W972GG6KB-25 - 2Gb DDR2-800 SDRAM x16 84-WBGA | Winbond
N.º de pieza: W972GG6KB-25 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $8.45 | $8,45 |
| 10 | $7.62 | $76,20 |
| 100 | $6.18 | $618,00 |
| 500 | $5.42 | $2.710,00 |
| 1.000 | $4.87 | $4.870,00 |
W972GG6KB-25 Descripción general
DDR2 SDRAM (Double Data Rate 2 Synchronous DRAM) is a synchronous volatile memory class that transfers data on both clock edges and uses a 1.8 V supply to halve the power of first-generation DDR. In the wider system hierarchy it sits between DDR1 and DDR3, in the taxonomy: SDRAM -> DDR SDRAM -> DDR2 SDRAM -> DRAM -> volatile memory IC. Its JEDEC-defined features (posted CAS, OCD calibration, off-chip driver strength adjustment) make it a workhorse for embedded networking, imaging, and consumer designs that need >400 MT/s bandwidth without migrating to DDR3 footprints.
Key features include four internal banks, programmable CAS Latency (3, 4, 5, 6), programmable burst length (4 or 8 with sequential or interleave modes), differential clock inputs (CK, /CK), and a 2-bit refresh control (1x or 4x). The 84-WBGA ballout follows JEDEC standard for x16 DDR2 and is pin-compatible with industry-standard 2-Gbit DDR2 SDRAMs, simplifying second-source qualification. Industrial temperature option (-25I) is available down to -40 C.
Typical applications include 720p/1080p video buffering in IP cameras and DVRs, frame buffers in industrial HMI panels, networking line cards requiring 800 MT/s bandwidth, and digital photo frames or set-top box main memory. The combination of x16 width and 1.8 V operation matches legacy DDR2 host controllers without level shifting.
When designing with the W972GG6KB-25, follow JEDEC DDR2 PCB layout rules: matched-length CK//CK traces within 5 mils, 50 ohm controlled impedance, VTT termination at 0.9 V via 4.7 uF decoupling, and VREF generation at 0.9 V with 1% tolerance. Decoupling requires 0.1 uF plus 4.7 uF per pin group.
This page synthesizes Winbond datasheet parameters, distributor pricing, drop-in equivalents, and PCB layout considerations not consolidated on a single OEM page.
Alternativas directas para W972GG6KB-25 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
W972GG6KB-25I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
W972GG6KB-25/TRAY
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
W972GG6JB-25
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MT47H128M16RT-25
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
IS43DR16640B-25DBLI
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
W972GG6KB-25 Valores máximos y características eléctricas
| Tipo de memoria | Volatile, DRAM, SDRAM - DDR2 |
| Density | 2 Gbit (128M x 16) |
| Organización de memoria | 128M words x 16 bits x 4 banks |
| Clock Frequency (max) | 400 MHz |
| Velocidad de datos | DDR2-800 (800 MT/s) |
| Access Time (tRAC) | 57.5 ns |
| Clock Cycle Time (tCK) | 2.5 ns |
| Tensión de alimentación | 1.8 V (typical, 1.7 V to 1.9 V) |
| Interfaz | SSTL_18 |
| Latencia CAS | Programmable 3 / 4 / 5 / 6 |
| Burst Length | 4 or 8 (sequential or interleave) |
| Number of Banks | 4 internal banks |
| On-Die Termination (ODT) | Supported (dynamic ODT supported) |
| Encapsulado | 84-WBGA (8x12.5 mm) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | 0 C to +85 C (-25 commercial); -40 C to +95 C (-25I industrial) |
| Estado RoHS | Compliant (Halogen-Free per Winbond product page) |
Guía de configuración de pines de W972GG6KB-25 84-wbga (8x12.5 mm)
Configuración de pines para W972GG6KB-25 (encapsulado 84-wbga (8x12.5 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para W972GG6KB-25.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
W972GG6KB-25 es adecuado para 6 aplicacións: IP Camera / DVR Frame Buffer, Industrial HMI Panel Memory, Set-Top Box Main Memory, Networking Line Card Memory, Digital Photo Frame / Kiosk Display, Point-of-Sale Terminal Memory.
