PC28F640P30BF65B - 64Mb Parallel NOR Flash, 52MHz, 64-EasyBGA | Micron
N.º de pieza: PC28F640P30BF65B ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $8.39 | $8,39 |
| 10 | $7.55 | $75,50 |
| 100 | $6.71 | $671,00 |
| 500 | $5.87 | $2.935,00 |
| 1.000 | $5.03 | $5.030,00 |
PC28F640P30BF65B Descripción general
A parallel NOR Flash (often called CFI NOR) is a non-volatile memory that maps random memory accesses onto a parallel address/data bus, giving true execute-in-place (XIP) capability. Unlike NAND, every byte is addressable and read latency is deterministic in tens of nanoseconds, so boot code, BIOS, and firmware can run directly from the array without shadowing into DRAM. Parallel NOR sits above asynchronous SRAM and below NAND in the memory hierarchy: lower density than NAND, far faster random access, and far more durable (typically 100K program/erase cycles per sector).
Key features include a bottom-boot sector architecture (parameter and small boot blocks at low addresses, bulk array above), 65 ns initial access / 52 MHz burst read for fast sequential code execution, x16 data width with multiplexed address bus, hardware data protection via WP#/LOCK#, deep power-down to microamp-level standby, and a -40C to +85C industrial operating range. The P30 family is also known for an automotive grade option (-B suffix) and a self-encrypting drive variant in the 128 Mb member of the family.
The architecture is a true 16-bit-wide NOR cell array with on-chip write state machine supporting chip/sector erase and single-word programming, freeing the host from toggling legacy Intel-command sequences. Programmable erase and program timing let the host trade throughput for in-system endurance. The 64-ball EasyBGA package (10x13 mm) provides a compact footprint with exposed die attach paddle for thermal dissipation during sustained writes or erases.
Typical applications include automotive infotainment boot ROM, networking line cards running u-boot or VxWorks directly from flash, industrial PLC firmware storage, point-of-sale terminals, and any embedded design requiring deterministic read latency and high endurance. The bottom-boot layout favors systems that need a small, frequently-updated calibration block plus a large read-mostly code region.
Designers should respect the 1.7-2.0V VCC window, place VCC/VCCQ decoupling within 5 mm of the balls, and observe tAVQV (address-to-output) timing. Because this part is supplied today primarily by Alliance Memory's Axcell franchise (Micron exit-NOR was completed earlier), confirm current lead time and lifecycle status at order entry.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found on a single manufacturer datasheet page.
Alternativas directas para PC28F640P30BF65B — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PC28F640P30BF65B (mismo factor de forma y huella) — difiere en Memory Type, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PC28F640P30BF65E
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PC28F640P30B65B
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PC28F640P30T65B
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PC28F128P30BF65B
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PC28F256P30BF65B
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PC28F640P30BF65B Valores máximos y características eléctricas
| Tipo de memoria | Non-Volatile FLASH - NOR (CFI) |
| Tamaño de memoria | 64 Mbit |
| Memory Organization | 4M x 16 |
| Ancho del bus de datos | 16 bit (x16) |
| Tipo de interfaz | Parallel |
| Access Time | 65 ns |
| Burst Read Clock Frequency | 52 MHz |
| Write Cycle Time - Word, Page | 65 ns |
| Sector Architecture | Bottom Boot (parameter/small boot blocks at low addresses) |
| Supply Voltage - VCC | 1.7 V to 2.0 V |
| Temperatura de funcionamiento | -40C to +85C |
| Encapsulado / Carcasa | 64-EasyBGA (10x13 mm) |
| Tipo de montaje | Surface Mount |
Guía de configuración de pines de PC28F640P30BF65B 64-easybga (10x13 mm)
Configuración de pines para PC28F640P30BF65B (encapsulado 64-easybga (10x13 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para PC28F640P30BF65B.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
PC28F640P30BF65B es adecuado para 6 aplicacións: Embedded Firmware Boot Storage, Automotive Infotainment Boot ROM, Networking Line Card Firmware, Industrial PLC Code Storage, Point-of-Sale Terminal Firmware, Router/Switch Boot and Recovery Image.
Embedded Firmware Boot Storage
The PC28F640P30BF65B is ideal for embedded firmware boot storage because its 65 ns access time and 52 MHz synchronous burst mode let microcontrollers execute boot code directly from the NOR array (execute-in-place / XIP). The 64 Mb capacity comfortably holds 8 MB of bootloader plus OS image for typical industrial controllers. Bottom-boot sectors reserve 8 KB / 64 KB at the low end for frequently updated calibration constants while the bulk 128 KB sectors hold read-mostly code. The 1.7-2.0V VCC window matches modern low-voltage SoCs without level shifters.
Recomendado
Automotive Infotainment Boot ROM
The PC28F640P30BF65B's -40C to +85C industrial temperature range, parallel address/data interface, and deterministic 65 ns read latency make it well-suited to head-unit and cluster boot ROM roles. It supports CFI for in-system identification by the host SoC and offers hardware write-protect via WP# to guard boot sectors against accidental reprogramming. For AEC-Q100 Grade 1 (125C) under-hood designs, designers should select the explicit automotive-grade P30 member (suffix -B65 with AEC-Q100 certification) rather than the standard 85C part.
