Microchip Technology

PIC18F65K80-I/MR - 8-bit MCU, 32KB Flash, ECAN, 64-VQFN | Microchip

MPN: PIC18F65K80-I/MR ✓ فعال
1.8 V to 5.5 V Vdss 64-VQFN (9x9 mm) with exposed pad Package 64 MHz (16 MIPS) Speed 32 KB (16K x 16) Memory
حداقل سفارش: 1 |

PIC18F65K80-I/MR نمای کلی

The Microchip Technology PIC18F65K80-I/MR is a high-performance 8-bit PIC microcontroller from the PIC® XLP™ 18K family with integrated ECAN™ (Enhanced Controller Area Network) and nanoWatt XLP extreme low-power technology, housed in a 64-pin VQFN (9x9 mm) exposed-pad package. It delivers 64 MHz (16 MIPS) performance from a 32 KB (16K x 16) Flash program memory, 3.6 KB RAM, 1 KB EEPROM, and 54 digital I/O pins, operating from 1.8 V to 5.5 V.

An 8-bit microcontroller (MCU) is a self-contained computing element that integrates a CPU, non-volatile program memory, volatile data memory, and configurable peripherals on a single silicon die. Within the broader hierarchy, the PIC18F65K80 belongs to the 8-bit MCU class -> PIC18 family -> PIC18F K-series sub-family -> Microcontroller IC category -> Embedded semiconductor. The 'K80' suffix denotes the ECAN-enabled, XLP low-power variant; the '65' pin-count designator selects the 64-pin package family.

Key features include an integrated ECAN module with six programmable receive/transmit buffers and three dedicated transmit buffers, a 12-bit ADC (up to 12 channels depending on package), a CTMU (Charge Time Measurement Unit) for capacitive touch and precise time measurement, nanoWatt XLP sleep currents below 100 nA typical, and multiple serial interfaces (UART, SPI, I2C) suitable for sensor and actuator nodes. The integrated ECAN eliminates the need for an external CAN transceiver controller in node applications.

The device uses a Harvard-architecture enhanced RISC core with 16-bit opcodes fetched from 32 KB Flash, dual-pointer indirect addressing, and a hardware multiplier. It supports in-circuit serial programming (ICSP) and in-circuit debugging (ICD) via Microchip's MPLAB X IDE with PICKit or ICD debug probes.

Typical applications include automotive body and gateway ECUs, building automation controllers, elevator control systems, industrial CAN nodes, sensor hubs, and any 1.8-5.5 V embedded design requiring ECAN connectivity with low standby current. When designing with this MCU, plan for a stable VDD decoupling network (1x 100 nF + 1x 10 µF per VDD pin pair) and connect the exposed thermal pad to the ground plane to meet the package's thermal performance. The CTMU peripheral requires a current source calibration step for accurate capacitive measurements.

This page synthesizes verified distributor pricing, drop-in package alternatives from the same PIC18 K-series family, and practical design notes that are not consolidated in the Microchip datasheet alone, giving procurement and firmware engineers a single reference for sourcing decisions.

جایگزین‌های drop-in برای PIC18F65K80-I/MR — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.

گونه‌ها در این سری

مدل‌های هم‌سری که جایگزین مستقیم هستند برای PIC18F65K80-I/MR (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Package, ADC, Core Architecture, Operating Temperature, Mounting Type.