IP Camera / DVR Frame Buffer
The W972GG6KB-25 supplies a 2-Gbit frame buffer for 720p and 1080p IP cameras and DVRs. With DDR2-800 (800 MT/s) data rate and 16-bit bus width, the device delivers 1.6 GB/s of bandwidth, sufficient to support 1080p60 RGB888 capture without dropping frames. Its 128Mx16 organization maps directly onto SoC DDR2 controllers from HiSilicon, Ambarella, and Hisilicon-class video SoCs. The 1.8 V VDDQ matches mainstream video SoC rails, eliminating level shifters. PCB layout follows JEDEC DDR2 reference: matched-length CK//CK traces within 5 mils, 50 ohm single-ended impedance, VTT termination at 0.9 V via dedicated LDO. Industrial -25I variant supports outdoor IP cameras down to -40 C.
Recomendado
Industrial HMI Panel Memory
The W972GG6KB-25 provides main memory for industrial HMI panels driving WVGA to 720p LCDs. The 2-Gbit density stores double-buffered frame data plus font tables and runtime application memory. DDR2-800 bandwidth (800 MT/s on x16) supports 60 Hz refresh rates on 7-inch WVGA panels without tearing. The 1.8 V operation reduces panel power consumption versus DDR3 designs, important for sealed IP65 enclosures. Winbond specifies a 0 to +85 C commercial operating range, or -40 to +95 C for the -25I variant suitable for outdoor or factory-floor installations. The 84-WBGA's small 8x12.5 mm footprint fits within the tight routing constraints of panel controller PCBs.
Recomendado
Set-Top Box Main Memory
Set-top boxes (STBs) and over-the-top (OTT) streaming devices use the W972GG6KB-25 as main system memory for Linux-based middleware. The 2-Gbit (256 MB) density matches minimum RAM requirements for STB reference designs and supports a complete AndroidTV or RDK environment. DDR2-800 bandwidth handles 1080p60 H.264/H.265 decode bitstreams with adequate headroom for system-on-chip and application processing. The 84-WBGA's standard JEDEC x16 2-Gbit pinout simplifies second-sourcing between Winbond and Micron, both offering 84-ball WBGA parts that share electrical timing. STB thermal environments are well within the commercial 0 to +85 C operating range.
Recomendado
Networking Line Card Memory
Networking line cards and small home routers integrate the W972GG6KB-25 as packet buffer memory. The 2-Gbit density stores roughly 16 M packets at 64 B each, sufficient for small switches. DDR2-800 (800 MT/s) bandwidth delivers 1.6 GB/s aggregate, adequate for gigabit Ethernet forwarding at wire speed. The 1.8 V VDDQ operation aligns with networking ASIC rails from Broadcom and Qualcomm. The 84-WBGA's 8x12.5 mm outline fits within typical line-card front-panel slot spacing. Industrial -25I variant supports outdoor PoE switches and industrial Ethernet nodes operating down to -40 C.
Recomendado
Digital Photo Frame / Kiosk Display
The W972GG6KB-25 acts as frame-store memory in digital photo frames and interactive kiosks. With 2 Gbit of capacity, the device can hold 4-8 decoded JPEG/PNG images in RGB565 or RGB888 formats, allowing instant transitions and pan/zoom effects. DDR2-800 provides ample bandwidth to refresh 800x480 to 1024x600 LCD panels at 60 Hz without bus contention. The single 1.8 V supply reduces BOM cost versus DDR3 designs that need a 1.5 V rail. The compact 84-WBGA footprint suits slim kiosk enclosures with limited PCB area. Commercial 0 to +85 C range is appropriate for indoor kiosks and consumer photo frames.
