5CEFA4F23C7N - Cyclone V E FPGA, 49K LE, 484-BGA | Intel
MPN: 5CEFA4F23C7N ✓ فعال5CEFA4F23C7N نمای کلی
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM (BRAM), DSP blocks, PLLs, and transceivers. Within the broader semiconductor taxonomy, an FPGA sits between an application-specific integrated circuit (ASIC) and a general-purpose microcontroller: it offers ASIC-class performance and parallelism while remaining software-configurable like a CPU. Cyclone V E is Intel's (formerly Altera's) lowest-power family, optimized for industrial, motor control, video processing, and embedded vision.
Key features of the 5CEFA4F23C7N include 49K logic elements, 3.46 Mbit embedded memory (approximately 303 Kbytes of block RAM plus distributed RAM), 224 18x18 multipliers, four general-purpose PLLs, and up to 224 user I/O pins (package-dependent). The device integrates a hard PCIe Gen2 controller (x1/x2/x4) and supports external memory interfaces (EMIF) for DDR3, DDR2, LPDDR2, and QDRII/+. Compared with the previous-generation Cyclone IV, Cyclone V E reduces core power by up to 40% and offers double the logic and memory density at lower cost per logic element.
Typical applications include industrial motor control and factory automation (driven by high DSP block count), video processing and surveillance infrastructure, automotive driver-assistance subsystems, low-cost ASIC prototyping, and PCI Express endpoint cards. The wide I/O support and integrated transceivers make the part well suited to camera-link and LVDS-based image sensor aggregation. Designers typically pair the FPGA with a TI MSP430 host MCU for housekeeping or a Lattice MachXO2 for I/O expansion.
When designing with the 5CEFA4F23C7N, ensure the PCB provides a minimum 8-layer stack-up with continuous GND planes beneath the BGA to maintain signal-integrity on LVDS pairs and DDR3 signals. The JTAG chain must include the proper TCK pull-down and TMS pull-up resistors per the BSDL file. Thermal management: at 1.1 V core and 49K LE utilization, a typical design draws 1.5-3 W; provide adequate top-side copper or a heat-spreader footprint for hot-spot mitigation.
This page synthesizes distributor pricing, drop-in Cyclone V family alternatives, and practical PCB/layout design notes not found in the manufacturer datasheet, giving engineers an actionable comparison resource.
جایگزین‌های drop-in برای 5CEFA4F23C7N — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای 5CEFA4F23C7N (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Family, Mounting Type, PCIe Hard IP, PLLs, Package.
5CEFA4F23C8N
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
5CEFA7F23C7N
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
5CEBA4F23C7N
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
5CEFA5F23C7N
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشدهبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←5CEFA2F23C7N
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشده📋 جایگزین مرجع (خارج از کاتالوگ)
5CEFA4F23C7N حداکثر مقادیر مجاز و مشخصات الکتریکی
| Series | Cyclone V E |
| Family | Cyclone V E FPGA |
| Logic Elements (LE) | 49,000 |
| Embedded Memory (bits) | 3,464,192 |
| DSP / 18x18 Multipliers | 224 |
| User I/O (max) | 224 |
| Core Voltage | 1.1 V |
| Process Technology | 28 nm TSMC low-power |
| Transceivers | Not applicable (Cyclone V E is non-transceiver family) |
| PLLs | 4 |
| PCIe Hard IP | PCIe Gen2 x1/x2/x4 endpoint |
| External Memory Interface | DDR3, DDR2, LPDDR2, QDRII/+ |
| بسته‌بندی | 484-FBGA (FBGA-484, F23) |
| دمای کاری | 0C to +85C (commercial, C7 suffix) |
| نوع نصب | Surface Mount |
| وضعیت RoHS | Compliant |
پیکربندی پین 5CEFA4F23C7N
| پین A1 | I/O Bank 3A — User I/O (Bank 3A) |
| پین A2 | I/O Bank 3A — User I/O (Bank 3A) |
| پین B1 | GND — Ground reference |
| پین B2 | I/O Bank 3B — User I/O (Bank 3B) |
| پین C1 | I/O Bank 3C — User I/O (Bank 3C) |
| پین D2 | VCCIO3 — I/O supply for Bank 3 |
| پین D3 | I/O Bank 4A — User I/O (Bank 4A) |
| پین D5 | I/O Bank 4B — User I/O (Bank 4B) |
| پین E4 | VCC — 1.1V core supply |
| پین E6 | I/O Bank 5A — User I/O (Bank 5A) |
| پین F5 | I/O Bank 5B — User I/O (Bank 5B) |
| پین G6 | I/O Bank 6A — User I/O (Bank 6A) |
| پین H7 | VCCIO6 — I/O supply for Bank 6 |
| پین H8 | I/O Bank 6B — User I/O (Bank 6B) |
| پین J10 | I/O Bank 7A — User I/O (Bank 7A) |
| پین K11 | I/O Bank 7B — User I/O (Bank 7B) |
| پین L12 | I/O Bank 8A — User I/O (Bank 8A) |
| پین M13 | VCCIO8 — I/O supply for Bank 8 |
| پین N14 | I/O Bank 8B — User I/O (Bank 8B) |
| پین P15 | TCK — JTAG test clock input |
| پین P16 | TMS — JTAG test mode select |
| پین P17 | TDI — JTAG test data in |
| پین R18 | TDO — JTAG test data out |
| پین T19 | nCONFIG — Configuration active-low reset |
| پین T20 | nSTATUS — Configuration status |
| پین U21 | CONFIG_DONE — Configuration complete |
| پین U22 | CLK0 — Dedicated clock input 0 |
| پین V21 | CLK1 — Dedicated clock input 1 |
| پین V22 | GND — Ground reference |
کاربردهای معمول
5CEFA4F23C7N مناسب است برای 6 کاربردs: Industrial Motor Control & Factory Automation, Video Surveillance & Image Aggregation, PCI Express Endpoint Card / Low-Cost ASIC Prototyping, Low-Cost ASIC Prototyping & Emulation, Automotive Driver-Assistance Subsystems (Pre-Production), Communications & Networking Infrastructure (Edge/Access).
