TPS65951A1ZWSR - OMAP PMIC + Audio Codec 169-NFBGA | Texas Instruments
料号： TPS65951A1ZWSR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $8.95 | $8.95 |
| 10 | $8.19 | $81.90 |
| 100 | $7.35 | $735.00 |
| 500 | $6.6 | $3,300.00 |
| 1,000 | $5.95 | $5,950.00 |
TPS65951A1ZWSR 概述
A power management IC (PMIC) is a specialized class of power management integrated circuits that combines multiple voltage regulators, sequencing logic, and supervisory functions on a single die, reducing board area and BOM count in battery-powered systems. Within this hierarchy, the TPS65951 sits at the system-power level, sitting above individual DC-DC converters and LDO regulators and integrating the entire handheld power tree.
According to the TI data manual, the TPS65951 contains several buck converters and low-dropout regulators to generate the multiple rails required by application processors, plus USB transceiver and charger interface functionality typical of the TPS659xx handset family. A distinctive feature is its complete audio subsystem: an entire audio module with audio codecs, digital filters, input preamplifiers and amplifiers, and class-D output amplifiers, allowing a single chip to manage both power and audio signal chains.
Typical applications include OMAP-based smartphone and tablet power management, handheld/mobile device power sequencing, and communication control in cellular handsets. The industrial temperature grade (per distributor data) supports embedded and portable instrumentation designs beyond handsets.
When designing with the TPS65951A1ZWSR, follow the TI reference schematics for OMAP power sequencing, as rail ordering is controlled by the device's internal state machine. Verify software I2C configuration against the TI application code, and confirm battery charger parameters match the chosen Li-ion cell chemistry. Pricing and availability should be verified as of 2026-08-29.
直接替换替代料： TPS65951A1ZWSR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： TPS65951A1ZWSR （相同外形与封装尺寸） ——差异在于 Audio Subsystem, Function, Package, Operating Temperature, Target Processor.
快速对比工具——选择替代料号进行并排对比：
TPS65950A1ZWSR
✅ 直接替换📋 参考替代料（不在目录中）
TPS65951A1ZGUR
✅ 直接替换✓ 有现货
$5.94 / 个
查看数据手册 →TPS65951A1ZWSR 最大额定值与电气特性
| 功能 | Integrated Power Management / Audio Codec PMIC |
| Target Processor | TI OMAP application processors |
| Battery Chemistry | Li-ion / Li-ion polymer / cobalt-nickel-manganese |
| Audio Subsystem | Audio codecs, digital filters, preamplifiers, class-D output amplifiers |
| 封装 | 169-NFBGA (LFBGA), 12x12 mm square |
| 安装类型 | Surface Mount |
| Number of Terminals | 169 |
| Temperature Grade | Industrial |
| 生命周期状态 | Active per TI product page |
TPS65951A1ZWSR 169-nfbga (lfbga), 12x12 mm square 引脚配置指南
TPS65951A1ZWSR（169-nfbga (lfbga), 12x12 mm square 封装）的引脚配置。 该功率器件具有栅极、漏极和源极端子。对于无极性封装，请参阅制造商数据手册以了解确切的引脚 1 方向和封装尺寸细节。常见应用包括电源设计、电机驱动和负载开关。
暂无详细引脚数据： TPS65951A1ZWSR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
TPS65951A1ZWSR 适用于 6 应用s: OMAP Smartphone Power Management, Mobile Audio Signal Chain, Li-ion Battery Charging Management, Embedded ARM/Linux Board Power, Portable Medical and Instrumentation Devices, Communication Control and Modem Power.
OMAP Smartphone Power Management
The TPS65951A1ZWSR is purpose-built for handset power trees around TI OMAP application processors. Its internal state machine sequences the multiple buck converter and LDO rails in the order OMAP devices require, while its charger interface manages a Li-ion or Li-ion polymer cell. Integration of power and audio into one 169-ball 12x12 mm package reduces board area versus a discrete regulator-plus-codec solution. Use the TI reference design for the specific OMAP variant, as rail ordering and default voltages are set by the PMIC firmware and I2C host configuration.