Recomendado
Networking Line Card Firmware
The PC28F640P30BF65B delivers deterministic read latency essential for networking line cards running u-boot or VxWorks directly from Flash without DRAM shadowing, reducing bill-of-materials cost and cold-start time. Its x16 data width provides enough bandwidth for typical network processor firmware streams at 52 MHz burst, while the 64-EasyBGA 10x13 mm footprint is compact enough for dense line-card PCB layouts. Hardware WP# and LOCK# pins allow secure field-update workflows required by carrier-grade equipment.
Recomendado
Industrial PLC Code Storage
The PC28F640P30BF65B fits industrial PLC code storage where the 64 Mb capacity holds ladder-logic firmware plus parameter sets, and the bottom-boot sectors provide safe locations for machine-specific calibration data. Its 100K program/erase endurance per sector (P30 family typical) is well-matched to PLCs that update logic blocks during commissioning but rarely afterward. The industrial -40C to +85C operating range and 1.7-2.0V VCC keep it compatible with low-voltage PLC SoCs.
Recomendado
Point-of-Sale Terminal Firmware
The PC28F640P30BF65B suits point-of-sale (POS) terminals that require deterministic boot latency and secure field-upgrade paths for PCI-compliant firmware signing. The 64 Mb capacity supports full POS application code plus transaction log buffers staged before upload, while the parallel interface integrates with the terminal's main application processor without DMA complexity. WP# and LOCK# provide hardware write-protect for signed firmware regions during normal operation.
Recomendado
Router/Switch Boot and Recovery Image
The PC28F640P30BF65B provides deterministic read latency and execute-in-place capability required for primary boot and golden recovery images in managed switches and enterprise routers. Its 64 Mb capacity holds a full network operating system plus a small recovery partition, and the EasyBGA 10x13 mm package fits compact router mainboards. The bottom-boot layout places the recovery image at known low addresses, simplifying bootloader logic that switches between primary and golden images during field recovery.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PC28F640P30BF65B — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PC28F640P30BF65E | PC28F640P30B65B | PC28F640P30T65B | PC28F128P30BF65B | PC28F256P30BF65B |
|---|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Package | 64-EasyBGA (10x13) | 64-EasyBGA (10x13) - same | 64-EasyBGA (10x13) - same | 64-EasyBGA (10x13) - same | 64-EasyBGA (10x13) - same | 64-EasyBGA (10x13) - same |
| Density | 64 Mb (4M x 16) | 64 Mb (4M x 16) | 64 Mb (4M x 16) | 64 Mb (4M x 16) | 128 Mb (8M x 16) - 2x density | 256 Mb (16M x 16) - 4x density |
| Access Time | 65 ns | 65 ns | 65 ns | 65 ns | 65 ns | 65 ns |
| Burst Read Clock | 52 MHz | 52 MHz | 52 MHz | 52 MHz | 52 MHz | 52 MHz |
| VCC Supply | 1.7V to 2.0V | 1.7V to 2.0V | 1.7V to 2.0V | 1.7V to 2.0V | 1.7V to 2.0V | 1.7V to 2.0V |
| Sector Architecture | Bottom Boot | Top Boot | Bottom Boot | Top Boot | Bottom Boot | Bottom Boot |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Diferenciadores clave
- Bottom-boot sector layout for small frequently-updated parameters at low addresses (frente a PC28F640P30T65B (top-boot variant))
- Alliance Memory Axcell franchise support extends lifecycle beyond Micron exit-NOR (frente a Older discontinued Micron parallel NOR parts)
- Synchronous 52 MHz burst read for high-throughput XIP code execution (frente a Asynchronous-only parallel NOR parts (e.g. legacy Am29LV series))
Notas de diseño
The PC28F640P30BF65B requires VCC of 1.7V to 2.0V and a separate VCCQ rail (typically 1.7V-3.6V per P30 family datasheet). Place 0.1 uF ceramic decoupling within 5 mm of each VCC/VCCQ ball pair and a bulk 4.7 uF tantalum or ceramic on the supply side. Estimated: at 52 MHz continuous burst read, supply current approximates 25-30 mA for the core plus I/O switching - size the regulator for 1.5x margin to avoid droop-induced read errors.
The 64-EasyBGA (10x13 mm) package requires NSMD (non-solder-mask-defined) land pads with a 0.5 mm pitch BGA footprint per JEDEC MO-211. Use microvia-in-pad if the design is a 4-layer or thinner stack-up; otherwise dog-bone fan-out is acceptable for 6+ layer boards. Confirm EasyBGA ball matrix against the P30 family datasheet ball-map before committing artwork - the EasyBGA has a unique depopulated corner pattern versus a standard JEDEC 64-ball BGA.
Do not substitute the bottom-boot PC28F640P30BF65B with the top-boot -T65B variant without updating firmware sector maps - the small 8 KB / 64 KB parameter sectors are mirrored to opposite ends of the address space. Hold the device in reset (RP# low) during power-up until VCC and VCCQ are stable for at least 1 ms to prevent spurious command latches. Do not apply WP# assertion during a program or erase operation - it will abort the cycle and may corrupt the target sector.
Información de cumplimiento
Compliance fields not explicitly listed in the Verified Web Data snippet; treat as unknown until cross-checked against the current Alliance Memory / Micron PCN or full manufacturer datasheet. Part is supplied today through Alliance Memory's Axcell franchise program that re-supports discontinued Micron NOR devices.