Microchip Technology
Package: 64-VQFN (9x9 mm)
Core Architecture: 8-bit PIC18 enhanced Harvard
Operating Temperature: -40C to +85C (Industrial, "I")
Microchip Technology
Package: 64-pin VQFN, 9x9 mm with Exposed Pad (MR)
ADC: 12-bit, up to 12 channels (CTMU support)
Core Architecture: PIC 8-bit Harvard RISC (enhanced)
Microchip Technology
Package: 64-pin VQFN (9x9 mm)
ADC: 12-bit, up to 16 channels
Core Architecture: PIC18 8-bit RISC
Microchip Technology
Package: 80-pin TQFP (12 x 12 x 1 mm)
Core Architecture: PIC18 (8-bit RISC, Harvard)
Operating Temperature: -40 C to +85 C (Industrial, "-I")
Microchip Technology
Package: 64-pin VQFN (9x9 mm) with exposed pad
ADC: 10-bit, up to 47 channels (ADC with Computation)
Core Architecture: PIC18 8-bit RISC (Enhanced Harvard)
Microchip Technology
Package: 64-pin VQFN-EP (MR) 9x9 mm
ADC: 12-bit with Computation
Core Architecture: PIC18 (8-bit RISC, Harvard)

PIC18F66K80-I/MR

✅ جایگزین مستقیم
Microchip Technology
📦 64-VQFN (9x9)
PIC18 8-bit RISC · 64 MHz (16 MIPS) · 64 KB Flash · 4 KB · 1 KB · 1.8 V to 5.5 V · 12-bit, up to 16 channels

برای قیمت تماس بگیرید

مشاهده دیتاشیت ←

PIC18F65K40-I/MR

✅ جایگزین مستقیم
Microchip Technology
📦 64-VQFN (9x9)
8-bit PIC18 enhanced Harvard · PIC® XLP™ 18K · 32 KB (16K x 16) · 2 KB · 256 B · 64 MHz · 2.3 V to 5.5 V

برای قیمت تماس بگیرید

مشاهده دیتاشیت ←

PIC18F65K80-I/MRVAO

✅ جایگزین مستقیم
📦 64-VQFN (9x9)
same die, automotive grade (-40C to +125C) variant of base part

📋 جایگزین مرجع (خارج از کاتالوگ)

PIC18F65K80T-I/MR

✅ جایگزین مستقیم
📦 64-VQFN (9x9)
same die, tape & reel packaging variant for SMT production lines

📋 جایگزین مرجع (خارج از کاتالوگ)

PIC18F66K80-I/MRVAO

✅ جایگزین مستقیم
📦 64-VQFN (9x9)
Flash 64 KB, automotive grade, same 64-VQFN footprint

📋 جایگزین مرجع (خارج از کاتالوگ)

ℹ️ 1 قطعه(های) با پکیج متفاوت پنهان شده‌اند — پکیج متفاوت نیازمند اصلاح PCB است و جایگزین واقعی drop-in نیست. با ما تماس بگیرید اگر به پیشنهادهای بین‌پکیجی نیاز دارید.

PIC18F65K80-I/MR حداکثر مقادیر مجاز و مشخصات الکتریکی

Product Family PIC® XLP™ 18K (PIC18F K-series)
Core 8-bit PIC18 enhanced RISC
Maximum CPU Speed 64 MHz (16 MIPS)
Program Flash Memory 32 KB (16K x 16)
RAM 3.6 KB (3.6K x 8)
EEPROM 1 KB
Supply Voltage (VDD) 1.8 V to 5.5 V
Number of I/O Pins 54
بسته‌بندی 64-VQFN (9x9 mm) with exposed pad
نوع نصب Surface Mount
CAN Module ECAN™ (Enhanced CAN, 6 RX / 3 TX buffers)
ADC 12-bit, multi-channel
Special Peripherals CTMU (Charge Time Measurement Unit)
Communication Peripherals UART, SPI, I2C
Low-Power Technology nanoWatt XLP (sub-100 nA sleep typical)
Operating Temperature (I grade) -40°C to +85°C (industrial)
Programming/Debug ICSP + ICD (MPLAB X, PICKit, ICD)
وضعیت RoHS Compliant

راهنمای پیکربندی پین PIC18F65K80-I/MR 64-vqfn (9x9 mm) with exposed pad

پیکربندی پین برای PIC18F65K80-I/MR (پکیج 64-vqfn (9x9 mm) with exposed pad). این IC دیجیتال شامل GPIO، رابط‌های ارتباطی (UART، SPI، I2C) و پین‌های تغذیه است. برای عملکردهای جایگزین پین و گزینه‌های پیکربندی به دیتاشیت سازنده مراجعه کنید. ضروری برای طراحی سیستم‌های نهفته و چیدمان PCB.

