5CEFA4F23C7N - Cyclone V E FPGA, 49K LE, 484-BGA | Intel
부품 번호: 5CEFA4F23C7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $39.53 | $39.53 |
| 10 | $35.2 | $352.00 |
| 100 | $28.95 | $2,895.00 |
| 250 | $26.4 | $6,600.00 |
| 500 | $24.1 | $12,050.00 |
5CEFA4F23C7N 개요
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM (BRAM), DSP blocks, PLLs, and transceivers. Within the broader semiconductor taxonomy, an FPGA sits between an application-specific integrated circuit (ASIC) and a general-purpose microcontroller: it offers ASIC-class performance and parallelism while remaining software-configurable like a CPU. Cyclone V E is Intel's (formerly Altera's) lowest-power family, optimized for industrial, motor control, video processing, and embedded vision.
Key features of the 5CEFA4F23C7N include 49K logic elements, 3.46 Mbit embedded memory (approximately 303 Kbytes of block RAM plus distributed RAM), 224 18x18 multipliers, four general-purpose PLLs, and up to 224 user I/O pins (package-dependent). The device integrates a hard PCIe Gen2 controller (x1/x2/x4) and supports external memory interfaces (EMIF) for DDR3, DDR2, LPDDR2, and QDRII/+. Compared with the previous-generation Cyclone IV, Cyclone V E reduces core power by up to 40% and offers double the logic and memory density at lower cost per logic element.
Typical applications include industrial motor control and factory automation (driven by high DSP block count), video processing and surveillance infrastructure, automotive driver-assistance subsystems, low-cost ASIC prototyping, and PCI Express endpoint cards. The wide I/O support and integrated transceivers make the part well suited to camera-link and LVDS-based image sensor aggregation. Designers typically pair the FPGA with a TI MSP430 host MCU for housekeeping or a Lattice MachXO2 for I/O expansion.
When designing with the 5CEFA4F23C7N, ensure the PCB provides a minimum 8-layer stack-up with continuous GND planes beneath the BGA to maintain signal-integrity on LVDS pairs and DDR3 signals. The JTAG chain must include the proper TCK pull-down and TMS pull-up resistors per the BSDL file. Thermal management: at 1.1 V core and 49K LE utilization, a typical design draws 1.5-3 W; provide adequate top-side copper or a heat-spreader footprint for hot-spot mitigation.
This page synthesizes distributor pricing, drop-in Cyclone V family alternatives, and practical PCB/layout design notes not found in the manufacturer datasheet, giving engineers an actionable comparison resource.
드롭인 대체품: 5CEFA4F23C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CEFA4F23C7N (동일 폼 팩터 및 풋프린트) — 차이점: Family, Mounting Type, PCIe Hard IP, PLLs, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CEFA4F23C8N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CEFA7F23C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CEBA4F23C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CEFA5F23C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$108.75 / 개
데이터시트 보기 →5CEFA2F23C7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CEFA4F23C7N 최대 정격 & 전기적 특성
| Series | Cyclone V E |
| Family | Cyclone V E FPGA |
| Logic Elements (LE) | 49,000 |
| Embedded Memory (bits) | 3,464,192 |
| DSP / 18x18 Multipliers | 224 |
| User I/O (max) | 224 |
| Core Voltage | 1.1 V |
| Process Technology | 28 nm TSMC low-power |
| Transceivers | Not applicable (Cyclone V E is non-transceiver family) |
| PLLs | 4 |
| PCIe Hard IP | PCIe Gen2 x1/x2/x4 endpoint |
| External Memory Interface | DDR3, DDR2, LPDDR2, QDRII/+ |
| 패키지 | 484-FBGA (FBGA-484, F23) |
| 동작 온도 | 0C to +85C (commercial, C7 suffix) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
5CEFA4F23C7N 핀 구성
| 핀 A1 | I/O Bank 3A — User I/O (Bank 3A) |
| 핀 A2 | I/O Bank 3A — User I/O (Bank 3A) |
| 핀 B1 | GND — Ground reference |
| 핀 B2 | I/O Bank 3B — User I/O (Bank 3B) |
| 핀 C1 | I/O Bank 3C — User I/O (Bank 3C) |
| 핀 D2 | VCCIO3 — I/O supply for Bank 3 |
| 핀 D3 | I/O Bank 4A — User I/O (Bank 4A) |
| 핀 D5 | I/O Bank 4B — User I/O (Bank 4B) |
| 핀 E4 | VCC — 1.1V core supply |
| 핀 E6 | I/O Bank 5A — User I/O (Bank 5A) |
| 핀 F5 | I/O Bank 5B — User I/O (Bank 5B) |
| 핀 G6 | I/O Bank 6A — User I/O (Bank 6A) |
| 핀 H7 | VCCIO6 — I/O supply for Bank 6 |
| 핀 H8 | I/O Bank 6B — User I/O (Bank 6B) |
| 핀 J10 | I/O Bank 7A — User I/O (Bank 7A) |
| 핀 K11 | I/O Bank 7B — User I/O (Bank 7B) |
| 핀 L12 | I/O Bank 8A — User I/O (Bank 8A) |
