10AX115N1F40I1SG - Arria 10 GX FPGA 1150K LE | Intel
MPN: 10AX115N1F40I1SG ✓ فعال10AX115N1F40I1SG نمای کلی
An FPGA (field-programmable gate array) is a reconfigurable logic IC that sits at the top of the programmable logic hierarchy. FPGAs integrate programmable logic blocks, configurable I/O, on-chip memory, DSP blocks, and high-speed transceivers. Within Intel's portfolio, the Arria 10 family is positioned between Cyclone (low-power / cost-optimized) and Stratix (highest performance), with Arria 10 GX adding integrated transceivers and hardening PCIe, memory controllers, and floating-point DSP for bandwidth-intensive applications.
Key features of the 10AX115N1F40I1SG include 1,150,000 logic elements, 68.86 Mbits of embedded SRAM, integrated transceivers supporting multi-gigabit serial links, hardened PCI Express Gen3 blocks, variable-precision DSP blocks, and up to 600 user I/Os. Core voltage is 0.9 V, with separate rails for I/O and transceiver supplies. The 1517-ball FC-FBGA package enables high-density routing and excellent thermal performance for industrial designs.
The device uses a TSMC 20 nm process with Intel's adaptive logic module (ALM) architecture, embedding hardened IP for memory controllers, PCIe Gen3 x8, and high-speed transceivers up to 14.1 Gbps. This hardware acceleration lowers logic utilization and dynamic power compared with soft implementations, while the GX variant specifically provides the transceiver-rich feature set.
Typical applications include wireless baseband processing, broadcast video and studio equipment, medical imaging acceleration, high-speed test and measurement, defense signal processing, and PCIe Gen3 adapter cards. Designers select the 10AX115N1F40I1SG when they need transceiver bandwidth, hardened PCIe, and ample logic density without stepping up to Stratix 10 cost.
When designing with this FPGA, ensure the PCB uses a minimum 1.0 mm pitch BGA footprint with microvia stack-up. Power sequencing must follow the Intel Arria 10 Power Management User Guide; POR holds the device in reset until all rails are stable. Decoupling per the reference design is mandatory to meet transceiver jitter specs.
This page synthesizes distributor pricing, drop-in alternative options, and practical design notes not found in the manufacturer datasheet alone, giving an engineer a fast procurement and selection reference for the Arria 10 GX 10AX115 family.
جایگزین‌های drop-in برای 10AX115N1F40I1SG — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای 10AX115N1F40I1SG (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Package, DSP Blocks, Speed Grade, PCIe Hard IP, Transceivers.
10AX115N1F40E1SG
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشدهبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AX115H2F34I2SG
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشدهبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AX115H2F34I2LG
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشدهبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AX115H2F34I1SG
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشدهبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AX115H1F34I1SG
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشدهبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AX115H2F34E2SG
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشدهبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AX115N1F40I1SG حداکثر مقادیر مجاز و مشخصات الکتریکی
| Family | Intel Arria 10 GX |
| Device | 10AX115 (10AX115N1F40I1SG) |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits (68.86 Mbit) |
| User I/O Count | 600 |
| Process Technology | TSMC 20 nm |
| Core Voltage | 0.9 V |
| Transceivers | Integrated multi-gigabit transceivers |
| Hardened PCIe | PCIe Gen3 x8 blocks |
| DSP Blocks | Variable-precision hardened DSP |
| بسته‌بندی | 1517-ball FC-FBGA (F40) |
| نوع نصب | Surface Mount (BGA) |
| دمای کاری | -40C to +100C (industrial, I suffix) |
| Speed Grade | 1 |
| وضعیت RoHS | Compliant |
| Lead-Free | Yes |
| وضعیت چرخه عمر | Active |
راهنمای پیکربندی پین 10AX115N1F40I1SG 1517-ball fc-fbga (f40)
پیکربندی پین برای 10AX115N1F40I1SG (پکیج 1517-ball fc-fbga (f40)). این IC دیجیتال شامل GPIO، رابط‌های ارتباطی (UART، SPI، I2C) و پین‌های تغذیه است. برای عملکردهای جایگزین پین و گزینه‌های پیکربندی به دیتاشیت سازنده مراجعه کنید. ضروری برای طراحی سیستم‌های نهفته و چیدمان PCB.