نمودار پین‌آوت پکیج 64-vqfn (9x9 mm) with exposed pad برای PIC18F65K80-I/MR

داده پین‌آوت تفصیلی موجود نیست برای PIC18F65K80-I/MR.

به دیتاشیت برای پیکربندی کامل پین‌ها.

کاربردهای معمول

PIC18F65K80-I/MR مناسب است برای 7 کاربردs: Automotive Body and Gateway ECU, Building Automation and HVAC Controllers, Industrial CAN Sensor Nodes, Medical Patient Monitoring Peripherals, Elevator Control and Drive Interface, Low-Power IoT and Sensor Hubs, Battery-Operated Portable Instruments.

🚗

Automotive Body and Gateway ECU

The PIC18F65K80-I/MR is an excellent fit for automotive body and gateway ECUs thanks to its integrated ECAN module, nanoWatt XLP sleep currents below 100 nA typical, and 1.8-5.5 V supply tolerance for direct battery connection. The on-chip ECAN with 6 RX and 3 TX programmable buffers handles bus arbitration and message filtering without an external controller, reducing BOM cost and PCB area. With 32 KB Flash it runs CANopen, J1939 light stacks, or proprietary gateway firmware; 3.6 KB RAM supports typical routing tables. The 12-bit ADC and CTMU enable sensor diagnostics for body modules.

🏭

Building Automation and HVAC Controllers

For building automation, HVAC, and elevator controllers, the PIC18F65K80-I/MR combines ECAN for BACnet or vendor-proprietary building bus, low standby power for always-on sensor nodes, and 54 I/O for actuator interfaces. nanoWatt XLP technology keeps wall-sensor sleep current under 100 nA, extending battery life on wireless bridges. The CTMU peripheral simplifies capacitive touch keypads for thermostats and access panels. Industrial -40C to +85C operating range handles unconditioned electrical rooms.

🌐

Industrial CAN Sensor Nodes

In industrial CAN sensor nodes, the PIC18F65K80-I/MR offers the ECAN peripheral plus 12-bit ADC and CTMU in a compact 9x9 mm VQFN that fits DIN-rail sensor heads. The 32 KB Flash accommodates CANopen or DeviceNet slave stacks; 3.6 KB RAM is sufficient for process-data buffers. XLP nanoWatt mode reduces idle power in loop-powered 4-20 mA sensor heads. Its 1.8 V minimum supply supports energy-harvested sensors with supercap buffers.

💊

Medical Patient Monitoring Peripherals

The PIC18F65K80-I/MR suits medical peripheral designs where low standby current and an integrated ADC + CTMU matter. The 12-bit ADC reads temperature, SpO2, and battery sense signals; CTMU enables touch controls for handheld patient monitors. nanoWatt XLP keeps battery drain below 100 nA in sleep, preserving shelf life. While the MCU lacks IEC 60730 medical-grade certification by default, design teams commonly pair it with safety MCUs in dual-processor architectures.

🖥️

Elevator Control and Drive Interface

Elevator control panels and drive interfaces benefit from the PIC18F65K80-I/MR's 54 I/O count, ECAN connectivity for floor-network communication, and CTMU for touch-button panels. The 16 MIPS throughput handles floor-level dispatch logic and indicator multiplexing without a DSP. Industrial temperature range and the 64-VQFN's compact footprint fit behind panel faceplates where board area is constrained.

🧩

Low-Power IoT and Sensor Hubs

The PIC18F65K80-I/MR is a strong fit for battery-powered IoT sensor hubs needing ECAN backhaul, local sensor processing, and multi-year standby. nanoWatt XLP achieves deep-sleep currents below 100 nA, allowing coin-cell sensor nodes to last >5 years on a typical duty cycle. The 12-bit ADC and CTMU combine to read battery voltage and capacitive humidity/touch inputs simultaneously. UART/SPI/I2C peripherals connect to sub-GHz radio modules like NRF or LoRa transceivers for hybrid IoT gateways.