Recomendado
Point-of-Sale Terminal Memory
Point-of-sale (POS) terminals and handheld barcode scanners use the W972GG6KB-25 as application memory for transaction processing. The 2-Gbit density runs embedded Linux stacks, SQLite databases for inventory, and TLS-secured payment libraries. DDR2-800 bandwidth (800 MT/s on x16) supports fast payment processing latency requirements under PCI PTS specification. Industrial -25I variant operating range -40 to +95 C is well-suited for POS terminals that may be deployed in semi-outdoor retail environments or warehouse aisles. Standard JEDEC 84-WBGA footprint enables second-sourcing through Micron and ISSI distribution channels for production continuity.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para W972GG6KB-25 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | W972GG6KB-25I | W972GG6JB-25 | MT47H128M16RT-25 | IS43DR16640B-25DBLI |
|---|---|---|---|---|---|
| Brand | Winbond | Winbond | Winbond | Micron Technology | ISSI |
| Package | 84-WBGA (8x12.5) | 84-WBGA (8x12.5) | 84-WBGA (8x12.5) | 84-WBGA (8x12.5) | 84-WBGA (8x12.5) |
| Density | 2 Gbit | 2 Gbit | 2 Gbit | 2 Gbit | 2 Gbit |
| Organization | 128M x 16 x 4 banks | 128M x 16 x 4 banks | 128M x 16 (different row-col) | 128M x 16 x 8 banks | 128M x 16 x 4 banks |
| Speed Grade | DDR2-800 (400 MHz) | DDR2-800 | DDR2-800 | DDR2-800 | DDR2-800 |
| Operating Temperature | 0 C to +85 C | -40 C to +95 C | 0 C to +85 C | 0 C to +85 C | -40 C to +95 C |
| Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| On-Die Termination | Yes (dynamic ODT) | Yes | Yes | Yes | Yes |
Diferenciadores clave
- Wider industrial temperature option on identical die (frente a W972GG6KB-25 (commercial))
- Dual-sourcing via JEDEC-standard 84-WBGA pinout (frente a Micron MT47H128M16RT-25)
- Lower cost versus ISSI equivalent at high volumes (frente a IS43DR16640B-25DBLI)
Notas de diseño
Follow JEDEC DDR2 PCB layout: matched-length CK and /CK traces within 5 mils (0.127 mm), 50 ohm single-ended controlled impedance (100 ohm differential for clock), VTT termination rail at VDDQ/2 (0.9 V). Place 0.1 uF plus 4.7 uF decoupling on VDD/VSS pairs as close to the 84-WBGA balls as possible. Maintain 8 mil spacing between data byte lanes. Route address/command in matched-length groups to minimize skew across the fly-by topology.
Provide a low-noise 1.8 V source with 3% tolerance for VDD and VDDQ. Use a dedicated DDR termination LDO for VTT capable of sourcing up to 1 A peak (depending on bus loading). Total supply current for the W972GG6KB-25 during burst reads can reach 200 mA; size the regulator and bulk capacitors accordingly. A 4.7 uF plus 0.1 uF capacitor pair should be placed within 5 mm of each VDD/VSS ball group.
Always issue the JEDEC-required sequence of mode register set (MRS) commands after power-up with clocks stable before performing any read/write. Do not violate the tRFC (refresh cycle) timing of 195 ns - missing refreshes can corrupt data. Ensure that VREF voltage tracks VDDQ/2 within 1% tolerance; use a dedicated reference buffer, not a resistor divider. Confirm that host controller DLL is locked before enabling the SDRAM clocks.
DDR2 relies on source-synchronous DQS strobing with on-die termination. Verify DQS-to-DQ trace length matching within 50 mils (1.27 mm) on each byte lane. If signal integrity issues arise (eye closure on oscilloscope), reduce ODT strength from the default 75 ohm to 150 ohm setting via mode register. Use VREF decoupling (0.1 uF plus 1 uF) within 100 mils of the SDRAM pin.
Información de cumplimiento
RoHS compliant and Halogen-Free per Winbond product page. Not AEC-Q100 qualified (industrial-grade only). For automotive DDR2, contact Winbond sales for AEC-Q100 qualified parts.
