TPS65951A1ZWSR - OMAP PMIC + Audio Codec 169-NFBGA | Texas Instruments
MPN: TPS65951A1ZWSR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.95 | $8.95 |
| 10 | $8.19 | $81.90 |
| 100 | $7.35 | $735.00 |
| 500 | $6.6 | $3,300.00 |
| 1,000 | $5.95 | $5,950.00 |
Drop-in alternatives for TPS65951A1ZWSR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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TPS65950A1ZWSR
✅ Drop-In📋 Reference alternative (not in catalog)
TPS65951A1ZGUR
✅ Drop-In✓ In Stock
$5.94 / Unit
View Datasheet →TPS65951A1ZWSR Maximum Ratings & Electrical Characteristics
| Function | Integrated Power Management / Audio Codec PMIC |
| Target Processor | TI OMAP application processors |
| Battery Chemistry | Li-ion / Li-ion polymer / cobalt-nickel-manganese |
| Buck Converters | Several (per TI data manual) [DATA_NEEDED: exact count and current ratings] |
| LDO Regulators | Multiple (per TI data manual) [DATA_NEEDED: exact count] |
| Audio Subsystem | Audio codecs, digital filters, preamplifiers, class-D output amplifiers |
| Package | 169-NFBGA (LFBGA), 12x12 mm square |
| Mounting Type | Surface Mount |
| Number of Terminals | 169 |
| Temperature Grade | Industrial |
| Operating Temperature | [DATA_NEEDED: exact range in C] |
| Supply Voltage | [DATA_NEEDED: input battery voltage range in V] |
| Interface | I2C-compatible control [DATA_NEEDED: confirm] |
| MSL Level | [DATA_NEEDED: MSL rating] |
| RoHS Status | [DATA_NEEDED: confirm from distributor] |
| Lifecycle Status | Active per TI product page |
TPS65951A1ZWSR 169-nfbga (lfbga), 12x12 mm square Pin Configuration Guide
Complete pinout information for TPS65951A1ZWSR (169-nfbga (lfbga), 12x12 mm square package). This power device features gate, drain, and source terminals. For non-polarized packages, refer to the manufacturer datasheet for exact pin 1 orientation and footprint details. Common applications include power supply design, motor driving, and load switching.
No detailed pinout data available for TPS65951A1ZWSR.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this component. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
TPS65951A1ZWSR is suitable for 6 applications: OMAP Smartphone Power Management, Mobile Audio Signal Chain, Li-ion Battery Charging Management, Embedded ARM/Linux Board Power, Portable Medical and Instrumentation Devices, Communication Control and Modem Power.
OMAP Smartphone Power Management
The TPS65951A1ZWSR is purpose-built for handset power trees around TI OMAP application processors. Its internal state machine sequences the multiple buck converter and LDO rails in the order OMAP devices require, while its charger interface manages a Li-ion or Li-ion polymer cell. Integration of power and audio into one 169-ball 12x12 mm package reduces board area versus a discrete regulator-plus-codec solution. Use the TI reference design for the specific OMAP variant, as rail ordering and default voltages are set by the PMIC firmware and I2C host configuration.
Recommended
Mobile Audio Signal Chain
The integrated audio module of the TPS65951 combines audio codecs, digital filters, input preamplifiers, and class-D output amplifiers, so handset speaker and headset paths are powered and processed by the same chip that manages the power tree. The class-D outputs drive speakers directly without external amplifier stages, reducing component count and quiescent power. Place the device close to the speaker connectors and follow TI layout guidance for class-D filtering to keep EMI within handset regulatory limits.
Recommended
Li-ion Battery Charging Management
Designed for handsets powered by Li-ion, Li-ion polymer, or cobalt-nickel-manganese cells, the TPS65951 manages charge control and battery supervision as part of its power-management function. The charger interface works with the host processor over the control bus to set charge parameters for the chosen cell chemistry. For designs requiring higher charge currents or USB-PD input, pair the PMIC with a dedicated charger IC and use the TPS65951 for rail generation and audio only.
