Texas Instruments

TPS65951A1ZWSR - OMAP PMIC + Audio Codec 169-NFBGA | Texas Instruments

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169-NFBGA (LFBGA), 12x12 mm square Package
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Precio actualizado: 2026-08-29
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TPS65951A1ZWSR Descripción general

The Texas Instruments TPS65951A1ZWSR is an integrated power management IC (PMIC) designed for mobile cellular handsets powered by Li-ion, Li-ion polymer, or cobalt-nickel-manganese battery cells. It connects to an application processor and/or modem and is specifically optimized to meet the power requirements of Texas Instruments OMAP processor devices. The device is supplied in a 169-ball NFBGA (LFBGA) package measuring 12x12 mm.

A power management IC (PMIC) is a specialized class of power management integrated circuits that combines multiple voltage regulators, sequencing logic, and supervisory functions on a single die, reducing board area and BOM count in battery-powered systems. Within this hierarchy, the TPS65951 sits at the system-power level, sitting above individual DC-DC converters and LDO regulators and integrating the entire handheld power tree.

According to the TI data manual, the TPS65951 contains several buck converters and low-dropout regulators to generate the multiple rails required by application processors, plus USB transceiver and charger interface functionality typical of the TPS659xx handset family. A distinctive feature is its complete audio subsystem: an entire audio module with audio codecs, digital filters, input preamplifiers and amplifiers, and class-D output amplifiers, allowing a single chip to manage both power and audio signal chains.

Typical applications include OMAP-based smartphone and tablet power management, handheld/mobile device power sequencing, and communication control in cellular handsets. The industrial temperature grade (per distributor data) supports embedded and portable instrumentation designs beyond handsets.

When designing with the TPS65951A1ZWSR, follow the TI reference schematics for OMAP power sequencing, as rail ordering is controlled by the device's internal state machine. Verify software I2C configuration against the TI application code, and confirm battery charger parameters match the chosen Li-ion cell chemistry. Pricing and availability should be verified as of 2026-08-29.

Alternativas directas para TPS65951A1ZWSR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con TPS65951A1ZWSR (mismo factor de forma y huella) — difiere en Audio Subsystem, Function, Package, Operating Temperature, Target Processor.

Texas Instruments
Audio Subsystem: Audio codec, digital filters, preamps, Class-D amplifiers
Function: Integrated Power Management IC with Audio Codec
Package: 169-BGA MicroStar LFBGA (12 x 12 mm)
Comparar con TPS65951A1ZWSR →
Texas Instruments
Audio Subsystem: Codecs, digital filters, input preamplifiers/amplifiers, Class-D output amplifiers
Function: Integrated Power Management IC + Audio Codec Silicon
Package: 169-BGA MicroStar (12 x 12 mm), LFBGA
Comparar con TPS65951A1ZWSR →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

TPS65950A1ZWSR

✅ Sustitución directa
📦 169-NFBGA (12x12)
same-family handset PMIC, same OMAP power architecture; audio block differs (no enhanced class-D outputs)

📋 Alternativa de referencia (no en el catálogo)

TPS65951A1ZGUR

✅ Sustitución directa
Texas Instruments
📦 169-NFBGA variant
Integrated Power Management IC + Audio Codec Silicon · OMAP application processor / modem · 2.7 V to 4.5 V · Li-ion / Li-ion polymer / cobalt-nickel-manganese cell · Codecs, digital filters, input preamplifiers/amplifiers, Class-D output amplifiers

✓ En stock

$5.94 / unidad

Ver hoja de datos →
ℹ️ 3 pieza(s) de otro encapsulado ocultas — un encapsulado diferente requiere retrabajo de la PCB y no es una sustitución directa real. Contáctenos si necesita sugerencias de otros encapsulados.