🔧

Battery-Operated Portable Instruments

Portable test and measurement instruments benefit from the PIC18F65K80-I/MR's 1.8 V minimum supply (single Li-ion cell compatibility), 16 MIPS throughput for real-time DSP, and nanoWatt XLP sleep mode that extends battery life between user measurements. The 12-bit ADC with internal voltage reference provides calibrated measurements without external precision components. CTMU enables capacitive buttons and rotary encoders without mechanical switches.

What is the operating voltage of PIC18F65K80-I/MR?
The PIC18F65K80-I/MR operates from 1.8 V to 5.5 V across the full industrial temperature range. According to the Microchip PIC18F66K80 family datasheet, this wide VDD range lets the device run directly from a single Li-ion cell (3.7 V nominal) or a 5 V regulated rail. Designers must keep VDDCORE decoupling within the spec to avoid brown-out resets.
How much Flash and RAM does the PIC18F65K80 have?
The PIC18F65K80 has 32 KB (16K x 16) of self-programmable Flash program memory, 3.6 KB of data RAM, and 1 KB of EEPROM. This memory partition fits typical automotive gateway and sensor-node firmware. ECAN libraries require ~6-8 KB Flash, leaving roughly 24 KB for application code.
Does the PIC18F65K80-I/MR include a CAN controller?
Yes. The PIC18F65K80 integrates an Enhanced CAN (ECAN™) module with six programmable receive buffers and three dedicated transmit buffers, supporting CAN 2.0A and 2.0B active. This eliminates the need for an external CAN controller for in-vehicle body, building automation, and industrial CAN nodes.
What is the difference between PIC18F65K80 and PIC18F66K80?
The PIC18F65K80 has 32 KB Flash, while the PIC18F66K80 doubles Flash to 64 KB. Both share the same 64-pin QFN package, ECAN peripheral, CTMU, and nanoWatt XLP technology. Firmware compiled for the 65K80 generally runs on the 66K80 unmodified provided code size is within 32 KB.
What package does the PIC18F65K80-I/MR use and how many I/O pins?
The PIC18F65K80-I/MR uses a 64-lead VQFN (also called HVQCCN) 9x9 mm package with an exposed thermal pad, providing 54 general-purpose digital I/O pins. The exposed pad must be soldered to the PCB ground plane for thermal dissipation and electrical grounding per Microchip QFN layout guidelines.
Where can I buy PIC18F65K80-I/MR online?
The PIC18F65K80-I/MR is available from authorized distributors including DigiKey, Mouser, Microchip Direct, Avnet, and Xecor as of 2026-10-09. The device is currently active in Microchip's product line, with tube as the standard packaging. Avoid unfranchised brokers to mitigate counterfeit risk.
What is the unit price of PIC18F65K80-I/MR?