| 핀 M13 | VCCIO8 — I/O supply for Bank 8 |
| 핀 N14 | I/O Bank 8B — User I/O (Bank 8B) |
| 핀 P15 | TCK — JTAG test clock input |
| 핀 P16 | TMS — JTAG test mode select |
| 핀 P17 | TDI — JTAG test data in |
| 핀 R18 | TDO — JTAG test data out |
| 핀 T19 | nCONFIG — Configuration active-low reset |
| 핀 T20 | nSTATUS — Configuration status |
| 핀 U21 | CONFIG_DONE — Configuration complete |
| 핀 U22 | CLK0 — Dedicated clock input 0 |
| 핀 V21 | CLK1 — Dedicated clock input 1 |
| 핀 V22 | GND — Ground reference |
일반적인 애플리케이션
5CEFA4F23C7N 적합 용도: 6 애플리케이션s: Industrial Motor Control & Factory Automation, Video Surveillance & Image Aggregation, PCI Express Endpoint Card / Low-Cost ASIC Prototyping, Low-Cost ASIC Prototyping & Emulation, Automotive Driver-Assistance Subsystems (Pre-Production), Communications & Networking Infrastructure (Edge/Access).
Industrial Motor Control & Factory Automation
The 5CEFA4F23C7N is well-suited to industrial motor control and factory automation because its 224 dedicated 18x18 DSP blocks deliver the throughput required for field-oriented control (FOC) algorithms and multi-axis pulse-width modulation. The 49K logic elements provide headroom for custom communication stacks (EtherCAT, PROFINET) implemented in soft IP, while the hard PCIe Gen2 endpoint simplifies host integration on industrial PCs. The commercial 0C-to-85C temperature grade covers most factory-floor enclosures, and the 1.1 V core voltage keeps board-level power dissipation manageable when paired with TI MSP430 housekeeping. Typical designs consume 1.5-3 W at full utilization, allowing fanless operation with adequate copper pours.
추천
Video Surveillance & Image Aggregation
For video surveillance and image aggregation, the 5CEFA4F23C7N's 224 LVDS-capable user I/Os and dedicated DDR3 memory controller deliver the bandwidth required to aggregate multiple camera-link or LVDS image sensors into a single processing pipeline. The 3.46 Mbit embedded block RAM serves as line buffers for HD-resolution streams, and 224 DSP blocks support real-time image preprocessing such as lens distortion correction, demosaicing, and noise reduction. Pairing the FPGA with a TI MSP430 host enables PTZ control while the FPGA handles pixel-rate processing. Industrial temperature options (5CEFA4F23C8N) are recommended for outdoor deployments.
추천
PCI Express Endpoint Card / Low-Cost ASIC Prototyping
The integrated PCIe Gen2 hard IP controller (x1/x2/x4 endpoint) makes the 5CEFA4F23C7N an ideal drop-in FPGA for PCI Express endpoint cards, low-cost ASIC prototyping, and add-in data-acquisition boards. The 49K logic elements and 3.46 Mbit block RAM are sufficient to implement soft RISC-V cores, custom accelerators, or bus protocol bridges on a single device. Compared with discrete PCIe chipsets, this integrated approach reduces BOM cost and PCB footprint, while the BGA-484 package supports standard 8-layer stack-ups for signal-integrity compliance. The device is widely used in industrial frame grabbers and software-defined radio (SDR) front-end cards.
추천
Low-Cost ASIC Prototyping & Emulation
Engineers use the 5CEFA4F23C7N as a low-cost ASIC prototyping vehicle because the Cyclone V E family shares a Quartus Prime design flow and BSDL/IBIS models with higher-density Cyclone V variants, allowing portable bitstream development across the family. The 49K LE capacity supports verification of mid-complexity ASIC RTL, while the integrated PCIe and DDR3 controllers validate SoC I/O behaviors before tape-out. Designers can partition logic across multiple 5CEFA4F23C7N devices for higher density, leveraging the same BGA-484 footprint across boards. Industrial temperature grades (5CEFA4F23C8N) extend prototyping into harsher validation environments.
추천
Automotive Driver-Assistance Subsystems (Pre-Production)
Although the C7 commercial temperature grade limits deployment to cabin electronics, the 5CEFA4F23C7N architecture supports pre-production development of automotive driver-assistance subsystems such as surround-view camera aggregation and sensor-fusion prototypes. The 224 LVDS-capable I/Os accept multiple CSI-2 / LVDS camera streams, while the 224 DSP blocks perform real-time object detection preprocessing. For production automotive designs, the same-package 5CEFA4F23I7N industrial variant is recommended. The Quartus Prime automotive IP catalog provides CAN, LIN, and FlexRay soft cores for fast validation.