TPS65951A1ZWSR Valores máximos y características eléctricas

Función Integrated Power Management / Audio Codec PMIC
Target Processor TI OMAP application processors
Battery Chemistry Li-ion / Li-ion polymer / cobalt-nickel-manganese
Audio Subsystem Audio codecs, digital filters, preamplifiers, class-D output amplifiers
Encapsulado 169-NFBGA (LFBGA), 12x12 mm square
Tipo de montaje Surface Mount
Number of Terminals 169
Temperature Grade Industrial
Estado del ciclo de vida Active per TI product page

Guía de configuración de pines de TPS65951A1ZWSR 169-nfbga (lfbga), 12x12 mm square

Configuración de pines para TPS65951A1ZWSR (encapsulado 169-nfbga (lfbga), 12x12 mm square). Este dispositivo de potencia presenta terminales de puerta, drenador y fuente. Para encapsulados no polarizados, consulte la hoja de datos del fabricante para conocer la orientación exacta del pin 1 y los detalles del footprint. Las aplicaciones habituales incluyen el diseño de fuentes de alimentación, el accionamiento de motores y la conmutación de cargas.

Diagrama de patillaje del encapsulado 169-nfbga (lfbga), 12x12 mm square para TPS65951A1ZWSR

No hay datos detallados de patillaje disponibles para TPS65951A1ZWSR.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

TPS65951A1ZWSR es adecuado para 6 aplicacións: OMAP Smartphone Power Management, Mobile Audio Signal Chain, Li-ion Battery Charging Management, Embedded ARM/Linux Board Power, Portable Medical and Instrumentation Devices, Communication Control and Modem Power.

📱

OMAP Smartphone Power Management

The TPS65951A1ZWSR is purpose-built for handset power trees around TI OMAP application processors. Its internal state machine sequences the multiple buck converter and LDO rails in the order OMAP devices require, while its charger interface manages a Li-ion or Li-ion polymer cell. Integration of power and audio into one 169-ball 12x12 mm package reduces board area versus a discrete regulator-plus-codec solution. Use the TI reference design for the specific OMAP variant, as rail ordering and default voltages are set by the PMIC firmware and I2C host configuration.

🎧

Mobile Audio Signal Chain

The integrated audio module of the TPS65951 combines audio codecs, digital filters, input preamplifiers, and class-D output amplifiers, so handset speaker and headset paths are powered and processed by the same chip that manages the power tree. The class-D outputs drive speakers directly without external amplifier stages, reducing component count and quiescent power. Place the device close to the speaker connectors and follow TI layout guidance for class-D filtering to keep EMI within handset regulatory limits.

⚡

Li-ion Battery Charging Management

Designed for handsets powered by Li-ion, Li-ion polymer, or cobalt-nickel-manganese cells, the TPS65951 manages charge control and battery supervision as part of its power-management function. The charger interface works with the host processor over the control bus to set charge parameters for the chosen cell chemistry. For designs requiring higher charge currents or USB-PD input, pair the PMIC with a dedicated charger IC and use the TPS65951 for rail generation and audio only.

🖥️

Embedded ARM/Linux Board Power

Although optimized for OMAP handsets, the TPS65951A1ZWSR fits embedded ARM boards needing a multi-rail, processor-managed power solution with an industrial temperature grade (per distributor data). Its several buck converters and LDOs supply core, I/O, and memory rails while the host configures voltages over the control interface. The 169-ball BGA requires careful PCB stack-up; plan via-in-pad fanout and follow TI's 12x12 mm BGA land-pattern recommendation for reliable assembly.

💊

Portable Medical and Instrumentation Devices

Battery-powered portable instruments benefit from the TPS65951's single-chip integration of power sequencing, battery management, and audio capture/playback. The industrial temperature grade supports operation in clinical environments, and the codec plus class-D amplifiers implement alarms and voice prompts without extra analog circuitry. Because the device is application-optimized for OMAP processors, verify that its default rail voltages and charger profile match the instrument battery and MCU requirements during design review.

🌐

Communication Control and Modem Power

The TPS65951 can connect to a modem in addition to or instead of the application processor, managing communication-control power sequencing in cellular designs. Its rail architecture supplies RF and baseband loads typical of handsets, and its audio path supports voice codec functionality. Ensure the I2C host firmware programs modem-specific rail voltages and sequencing, and confirm RF load-transient behavior with the buck converter ratings given in the TI data manual before layout freeze.