Industrial Motor Control & Factory Automation
The 5CEFA4F23C7N is well-suited to industrial motor control and factory automation because its 224 dedicated 18x18 DSP blocks deliver the throughput required for field-oriented control (FOC) algorithms and multi-axis pulse-width modulation. The 49K logic elements provide headroom for custom communication stacks (EtherCAT, PROFINET) implemented in soft IP, while the hard PCIe Gen2 endpoint simplifies host integration on industrial PCs. The commercial 0C-to-85C temperature grade covers most factory-floor enclosures, and the 1.1 V core voltage keeps board-level power dissipation manageable when paired with TI MSP430 housekeeping. Typical designs consume 1.5-3 W at full utilization, allowing fanless operation with adequate copper pours.
پیشنهادی
Video Surveillance & Image Aggregation
For video surveillance and image aggregation, the 5CEFA4F23C7N's 224 LVDS-capable user I/Os and dedicated DDR3 memory controller deliver the bandwidth required to aggregate multiple camera-link or LVDS image sensors into a single processing pipeline. The 3.46 Mbit embedded block RAM serves as line buffers for HD-resolution streams, and 224 DSP blocks support real-time image preprocessing such as lens distortion correction, demosaicing, and noise reduction. Pairing the FPGA with a TI MSP430 host enables PTZ control while the FPGA handles pixel-rate processing. Industrial temperature options (5CEFA4F23C8N) are recommended for outdoor deployments.
پیشنهادی
PCI Express Endpoint Card / Low-Cost ASIC Prototyping
The integrated PCIe Gen2 hard IP controller (x1/x2/x4 endpoint) makes the 5CEFA4F23C7N an ideal drop-in FPGA for PCI Express endpoint cards, low-cost ASIC prototyping, and add-in data-acquisition boards. The 49K logic elements and 3.46 Mbit block RAM are sufficient to implement soft RISC-V cores, custom accelerators, or bus protocol bridges on a single device. Compared with discrete PCIe chipsets, this integrated approach reduces BOM cost and PCB footprint, while the BGA-484 package supports standard 8-layer stack-ups for signal-integrity compliance. The device is widely used in industrial frame grabbers and software-defined radio (SDR) front-end cards.
پیشنهادی
Low-Cost ASIC Prototyping & Emulation
Engineers use the 5CEFA4F23C7N as a low-cost ASIC prototyping vehicle because the Cyclone V E family shares a Quartus Prime design flow and BSDL/IBIS models with higher-density Cyclone V variants, allowing portable bitstream development across the family. The 49K LE capacity supports verification of mid-complexity ASIC RTL, while the integrated PCIe and DDR3 controllers validate SoC I/O behaviors before tape-out. Designers can partition logic across multiple 5CEFA4F23C7N devices for higher density, leveraging the same BGA-484 footprint across boards. Industrial temperature grades (5CEFA4F23C8N) extend prototyping into harsher validation environments.
پیشنهادی
Automotive Driver-Assistance Subsystems (Pre-Production)
Although the C7 commercial temperature grade limits deployment to cabin electronics, the 5CEFA4F23C7N architecture supports pre-production development of automotive driver-assistance subsystems such as surround-view camera aggregation and sensor-fusion prototypes. The 224 LVDS-capable I/Os accept multiple CSI-2 / LVDS camera streams, while the 224 DSP blocks perform real-time object detection preprocessing. For production automotive designs, the same-package 5CEFA4F23I7N industrial variant is recommended. The Quartus Prime automotive IP catalog provides CAN, LIN, and FlexRay soft cores for fast validation.
