the MX30UF4GE8AB as primary or secondary non-volatile storage for firmware images, configuration, and system logs. Its 4 Gbit capacity holds multiple firmware A/B partitions plus persistent log storage for network diagnostics. The 1.8 V interface matches low-power networking SoCs that prioritize power efficiency for always-on edge devices. ONFI 1.0 timing ensures predictable read latency for fast firmware boot, and the SLC endurance profile tolerates frequent log write cycles that would wear out MLC/TLC NAND quickly.
Recomendado
IoT Gateway Local Data Logging
Edge IoT gateways aggregate sensor streams and store them locally during network outages, then forward buffered data when connectivity returns. The MX30UF4GE8AB's 4 Gbit capacity buffers days of telemetry at typical edge sample rates, while its SLC endurance supports constant journaling that would quickly degrade MLC/TLC NAND. The 1.8 V operation minimizes gateway standby power for battery-backed deployments. ONFI 1.0 standardized commands let IoT firmware engineers use off-the-shelf flash file systems (JFFS2, UBIFS) without per-vendor glue layers.
Recomendado
Set-Top Box and Portable Navigation Device
Set-top boxes (STBs) and portable navigation devices (PNDs) require non-volatile storage for firmware, channel guides, and map tiles that must survive power-loss events and frequent updates. The MX30UF4GE8AB offers 4 Gbit of SLC storage with ONFI 1.0 timing, fitting typical STB NAND requirements while the SLC profile tolerates frequent over-the-air firmware updates. The 1.8 V interface is compatible with mainstream STB SoCs, and the small VFBGA-63 footprint suits slim PND enclosures. Long 10-year data retention supports products with long field lifecycles.
Recomendado
Surveillance and POS Logging
Video surveillance NVRs, DVRs and point-of-sale (POS) terminals write continuously to non-volatile storage for audit trails and event logs. The MX30UF4GE8AB's SLC endurance of up to 100,000 P/E cycles is ideal for these write-intensive workloads where MLC/TLC NAND would fail prematurely. The 1.8 V interface integrates with low-power SoCs used in compact POS terminals, while the 4 Gbit capacity holds weeks of compressed event metadata. ONFI 1.0 standard commands simplify integration with both Linux and RTOS-based POS firmware.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MX30UF4GE8AB — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MX30UF2GE8AB-XKI | MX30UF1GE8AB-XKI | MX30LF4GE8AB-XKI | MX30LF2GE8AB-XKI | MX30LF1GE8AB-XKI |
|---|---|---|---|---|---|---|
| Package | VFBGA-63 (9x11 mm) | VFBGA-63 (same) | VFBGA-63 (same) | VFBGA-63 (same) | VFBGA-63 (same) | VFBGA-63 (same) |
| Brand | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix |
| Density | 4 Gbit (512M x 8) | 2 Gbit (256M x 8) | 1 Gbit (128M x 8) | 4 Gbit (512M x 8) | 2 Gbit (256M x 8) | 1 Gbit (128M x 8) |
| Operating Voltage (VCC) | 1.7 V to 1.95 V (1.8 V) | 1.7 V to 1.95 V (1.8 V) | 1.7 V to 1.95 V (1.8 V) | 2.7 V to 3.6 V (3.3 V) | 2.7 V to 3.6 V (3.3 V) | 2.7 V to 3.6 V (3.3 V) |
| Interface Standard | ONFI 1.0, x8 | ONFI 1.0, x8 | ONFI 1.0, x8 | ONFI 1.0, x8 | ONFI 1.0, x8 | ONFI 1.0, x8 |
| Endurance (P/E cycles) | Up to 100,000 (SLC) | Up to 100,000 (SLC) | Up to 100,000 (SLC) | Up to 100,000 (SLC) | Up to 100,000 (SLC) | Up to 100,000 (SLC) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Pin-to-Pin Compatible | Yes (VFBGA-63 reference) | Yes | Yes | Package yes, voltage no | Package yes, voltage no | Package yes, voltage no |
Diferenciadores clave
- 1.8 V native operation (frente a MX30LF4GE8AB-XKI)
- Highest density in the MX30UF family (frente a MX30UF2GE8AB-XKI)
- SLC endurance profile (frente a MLC/TLC NAND competitors)
Notas de diseño
Use a 4-layer PCB with a continuous ground plane directly under the VFBGA-63 footprint to provide a low-impedance reference for the NAND signals and to manage SSO (simultaneous switching output) noise on the 8-bit I/O bus. Decouple VCC and VCCQ with a 0.1 uF X7R ceramic placed within 2 mm of each power ball, and add a 10 uF bulk capacitor near the device. Route the I/O[7:0] bus with length matching of +/- 100 mils and avoid splitting the ground plane beneath the package.
Keep the RE#, WE#, CLE, ALE and CE# control traces short and isolated from the I/O bus to minimize crosstalk. Series-terminate the RE# and WE# strobes with 22-33 ohm resistors placed close to the controller to dampen ringing on the bidirectional 8-bit data bus. The R/B# (ready/busy) output is open-drain on most ONFI 1.0 parts; use an external 10 kohm pull-up to VCCQ and route this pin away from switching power traces.
The MX30UF4GE8AB requires the host controller to implement bad block management (BBM) and ECC per the ONFI 1.0 specification; the device itself does not include an internal ECC engine. Failing to initialize and skip factory-marked bad blocks will result in data corruption on first use. Also note that the 1.8 V VCC range must NOT be confused with the 3.3 V MX30LF family; cross-substituting UF and LF parts will permanently damage the part or the host controller.
The VFBGA-63 package is rated for the standard -40C to +85C industrial temperature range, but high sustained program/erase activity can raise the junction temperature above ambient. For sealed enclosures without airflow, derate write throughput by 30-50% or add a thermal via array under the center balls to the internal ground plane. Storage of the device above 85C for extended periods degrades data retention; follow JEDEC JESD22-A104 temperature-cycling guidance during qualification.
Información de cumplimiento
RoHS compliance per Macronix product page. AEC-Q100 qualification status not stated in the provided data; the MX30UF family is positioned for industrial/consumer rather than AEC-Q100 automotive. REACH, halogen-free and conflict-minerals status not in provided data - set to unknown.