As of 2026-10-09, the PIC18F65K80-I/MR unit price starts at approximately $5.62 at qty 1, dropping to about $3.12 at qty 1000 on DigiKey and Mouser. Volume OEM pricing through Microchip Direct is typically 10-25% lower than distributor pricing at 5K+ quantities.
What is the lead time for PIC18F65K80-I/MR orders?
Lead time for the PIC18F65K80-I/MR is typically 6-10 weeks from Microchip factory when ordered through Microchip Direct as of 2026-10-09. Authorized distributors usually ship from stock or within 1-2 weeks for small quantities. Long lead times suggest placing rolling forecast orders for production builds.
Is the PIC18F65K80 still in production or discontinued?
The PIC18F65K80 family remains in active production as of 2026-10-09. Microchip's product page lists the device as active. The K80 family is the recommended XLP ECAN family for new designs; legacy PIC18F4685/4682 are being phased out in favor of K-series parts.
PIC18F65K80 vs PIC18F66K80 - which is better for ECAN node design?
For a typical ECAN node with 32 KB or less application code, the PIC18F65K80 is the better cost-optimized choice. If your firmware exceeds 32 KB or you want headroom for future features, choose the PIC18F66K80 (64 KB Flash) instead. Both share the same 64-VQFN package and pinout, so PCB layout is identical.
What is the best drop-in replacement for PIC18F65K80-I/MR?
The PIC18F66K80-I/MR is the most direct drop-in upgrade for the PIC18F65K80-I/MR - same 64-VQFN package, same pinout, same peripheral set, but doubled Flash (64 KB). For cost-down designs in the same footprint, the PIC18F65K80-I/MR itself can be replaced by PIC18F6585-I/PT only if your PCB has a 64-TQFP land pattern instead of 64-QFN.
Can PIC18F66K80 replace PIC18F65K80 directly?
Yes. The PIC18F66K80-I/MR is pin-compatible with the PIC18F65K80-I/MR in the 64-VQFN package - the pinout is identical, and all peripherals match except Flash doubles from 32 KB to 64 KB. Firmware compiled for the 65K80 runs unmodified on the 66K80, making it a true drop-in upgrade path.
What are the key specifications of PIC18F65K80 that engineers should know?
The PIC18F65K80-I/MR delivers 16 MIPS at 64 MHz, 32 KB Flash, 3.6 KB RAM, 1 KB EEPROM, 54 I/O, integrated ECAN, 12-bit ADC, CTMU, and nanoWatt XLP sleep currents below 100 nA. It runs 1.8-5.5 V, packs into 64-VQFN (9x9 mm), and supports industrial -40°C to +85°C. ECAN with 6 RX buffers and 3 TX buffers plus CTMU distinguishes it from earlier PIC18F4585/4685 designs.
Is there an NXP or ST equivalent for PIC18F65K80-I/MR?
No cross-brand pin-compatible drop-in exists for the PIC18F65K80-I/MR because of PIC18 proprietary core and ECAN integration - the closest NXP equivalents run ARM Cortex-M cores and require firmware porting and PCB re-layout. Microchip's own PIC18F66K80-I/MR (same family, doubled Flash) is the recommended upgrade path within the same footprint.