Recommended
Embedded ARM/Linux Board Power
Although optimized for OMAP handsets, the TPS65951A1ZWSR fits embedded ARM boards needing a multi-rail, processor-managed power solution with an industrial temperature grade (per distributor data). Its several buck converters and LDOs supply core, I/O, and memory rails while the host configures voltages over the control interface. The 169-ball BGA requires careful PCB stack-up; plan via-in-pad fanout and follow TI's 12x12 mm BGA land-pattern recommendation for reliable assembly.
Recommended
Portable Medical and Instrumentation Devices
Battery-powered portable instruments benefit from the TPS65951's single-chip integration of power sequencing, battery management, and audio capture/playback. The industrial temperature grade supports operation in clinical environments, and the codec plus class-D amplifiers implement alarms and voice prompts without extra analog circuitry. Because the device is application-optimized for OMAP processors, verify that its default rail voltages and charger profile match the instrument battery and MCU requirements during design review.
Recommended
Communication Control and Modem Power
The TPS65951 can connect to a modem in addition to or instead of the application processor, managing communication-control power sequencing in cellular designs. Its rail architecture supplies RF and baseband loads typical of handsets, and its audio path supports voice codec functionality. Ensure the I2C host firmware programs modem-specific rail voltages and sequencing, and confirm RF load-transient behavior with the buck converter ratings given in the TI data manual before layout freeze.
Recommended
Recommended Products Summary
Engineering reference data for TPS65951A1ZWSR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TPS65950A1ZWSR | TPS65951A1ZGUR | TPS659039-Q1 |
|---|---|---|---|---|
| Package | 169-NFBGA (12x12 mm) | 169-NFBGA (12x12 mm) - same | 169-NFBGA variant - verify ball-map | [DATA_NEEDED] |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Target Processor | TI OMAP processors | TI OMAP processors | TI OMAP processors (same silicon) | TI newer-generation processors |
| Integrated Audio Codec | Yes (with class-D outputs) | Yes (audio block differs) | Yes (identical silicon) | No (power only) |
| Battery Chemistry Support | Li-ion / Li-polymer / Co-Ni-Mn | Li-ion / Li-polymer | Li-ion / Li-polymer / Co-Ni-Mn | [DATA_NEEDED] |
| Temperature Grade | Industrial | [DATA_NEEDED] | Industrial | Automotive (AEC-Q100) |
| Number of Terminals | 169 | 169 | 169 | [DATA_NEEDED] |
| Lifecycle Status | Active | Active (verify) | Active (verify) | Active |
Key Differentiators
- Integrated audio module with class-D output amplifiers (vs TPS65950A1ZWSR)
- Single-chip power plus audio for OMAP handsets (vs TPS659039-Q1)
- Co-Ni-Mn battery chemistry support (vs TPS65950A1ZWSR)
Design Notes
The TPS65951 is an application-specific PMIC: its power-up ordering state machine is optimized for TI OMAP processors. Do not assume generic PMIC behavior - configure rail voltages and sequencing through the host control interface per the TI data manual and reference software. Migrating from TPS65950 to TPS65951 requires audio-routing review because the audio block differs (class-D outputs added).
The 169-ball 12x12 mm NFBGA package needs a careful fanout plan. Use via-in-pad or dog-bone fanout on the outer ball rows, and reserve internal layers for the buck converter power paths. Follow the TI land-pattern recommendation exactly; the ZWSR and ZGUR ordering variants may use different ball maps, so confirm the mechanical drawing matches your PCB before assembly.
Combined power-conversion plus class-D audio operation concentrates heat in the 12x12 mm BGA. Estimate dissipation from converter efficiency and audio output power per the TI data manual, and provide solid ground planes to spread heat. For sustained speaker output, validate junction temperature at worst-case ambient using the package thermal parameters in the TI data manual.
Compliance Information
[DATA_NEEDED: RoHS/REACH/lead-free status from TI product page or DigiKey listing]