推荐
Mobile Audio Signal Chain
The integrated audio module of the TPS65951 combines audio codecs, digital filters, input preamplifiers, and class-D output amplifiers, so handset speaker and headset paths are powered and processed by the same chip that manages the power tree. The class-D outputs drive speakers directly without external amplifier stages, reducing component count and quiescent power. Place the device close to the speaker connectors and follow TI layout guidance for class-D filtering to keep EMI within handset regulatory limits.
推荐
Li-ion Battery Charging Management
Designed for handsets powered by Li-ion, Li-ion polymer, or cobalt-nickel-manganese cells, the TPS65951 manages charge control and battery supervision as part of its power-management function. The charger interface works with the host processor over the control bus to set charge parameters for the chosen cell chemistry. For designs requiring higher charge currents or USB-PD input, pair the PMIC with a dedicated charger IC and use the TPS65951 for rail generation and audio only.
推荐
Embedded ARM/Linux Board Power
Although optimized for OMAP handsets, the TPS65951A1ZWSR fits embedded ARM boards needing a multi-rail, processor-managed power solution with an industrial temperature grade (per distributor data). Its several buck converters and LDOs supply core, I/O, and memory rails while the host configures voltages over the control interface. The 169-ball BGA requires careful PCB stack-up; plan via-in-pad fanout and follow TI's 12x12 mm BGA land-pattern recommendation for reliable assembly.
推荐
Portable Medical and Instrumentation Devices
Battery-powered portable instruments benefit from the TPS65951's single-chip integration of power sequencing, battery management, and audio capture/playback. The industrial temperature grade supports operation in clinical environments, and the codec plus class-D amplifiers implement alarms and voice prompts without extra analog circuitry. Because the device is application-optimized for OMAP processors, verify that its default rail voltages and charger profile match the instrument battery and MCU requirements during design review.
推荐
Communication Control and Modem Power
The TPS65951 can connect to a modem in addition to or instead of the application processor, managing communication-control power sequencing in cellular designs. Its rail architecture supplies RF and baseband loads typical of handsets, and its audio path supports voice codec functionality. Ensure the I2C host firmware programs modem-specific rail voltages and sequencing, and confirm RF load-transient behavior with the buck converter ratings given in the TI data manual before layout freeze.
推荐
推荐产品汇总
工程参考数据： TPS65951A1ZWSR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | TPS65950A1ZWSR | TPS65951A1ZGUR | TPS659039-Q1 |
|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Target Processor | TI OMAP processors | TI OMAP processors | TI OMAP processors (same silicon) | TI newer-generation processors |
| Integrated Audio Codec | Yes (with class-D outputs) | Yes (audio block differs) | Yes (identical silicon) | No (power only) |
| Lifecycle Status | Active | Active (verify) | Active (verify) | Active |
关键差异点
- Integrated audio module with class-D output amplifiers （对比 TPS65950A1ZWSR)
- Single-chip power plus audio for OMAP handsets （对比 TPS659039-Q1)
- Co-Ni-Mn battery chemistry support （对比 TPS65950A1ZWSR)
设计说明
The TPS65951 is an application-specific PMIC: its power-up ordering state machine is optimized for TI OMAP processors. Do not assume generic PMIC behavior - configure rail voltages and sequencing through the host control interface per the TI data manual and reference software. Migrating from TPS65950 to TPS65951 requires audio-routing review because the audio block differs (class-D outputs added).
The 169-ball 12x12 mm NFBGA package needs a careful fanout plan. Use via-in-pad or dog-bone fanout on the outer ball rows, and reserve internal layers for the buck converter power paths. Follow the TI land-pattern recommendation exactly; the ZWSR and ZGUR ordering variants may use different ball maps, so confirm the mechanical drawing matches your PCB before assembly.
Combined power-conversion plus class-D audio operation concentrates heat in the 12x12 mm BGA. Estimate dissipation from converter efficiency and audio output power per the TI data manual, and provide solid ground planes to spread heat. For sustained speaker output, validate junction temperature at worst-case ambient using the package thermal parameters in the TI data manual.
合规信息
[DATA_NEEDED: RoHS/REACH/lead-free status from TI product page or DigiKey listing]
