TPS65951A1ZWSR - OMAP PMIC + Audio Codec 169-NFBGA | Texas Instruments
部品番号: TPS65951A1ZWSR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $8.95 | $8.95 |
| 10 | $8.19 | $81.90 |
| 100 | $7.35 | $735.00 |
| 500 | $6.6 | $3,300.00 |
| 1,000 | $5.95 | $5,950.00 |
TPS65951A1ZWSR 概要
A power management IC (PMIC) is a specialized class of power management integrated circuits that combines multiple voltage regulators, sequencing logic, and supervisory functions on a single die, reducing board area and BOM count in battery-powered systems. Within this hierarchy, the TPS65951 sits at the system-power level, sitting above individual DC-DC converters and LDO regulators and integrating the entire handheld power tree.
According to the TI data manual, the TPS65951 contains several buck converters and low-dropout regulators to generate the multiple rails required by application processors, plus USB transceiver and charger interface functionality typical of the TPS659xx handset family. A distinctive feature is its complete audio subsystem: an entire audio module with audio codecs, digital filters, input preamplifiers and amplifiers, and class-D output amplifiers, allowing a single chip to manage both power and audio signal chains.
Typical applications include OMAP-based smartphone and tablet power management, handheld/mobile device power sequencing, and communication control in cellular handsets. The industrial temperature grade (per distributor data) supports embedded and portable instrumentation designs beyond handsets.
When designing with the TPS65951A1ZWSR, follow the TI reference schematics for OMAP power sequencing, as rail ordering is controlled by the device's internal state machine. Verify software I2C configuration against the TI application code, and confirm battery charger parameters match the chosen Li-ion cell chemistry. Pricing and availability should be verified as of 2026-08-29.
ドロップイン代替品: TPS65951A1ZWSR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: TPS65951A1ZWSR （同一形状・フットプリント） — 相違点: Audio Subsystem, Function, Package, Operating Temperature, Target Processor.
クイック比較ツール — 並列比較する代替部品を選択:
TPS65950A1ZWSR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
TPS65951A1ZGUR
✅ ドロップイン✓ 在庫あり
$5.94 / 個
データシートを見る →TPS65951A1ZWSR 最大定格＆電気的特性
| 機能 | Integrated Power Management / Audio Codec PMIC |
| Target Processor | TI OMAP application processors |
| Battery Chemistry | Li-ion / Li-ion polymer / cobalt-nickel-manganese |
| Audio Subsystem | Audio codecs, digital filters, preamplifiers, class-D output amplifiers |
| パッケージ | 169-NFBGA (LFBGA), 12x12 mm square |
| 実装タイプ | Surface Mount |
| Number of Terminals | 169 |
| Temperature Grade | Industrial |
| ライフサイクル状態 | Active per TI product page |
TPS65951A1ZWSR 169-nfbga (lfbga), 12x12 mm square ピン配置ガイド
TPS65951A1ZWSR (169-nfbga (lfbga), 12x12 mm square パッケージ) のピン配置。 このパワーデバイスは、ゲート、ドレイン、ソース端子を備えています。非極性パッケージの場合、正確なピン1の向きとフットプリントの詳細については、メーカーのデータシートを参照してください。主な用途には、電源設計、モータ駆動、負荷スイッチングがあります。
詳細なピン配置データはありません: TPS65951A1ZWSR.
詳細は データシート をご参照ください。
主な用途
TPS65951A1ZWSR の用途: 6 件s: OMAP Smartphone Power Management, Mobile Audio Signal Chain, Li-ion Battery Charging Management, Embedded ARM/Linux Board Power, Portable Medical and Instrumentation Devices, Communication Control and Modem Power.
OMAP Smartphone Power Management
The TPS65951A1ZWSR is purpose-built for handset power trees around TI OMAP application processors. Its internal state machine sequences the multiple buck converter and LDO rails in the order OMAP devices require, while its charger interface manages a Li-ion or Li-ion polymer cell. Integration of power and audio into one 169-ball 12x12 mm package reduces board area versus a discrete regulator-plus-codec solution. Use the TI reference design for the specific OMAP variant, as rail ordering and default voltages are set by the PMIC firmware and I2C host configuration.