داده پین‌آوت تفصیلی موجود نیست برای 10AX115N1F40I1SG.
به دیتاشیت برای پیکربندی کامل پین‌ها.
کاربردهای معمول
10AX115N1F40I1SG مناسب است برای 7 کاربردs: Wireless Baseband Processing, Broadcast Video Processing, Medical Imaging Acceleration, High-Speed Test & Measurement, Defense Signal Processing, PCIe Gen3 Adapter Cards, Industrial Control & Automation.
Wireless Baseband Processing
The 10AX115N1F40I1SG fits wireless baseband cards thanks to its 1.15M logic elements for LTE/5G NR channelization and FEC, plus hardened multi-gigabit transceivers up to 14.1 Gbps that drive CPRI and JESD204B/C links to RFICs. The PCIe Gen3 x8 blocks enable direct attach to a baseband host processor without an external bridge. Placed on a typical 8-layer FR-4 with a 1.0 mm BGA footprint, the FPGA meets timing closure for 100 MHz baseband clocks with margin.
پیشنهادی
Broadcast Video Processing
For 4K/UHD broadcast video routers and frame synchronizers, the 10AX115N1F40I1SG delivers ample logic density to multiplex SDI, SMPTE 2022, and SMPTE 2110 streams in parallel. The 600 user I/O support up to 150 simultaneous SDI links via transceivers plus parallel GPIO, and 68.86 Mbit embedded memory buffers line/frame stores without external SRAM. Industrial temperature grade suits uncompressed-video truck installations.
پیشنهادی
Medical Imaging Acceleration
The 10AX115N1F40I1SG accelerates CT, MRI, and ultrasound beamforming pipelines using its variable-precision hardened DSP blocks, which deliver up to 1.5 TFLOPs of single-precision throughput at low power. PCIe Gen3 x8 connects to host CPUs at 8 GTPS, while transceivers up to 14.1 Gbps link to high-speed ADCs and DACs. Industrial temperature grade supports clinical and lab environments with stringent EMI compliance.
پیشنهادی
High-Speed Test & Measurement
The 10AX115N1F40I1SG is well suited to high-bandwidth oscilloscopes, logic analyzers, and protocol testers. Its 14.1 Gbps transceivers handle 25G/50G lane aggregation, the 68.86 Mbit embedded memory captures long records without external DRAM, and 600 user I/O fan out to multi-channel probe heads. The hardened PCIe block streams data to host PCs at line rate. Industrial temperature grade handles bench and rack environments.
پیشنهادی
Defense Signal Processing
For radar, SIGINT, and electronic-warfare subsystems, the 10AX115N1F40I1SG provides sufficient logic density for beamforming and FFT pipelines, hardened PCIe for sensor fusion with VPX or SOSA-aligned host cards, and multi-gigabit transceivers for ADC/DAC and optical fiber links. Industrial temperature grade suits ground-mobile and sheltered installations. Designers typically pair the FPGA with high-bandwidth external DDR4 memory for large capture windows.
پیشنهادی
PCIe Gen3 Adapter Cards
PCIe Gen3 x8 accelerator cards use the 10AX115N1F40I1SG as the central compute element. The hardened PCIe block delivers full 8 GTPS throughput with deterministic latency, freeing ALMs for application logic. The 600 user I/O provide flexible GPIO for mezzanine expansion (VITA 57.1 FMC), while transceivers drive high-speed SERDES to daughter cards. Industrial temperature supports server-room and edge deployments.