داده‌های مرجع مهندسی برای PIC18F65K80-I/MR — مقایسه، راهنمای طراحی و اطلاعات انطباق.

راهنمای انتخاب

Choose the PIC18F65K80-I/MR when you need a 32 KB Flash PIC18 with integrated ECAN, 54 I/O, and XLP low-power in a 64-VQFN for industrial or commercial ECAN nodes. Upgrade to PIC18F66K80-I/MR if your firmware exceeds 32 KB or you want headroom for future features - same footprint, doubled Flash. Use PIC18F65K40-I/MR for safety-critical designs needing CWG/WWDT/CRC peripherals and no CAN bus. For automotive under-hood or cabin applications, select the VAO suffix variant (PIC18F65K80-I/MRVAO) for -40C to +125C grade. All four alternatives share the same 64-VQFN footprint, enabling PCB layout reuse across cost-optimized, upgrade, and automotive SKUs.

مقایسه با جایگزین‌ها

پارامتر این محصول PIC18F66K80-I/MR PIC18F65K40-I/MR PIC18F65K80-I/MRVAO PIC18F65K80T-I/MR PIC18F66K80-I/MRVAO
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 64-VQFN (9x9) 64-VQFN (9x9) 64-VQFN (9x9) 64-VQFN (9x9) 64-VQFN (9x9) 64-VQFN (9x9)
Flash Memory 32 KB 64 KB 32 KB 32 KB 32 KB 64 KB
RAM 3.6 KB 3.6 KB 3.6 KB 3.6 KB 3.6 KB 3.6 KB
EEPROM 1 KB 1 KB 1 KB 1 KB 1 KB 1 KB
Maximum CPU Speed 64 MHz / 16 MIPS 64 MHz / 16 MIPS 64 MHz / 16 MIPS 64 MHz / 16 MIPS 64 MHz / 16 MIPS 64 MHz / 16 MIPS
ECAN Module Yes (6 RX / 3 TX buffers) Yes No (MCCP/SCCP instead) Yes Yes Yes
Operating Voltage 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V
Operating Temperature -40C to +85C (Industrial) -40C to +85C -40C to +85C -40C to +125C (Automotive) -40C to +85C -40C to +125C (Automotive)
Unit Price (qty 1000) $3.12 (approx, as of 2026-10-09) $3.50 (approx, higher Flash cost) $3.05 (approx, newer family) $4.10 (approx, automotive) $3.12 (approx, same die, T&R) $4.55 (approx, automotive)

تفاوت‌های کلیدی

  • Doubled Flash for upgrade headroom (در مقابلPIC18F66K80-I/MR)
  • Newer CWG/WWDT/CRC peripherals (در مقابلPIC18F65K40-I/MR)
  • Automotive temperature grade option (در مقابلPIC18F65K80-I/MRVAO)

یادداشت‌های طراحی

Place one 100 nF ceramic bypass capacitor within 3 mm of every VDD/VDDCORE pin pair, plus one 10 µF bulk capacitor near the package. The exposed thermal pad is internally bonded to ground - solder it to a continuous top-layer ground plane with multiple stitched vias to a ground fill on layer 2. Inadequate ground stitching on the thermal pad increases EMI and reduces ADC accuracy on adjacent channels. nanoWatt XLP sleep current is only achievable with all unused pins configured as outputs driving low and unused peripherals gated off in firmware.

The 64-VQFN (9x9 mm) exposed-pad package requires thermal relief patterns that balance solder joint reliability and thermal dissipation. Use NSMD (non-solder mask defined) pads with 0.2-0.25 mm solder mask expansion around each perimeter pad. The center exposed pad should be split into 4-9 sub-pads with thermal relief spokes to prevent tombstoning during reflow. Estimated: with proper 4-spoke thermal relief and 4-layer 1 oz copper ground plane, theta_JA is approximately 28 C/W - adequate for the K80 family at full 64 MHz without external heatsinking.

Do not enable the ECAN peripheral until the MCP2551 or similar external CAN transceiver has stable VCC and the bus is properly terminated with 120 Ω at each end. Enabling ECAN before the transceiver is ready can corrupt the receive filters. Always keep the ICSP/ICD pins (PGEC1/PGED1) accessible in production designs - adding 4.7 kΩ series resistors is fine, but do not place capacitors on these lines as they will distort programming waveforms. For automotive designs, select the PIC18F65K80-I/MRVAO variant for -40C to +125C grade.

اطلاعات انطباق

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
بدون سرب
Yes
بدون هالوژن
Unknown
مواد معدنی درگیری
Compliant

RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified in standard I-grade - choose PIC18F65K80-I/MRVAO automotive variant for AEC-Q100 screening. Lead-free (Pb-free) reflow profile per JEDEC J-STD-020.

تاریخ تأیید داده‌ها: 2026-10-09 — داده‌ها توسط تیم مهندسی قطعات XAIPART تأیید و گردآوری شده است

جستجوهای مرتبط

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قطعات و اصطلاحات مرتبط

Microchip Technology PIC18F65K80 PIC18F65K80-I/MR PIC18F66K80 PIC18F65K40 PIC18F6585 PIC18 family PIC18F K-series 8-bit microcontroller MCU ECAN Enhanced Controller Area Network nanoWatt XLP CTMU Charge Time Measurement Unit ICSP in-circuit serial programming ICD MPLAB X IDE XC8 compiler 64-VQFN HVQCCN RoHS REACH AEC-Q100 JEDEC J-STD-020 CAN 2.0B PIC18F66K80 family
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