Resumen de productos recomendados

What is the TPS65951A1ZWSR?
The TPS65951A1ZWSR is a Texas Instruments integrated power management IC (PMIC) with audio codec for mobile handsets. It combines several buck converters, LDO regulators, and a full audio module (codecs, filters, preamps, and class-D amplifiers) in a 169-ball NFBGA 12x12 mm package, and is optimized for TI OMAP application processors.
Which processors does the TPS65951 support?
The TPS65951 is designed to support the specific power requirements of TI OMAP application processor devices and can connect to an application processor and/or a modem. According to the TI product page, its rail configuration and sequencing state machine follow the OMAP power-up requirements for cellular handsets.
What package does the TPS65951A1ZWSR come in?
The TPS65951A1ZWSR is supplied in a 169-ball NFBGA (LFBGA) package with a 12x12 mm square body, surface-mountable per distributor data (DigiKey, Vyrian). The 169-ball footprint follows the TI MicroStar BGA family used across the TPS659xx handset PMIC series.
What is the difference between TPS65951 and TPS65950?
The TPS65951 and TPS65950 are members of the same TI handset PMIC family sharing the 169-ball BGA footprint and OMAP-targeted power architecture. The TPS65951 integrates an enhanced audio module with class-D output amplifiers. Per TI documentation, both target OMAP processors; verify exact audio codec differences in each data manual before substitution.
Can TPS65950 replace TPS65951A1ZWSR?
The TPS65950 is the closest same-brand alternative in the TPS659xx handset family, per distributor cross-reference listings (Eiyu). It shares the 169-ball BGA package and OMAP power architecture, but audio subsystem details differ (TPS65951 adds class-D outputs). Review both TI data manuals and your audio routing before committing to a replacement.
Is the TPS65951A1ZWSR still in production and available?
Yes. As of 2026-08-29, the TPS65951A1ZWSR is listed as an active part on TI.com and is in stock at distributors: DigiKey reports ships-today availability, and HLElectronics lists in stock. Octopart compares bulk pricing from 3 distributors. Verify current stock and pricing at time of order.
What is the price of TPS65951A1ZWSR?
Pricing for TPS65951A1ZWSR is available from multiple distributors as of 2026-08-29. DigiKey, Mouser, and Octopart list quantity-break pricing (typically $6-9 range at low volume for this class of handset PMIC). Exact current pricing varies by quantity and distributor; check the XAIPART price tiers above or distributor listings for the latest quote.
Where can I buy TPS65951A1ZWSR online?
The TPS65951A1ZWSR can be purchased from authorized distributors including DigiKey (product page 13563048), Mouser, and Octopart-compared distributors. XAIPART also offers this part with datasheet access and technical support. As of 2026-08-29, DigiKey shows ships-today stock availability.
Where do I download the TPS65951A1ZWSR datasheet PDF?
The TPS65951 data manual is available on the official TI product page at ti.com/product/TPS65951, and a PDF copy is hosted on alldatasheet.com (170 pages, ~1 Mbytes, listed as Integrated Power Management/Audio Codec). TI recommends always downloading the latest revision from TI.com for design work.
Is the TPS65951 suitable for non-handset industrial designs?
Yes, with caveats. Distributor data (Vyrian) lists an industrial temperature grade, so the device can operate beyond smartphone environments. However, its rail configuration, charger interface, and audio codec are optimized for OMAP-class application processors; for generic industrial power trees, a more conventional PMIC may offer simpler configuration.
What are the key specifications of TPS65951A1ZWSR that engineers should know?
Key facts: it is a single-chip PMIC plus audio codec for Li-ion/polymer battery handsets, targeting TI OMAP processors. It integrates multiple buck converters and LDOs plus audio codecs, digital filters, preamplifiers, and class-D output amplifiers, per the TI data manual. Package: 169-ball NFBGA, 12x12 mm. Temperature grade: industrial. Exact converter current ratings require the full TI data manual.
What is the best TI equivalent for TPS65951A1ZWSR?
The best same-brand equivalents are within the TI TPS659xx handset PMIC family: TPS65950 and TPS65930/TPS65921-class devices, which share the 169-ball BGA footprint and OMAP power architecture. Per distributor listings (Eiyu), TPS65950 is the most commonly cited equivalent. Always confirm ball-map and audio-block parity against the TI data manual, as these are application-specific PMICs.
Does the TPS65951 include an audio codec?
Yes. According to the TI data manual, the audio portion of the TPS65951 is an entire audio module with audio codecs, digital filters, input preamplifiers and amplifiers, and class-D output amplifiers. This integration lets a handset implement the power tree and audio signal chain with one PMIC, saving board area and BOM components.
Is TPS65951A1ZWSR the same as TPS65951A1ZGUR?
No, they are different ordering variants. Both are TPS65951A1 silicon, but the ZWSR and ZGUR suffixes denote different package/ball-mapping options in the 169-ball BGA family per DigiKey cross-reference listings. Do not substitute one for the other without comparing the mechanical ball-map drawings in the TI data manual, since the landing pattern may differ.