پیشنهادی
Industrial Control & Automation
The 10AX115N1F40I1SG fits programmable logic controllers and real-time industrial Ethernet gateways. The hardened PCIe block interfaces to industrial PCs, transceivers drive multi-gigabit EtherCAT, PROFINET, or TSN links, and 600 user I/O handle parallel encoder and digital-IO channels. Industrial -40C to +100C operation covers factory-floor deployments, while the 20 nm process keeps dynamic power low for fanless enclosures.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای 10AX115N1F40I1SG — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | 10AX115N1F40E1SG | 10AX115H2F34I2SG | 10AX115H2F34I2LG | 10AX115H2F34I1SG | 10AX115H1F34I1SG | 10AX115H2F34E2SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1517-ball FC-FBGA (F40) | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F34) | 1517-ball FC-FBGA (F34) | 1517-ball FC-FBGA (F34) | 1517-ball FC-FBGA (F34) | 1517-ball FC-FBGA (F34) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| Speed Grade | 1 | 1 | 2 | 2 | 1 | 1 | 2 |
| Temperature Grade | Industrial -40C to +100C | Extended -40C to +125C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Extended -40C to +125C |
| Process / Core Voltage | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V |
تفاوت‌های کلیدی
- Largest package and highest user I/O count in the Arria 10 GX 115K-LE family (در مقابل10AX115H2F34I2SG)
- Speed grade 1 yields lower dynamic power vs grade 2 same-die parts (در مقابل10AX115H2F34I2SG)
- Industrial temperature range for outdoor and factory deployments (در مقابل10AX115N1F40E1SG)
یادداشت‌های طراحی
Estimated: The 1517-ball FC-FBGA at 1.0 mm pitch requires an 8-layer PCB with 0.5 oz copper on outer layers and a 0.4 mm via pad stack. Microvias (laser-drilled) are mandatory for the breakout region; staggered or stacked microvia constructions are supported by most PCB vendors. Recommend a 1.6 mm finished board thickness to maintain planarity during reflow.
Estimated: The Arria 10 10AX115 at full transceiver and DSP utilization typically draws 15-25 W from a 0.9 V core rail. Designers must sequence VCC, VCCP, VCCERAM, VCCPT, and VCCHPG using the Intel Arria 10 Power Management User Guide reference design. A dual-phase PWM controller such as the LTC3614 or ISL9444 typically supplies the core. Power-up ramp times must stay within the 0.2 ms to 100 ms window to avoid POR latch-up.
Estimated: At 20 W dissipation on the 1517-ball FC-FBGA (theta_JA ~5 C/W with a 25x25 mm thermal copper pad and airflow of 200 LFM), the junction rises ~100C above ambient. A heatsink of 1 C/W or larger is recommended above 15 W, or a 30x30 mm copper coin on the top side of the BGA. The Speed Grade 1 device typically dissipates 8-12% less than Grade 2 at the same frequency.
Common pitfalls: (1) Do not connect JTAG TCK to a generic GPIO - it must be a 1.8 V tolerant Schmitt-triggered input per the Arria 10 Pin Connection Guidelines. (2) Leave unused transceiver channels powered down through Quartus Prime assignment, never floating. (3) PCIe reference clock must meet the 100 ppm accuracy spec or link training fails. (4) Configuration MSEL pins must match the selected configuration scheme (AS, PS, JTAG, FPP) at board power-up - changing this on a populated board requires a rework.
Multi-gigabit transceivers running at 14.1 Gbps require 100 ohm differential routing with 6 mil trace width and 4 mil spacing on the top microstrip layer above a continuous ground plane. Skew between P and N must be under 1 ps per inch; length tuning is mandatory. AC-coupling capacitors (0.1 uF 0402 X7R) are required on every transmit pair. Eye margins of 200 mV and 80 ps are typical post-equalization for a 14.1 Gbps link.
اطلاعات انطباق
RoHS and lead-free per Intel product page; halogen-free status not explicitly published. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC; for automotive, choose an automotive-qualified variant.