추천
Communications & Networking Infrastructure (Edge/Access)
In communications and networking edge/access equipment, the 5CEFA4F23C7N is used to implement custom packet processors, protocol bridges, and timing-critical framer/parser functions. The four general-purpose PLLs generate multiple clock domains for SONET/SDH, Ethernet, or OTN derivatives, while the DDR3 controller supports deep packet buffering. The 49K LEs are well-matched to soft NPU offload or custom encryption accelerators. Compared with discrete ASSPs, this integrated approach enables rapid feature differentiation and field-upgradeable firmware.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CEFA4F23C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CEFA4F23C8N | 5CEFA7F23C7N | 5CEBA4F23C7N | 5CEFA5F23C7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-484 (F23) | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same |
| Logic Elements | 49,000 | 49,000 | 75,000 | 49,000 | 77,000 |
| Embedded Memory (bits) | 3,464,192 | 3,464,192 | 6,160,640 | 3,464,192 | 4,456,960 |
| DSP / 18x18 Multipliers | 224 | 224 | 300 | 224 | 312 |
| Transceivers | None (Cyclone V E) | None | None | 6 (3.125 Gbps, GX) | None |
| PCIe Hard IP | Gen2 x1/x2/x4 | Gen2 x1/x2/x4 | Gen2 x1/x2/x4 | Gen2 x1/x2/x4 | Gen2 x1/x2/x4 |
| Temperature Grade | Commercial 0C to 85C | Industrial -40C to 85C | Commercial 0C to 85C | Commercial 0C to 85C | Commercial 0C to 85C |
주요 차별점
- Highest logic density in the F23 BGA-484 commercial-temperature tier (vs 5CEFA2F23C7N)
- Adds 3.125 Gbps transceivers in the same BGA-484 footprint (vs 5CEBA4F23C7N)
- Integrated PCIe Gen2 hard IP controller saves ASSP cost (vs 5CEFA7F23C7N)
- Commercial temperature grade optimizes cost for non-industrial deployments (vs 5CEFA4F23C8N)
설계 노트
Use a minimum 8-layer PCB stack-up with continuous GND planes directly beneath the F23 BGA-484 footprint. Recommended stack-up: top signal / GND / signal / power / GND / signal / GND / bottom signal. Assign dedicated power planes to VCC (1.1 V core) and VCCIOx banks; avoid splitting VCC planes across the BGA field. Route LVDS pairs with 100 ohm differential impedance and length-match within 150 mil.
Estimated: at full 49K LE utilization with DDR3 active, expect core current of approximately 2.5 A at 1.1 V (2.75 W core power). Add a 22 uF bulk + 0.1 uF bypass per BGA quadrant. Sequence VCCIO before VCC; the Intel Cyclone V E handbook recommends a 100 ms delay. Use TI TPS7A4701 for clean analog rails feeding PLL supplies. Verify with Quartus PowerPlay early estimates before PCB layout finalization.
DDR3 memory interfaces require 2.5 V VCCIO_DDR and 50 ohm single-ended impedance with length-matching to within 25 mil across byte lanes. Use IBIS simulation to validate SI before tape-out. Place VTT termination resistors within 500 mil of the DDR3 chip. Series-stay resistors on high-speed LVDS pairs (33 ohm) reduce ringing on long traces (>3 inches).
Estimated: typical power dissipation for the 5CEFA4F23C7N at 70% utilization with DDR3 active is 1.8-2.5 W. The F23 BGA-484 has theta_JA of approximately 15 C/W with 4 thermal balls connected to internal planes; ensure at least 16 thermal vias (0.3 mm drill, 0.5 mm pad) under the center thermal array. For sealed industrial enclosures, derate ambient by 10C or specify the 5CEFA4F23C8N industrial grade.
Common pitfalls include: (1) leaving JTAG TCK floating - it must have a 1 kohm pull-down to GND; (2) not connecting the CFG_DONE pull-up (10 kohm to VCCIO3.3) which can cause intermittent configuration failures; (3) mis-assigning MSEL pins which selects AS/PS/JTAG configuration mode - confirm via BSDL before board bring-up; (4) omitting the nCONFIG reset supervisor (TI LTC2956 or equivalent) which can lead to brown-out configuration corruption.
규정 준수 정보
RoHS compliant per Intel product page. Not AEC-Q100 qualified - the C7 commercial temperature grade does not target automotive AEC-Q100 qualification; for automotive applications choose the I7 industrial variant or AEC-Q100 qualified Cyclone V E automotive PNs.