Datos de referencia de ingeniería para TPS65951A1ZWSR — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose TPS65951A1ZWSR when designing a handset or portable device around a TI OMAP application processor where a single-chip power tree plus audio codec (including class-D speaker drive) minimizes board area and BOM cost. Choose TPS65950A1ZWSR if your audio path already uses an external codec/amplifier and you want the same 169-ball power architecture. Choose TPS659039-Q1 (Site MPN) for new designs around TI's newer processor generations needing AEC-Q100 qualification - it is not pin-compatible but is the functional successor. For new non-OMAP multi-rail designs, consider LP87725-Q1 or TPS65036x-Q1 instead, as they offer simpler configuration for generic processor power trees. Honest trade-off: the TPS65951's OMAP optimization means configuration complexity and limited flexibility outside that ecosystem.

Comparación con alternativas

Parámetro Este producto TPS65950A1ZWSR TPS65951A1ZGUR TPS659039-Q1
Brand Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Target Processor TI OMAP processors TI OMAP processors TI OMAP processors (same silicon) TI newer-generation processors
Integrated Audio Codec Yes (with class-D outputs) Yes (audio block differs) Yes (identical silicon) No (power only)
Lifecycle Status Active Active (verify) Active (verify) Active

Diferenciadores clave

  • Integrated audio module with class-D output amplifiers (frente a TPS65950A1ZWSR)
  • Single-chip power plus audio for OMAP handsets (frente a TPS659039-Q1)
  • Co-Ni-Mn battery chemistry support (frente a TPS65950A1ZWSR)

Notas de diseño

The TPS65951 is an application-specific PMIC: its power-up ordering state machine is optimized for TI OMAP processors. Do not assume generic PMIC behavior - configure rail voltages and sequencing through the host control interface per the TI data manual and reference software. Migrating from TPS65950 to TPS65951 requires audio-routing review because the audio block differs (class-D outputs added).

The 169-ball 12x12 mm NFBGA package needs a careful fanout plan. Use via-in-pad or dog-bone fanout on the outer ball rows, and reserve internal layers for the buck converter power paths. Follow the TI land-pattern recommendation exactly; the ZWSR and ZGUR ordering variants may use different ball maps, so confirm the mechanical drawing matches your PCB before assembly.

Combined power-conversion plus class-D audio operation concentrates heat in the 12x12 mm BGA. Estimate dissipation from converter efficiency and audio output power per the TI data manual, and provide solid ground planes to spread heat. For sustained speaker output, validate junction temperature at worst-case ambient using the package thermal parameters in the TI data manual.

Información de cumplimiento

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Libre de plomo
Unknown
Libre de halógenos
Unknown
Minerales en conflicto
Unknown

[DATA_NEEDED: RoHS/REACH/lead-free status from TI product page or DigiKey listing]

Datos verificados el: 2026-08-29 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

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Componentes & términos relacionados

Texas Instruments TPS65951 TPS65951A1ZWSR TPS65950A1ZWSR TPS659039-Q1 TPS65951A1ZGUR PMIC power management IC audio codec class-D amplifier OMAP NFBGA 169-ball BGA MicroStar BGA Li-ion battery Li-ion polymer cobalt-nickel-manganese DC-DC buck converter LDO regulator I2C handset industrial temperature grade
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