おすすめ
Mobile Audio Signal Chain
The integrated audio module of the TPS65951 combines audio codecs, digital filters, input preamplifiers, and class-D output amplifiers, so handset speaker and headset paths are powered and processed by the same chip that manages the power tree. The class-D outputs drive speakers directly without external amplifier stages, reducing component count and quiescent power. Place the device close to the speaker connectors and follow TI layout guidance for class-D filtering to keep EMI within handset regulatory limits.
おすすめ
Li-ion Battery Charging Management
Designed for handsets powered by Li-ion, Li-ion polymer, or cobalt-nickel-manganese cells, the TPS65951 manages charge control and battery supervision as part of its power-management function. The charger interface works with the host processor over the control bus to set charge parameters for the chosen cell chemistry. For designs requiring higher charge currents or USB-PD input, pair the PMIC with a dedicated charger IC and use the TPS65951 for rail generation and audio only.
おすすめ
Embedded ARM/Linux Board Power
Although optimized for OMAP handsets, the TPS65951A1ZWSR fits embedded ARM boards needing a multi-rail, processor-managed power solution with an industrial temperature grade (per distributor data). Its several buck converters and LDOs supply core, I/O, and memory rails while the host configures voltages over the control interface. The 169-ball BGA requires careful PCB stack-up; plan via-in-pad fanout and follow TI's 12x12 mm BGA land-pattern recommendation for reliable assembly.
おすすめ
Portable Medical and Instrumentation Devices
Battery-powered portable instruments benefit from the TPS65951's single-chip integration of power sequencing, battery management, and audio capture/playback. The industrial temperature grade supports operation in clinical environments, and the codec plus class-D amplifiers implement alarms and voice prompts without extra analog circuitry. Because the device is application-optimized for OMAP processors, verify that its default rail voltages and charger profile match the instrument battery and MCU requirements during design review.
おすすめ
Communication Control and Modem Power
The TPS65951 can connect to a modem in addition to or instead of the application processor, managing communication-control power sequencing in cellular designs. Its rail architecture supplies RF and baseband loads typical of handsets, and its audio path supports voice codec functionality. Ensure the I2C host firmware programs modem-specific rail voltages and sequencing, and confirm RF load-transient behavior with the buck converter ratings given in the TI data manual before layout freeze.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: TPS65951A1ZWSR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | TPS65950A1ZWSR | TPS65951A1ZGUR | TPS659039-Q1 |
|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Target Processor | TI OMAP processors | TI OMAP processors | TI OMAP processors (same silicon) | TI newer-generation processors |
| Integrated Audio Codec | Yes (with class-D outputs) | Yes (audio block differs) | Yes (identical silicon) | No (power only) |
| Lifecycle Status | Active | Active (verify) | Active (verify) | Active |
主な差別化要因
- Integrated audio module with class-D output amplifiers （vs TPS65950A1ZWSR)
- Single-chip power plus audio for OMAP handsets （vs TPS659039-Q1)
- Co-Ni-Mn battery chemistry support （vs TPS65950A1ZWSR)
設計ノート
The TPS65951 is an application-specific PMIC: its power-up ordering state machine is optimized for TI OMAP processors. Do not assume generic PMIC behavior - configure rail voltages and sequencing through the host control interface per the TI data manual and reference software. Migrating from TPS65950 to TPS65951 requires audio-routing review because the audio block differs (class-D outputs added).
The 169-ball 12x12 mm NFBGA package needs a careful fanout plan. Use via-in-pad or dog-bone fanout on the outer ball rows, and reserve internal layers for the buck converter power paths. Follow the TI land-pattern recommendation exactly; the ZWSR and ZGUR ordering variants may use different ball maps, so confirm the mechanical drawing matches your PCB before assembly.
Combined power-conversion plus class-D audio operation concentrates heat in the 12x12 mm BGA. Estimate dissipation from converter efficiency and audio output power per the TI data manual, and provide solid ground planes to spread heat. For sustained speaker output, validate junction temperature at worst-case ambient using the package thermal parameters in the TI data manual.
コンプライアンス情報
[DATA_NEEDED: RoHS/REACH/lead-free status from TI product page or DigiKey listing]