پیشنهادی
Communications & Networking Infrastructure (Edge/Access)
In communications and networking edge/access equipment, the 5CEFA4F23C7N is used to implement custom packet processors, protocol bridges, and timing-critical framer/parser functions. The four general-purpose PLLs generate multiple clock domains for SONET/SDH, Ethernet, or OTN derivatives, while the DDR3 controller supports deep packet buffering. The 49K LEs are well-matched to soft NPU offload or custom encryption accelerators. Compared with discrete ASSPs, this integrated approach enables rapid feature differentiation and field-upgradeable firmware.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای 5CEFA4F23C7N — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | 5CEFA4F23C8N | 5CEFA7F23C7N | 5CEBA4F23C7N | 5CEFA5F23C7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-484 (F23) | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same |
| Logic Elements | 49,000 | 49,000 | 75,000 | 49,000 | 77,000 |
| Embedded Memory (bits) | 3,464,192 | 3,464,192 | 6,160,640 | 3,464,192 | 4,456,960 |
| DSP / 18x18 Multipliers | 224 | 224 | 300 | 224 | 312 |
| Transceivers | None (Cyclone V E) | None | None | 6 (3.125 Gbps, GX) | None |
| PCIe Hard IP | Gen2 x1/x2/x4 | Gen2 x1/x2/x4 | Gen2 x1/x2/x4 | Gen2 x1/x2/x4 | Gen2 x1/x2/x4 |
| Temperature Grade | Commercial 0C to 85C | Industrial -40C to 85C | Commercial 0C to 85C | Commercial 0C to 85C | Commercial 0C to 85C |
تفاوت‌های کلیدی
- Highest logic density in the F23 BGA-484 commercial-temperature tier (در مقابل5CEFA2F23C7N)
- Adds 3.125 Gbps transceivers in the same BGA-484 footprint (در مقابل5CEBA4F23C7N)
- Integrated PCIe Gen2 hard IP controller saves ASSP cost (در مقابل5CEFA7F23C7N)
- Commercial temperature grade optimizes cost for non-industrial deployments (در مقابل5CEFA4F23C8N)
یادداشت‌های طراحی
Use a minimum 8-layer PCB stack-up with continuous GND planes directly beneath the F23 BGA-484 footprint. Recommended stack-up: top signal / GND / signal / power / GND / signal / GND / bottom signal. Assign dedicated power planes to VCC (1.1 V core) and VCCIOx banks; avoid splitting VCC planes across the BGA field. Route LVDS pairs with 100 ohm differential impedance and length-match within 150 mil.
Estimated: at full 49K LE utilization with DDR3 active, expect core current of approximately 2.5 A at 1.1 V (2.75 W core power). Add a 22 uF bulk + 0.1 uF bypass per BGA quadrant. Sequence VCCIO before VCC; the Intel Cyclone V E handbook recommends a 100 ms delay. Use TI TPS7A4701 for clean analog rails feeding PLL supplies. Verify with Quartus PowerPlay early estimates before PCB layout finalization.
DDR3 memory interfaces require 2.5 V VCCIO_DDR and 50 ohm single-ended impedance with length-matching to within 25 mil across byte lanes. Use IBIS simulation to validate SI before tape-out. Place VTT termination resistors within 500 mil of the DDR3 chip. Series-stay resistors on high-speed LVDS pairs (33 ohm) reduce ringing on long traces (>3 inches).
Estimated: typical power dissipation for the 5CEFA4F23C7N at 70% utilization with DDR3 active is 1.8-2.5 W. The F23 BGA-484 has theta_JA of approximately 15 C/W with 4 thermal balls connected to internal planes; ensure at least 16 thermal vias (0.3 mm drill, 0.5 mm pad) under the center thermal array. For sealed industrial enclosures, derate ambient by 10C or specify the 5CEFA4F23C8N industrial grade.
Common pitfalls include: (1) leaving JTAG TCK floating - it must have a 1 kohm pull-down to GND; (2) not connecting the CFG_DONE pull-up (10 kohm to VCCIO3.3) which can cause intermittent configuration failures; (3) mis-assigning MSEL pins which selects AS/PS/JTAG configuration mode - confirm via BSDL before board bring-up; (4) omitting the nCONFIG reset supervisor (TI LTC2956 or equivalent) which can lead to brown-out configuration corruption.
اطلاعات انطباق
RoHS compliant per Intel product page. Not AEC-Q100 qualified - the C7 commercial temperature grade does not target automotive AEC-Q100 qualification; for automotive applications choose the I7 industrial variant or AEC-Q100 qualified Cyclone V E automotive PNs.
