PIC18F65K80-I/MR - 8-bit MCU, 32KB Flash, ECAN, 64-VQFN | Microchip
MPN: PIC18F65K80-I/MR ✓ Hoạt độngPIC18F65K80-I/MR Tóm tắt
An 8-bit microcontroller (MCU) is a self-contained computing element that integrates a CPU, non-volatile program memory, volatile data memory, and configurable peripherals on a single silicon die. Within the broader hierarchy, the PIC18F65K80 belongs to the 8-bit MCU class -> PIC18 family -> PIC18F K-series sub-family -> Microcontroller IC category -> Embedded semiconductor. The 'K80' suffix denotes the ECAN-enabled, XLP low-power variant; the '65' pin-count designator selects the 64-pin package family.
Key features include an integrated ECAN module with six programmable receive/transmit buffers and three dedicated transmit buffers, a 12-bit ADC (up to 12 channels depending on package), a CTMU (Charge Time Measurement Unit) for capacitive touch and precise time measurement, nanoWatt XLP sleep currents below 100 nA typical, and multiple serial interfaces (UART, SPI, I2C) suitable for sensor and actuator nodes. The integrated ECAN eliminates the need for an external CAN transceiver controller in node applications.
The device uses a Harvard-architecture enhanced RISC core with 16-bit opcodes fetched from 32 KB Flash, dual-pointer indirect addressing, and a hardware multiplier. It supports in-circuit serial programming (ICSP) and in-circuit debugging (ICD) via Microchip's MPLAB X IDE with PICKit or ICD debug probes.
Typical applications include automotive body and gateway ECUs, building automation controllers, elevator control systems, industrial CAN nodes, sensor hubs, and any 1.8-5.5 V embedded design requiring ECAN connectivity with low standby current. When designing with this MCU, plan for a stable VDD decoupling network (1x 100 nF + 1x 10 µF per VDD pin pair) and connect the exposed thermal pad to the ground plane to meet the package's thermal performance. The CTMU peripheral requires a current source calibration step for accurate capacitive measurements.
This page synthesizes verified distributor pricing, drop-in package alternatives from the same PIC18 K-series family, and practical design notes that are not consolidated in the Microchip datasheet alone, giving procurement and firmware engineers a single reference for sourcing decisions.
Bộ thay thế dễ dàng lắp đặt cho PIC18F65K80-I/MR — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với PIC18F65K80-I/MR (cùng hình factor và footprint) — khác nhau ở Package, ADC, Core Architecture, Operating Temperature, Mounting Type.
PIC18F66K80-I/MR
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →PIC18F65K40-I/MR
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →PIC18F65K80-I/MRVAO
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
PIC18F65K80T-I/MR
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
PIC18F66K80-I/MRVAO
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
PIC18F65K80-I/MR Tỷ lệ tối đa & tính chất điện
| Product Family | PIC® XLP™ 18K (PIC18F K-series) |
| Core | 8-bit PIC18 enhanced RISC |
| Maximum CPU Speed | 64 MHz (16 MIPS) |
| Program Flash Memory | 32 KB (16K x 16) |
| RAM | 3.6 KB (3.6K x 8) |
| EEPROM | 1 KB |
| Supply Voltage (VDD) | 1.8 V to 5.5 V |
| Number of I/O Pins | 54 |
| Hộp | 64-VQFN (9x9 mm) with exposed pad |
| Kiểu lắp đặt | Surface Mount |
| CAN Module | ECAN™ (Enhanced CAN, 6 RX / 3 TX buffers) |
| ADC | 12-bit, multi-channel |
| Special Peripherals | CTMU (Charge Time Measurement Unit) |
| Communication Peripherals | UART, SPI, I2C |
| Low-Power Technology | nanoWatt XLP (sub-100 nA sleep typical) |
| Operating Temperature (I grade) | -40°C to +85°C (industrial) |
| Programming/Debug | ICSP + ICD (MPLAB X, PICKit, ICD) |
| Trạng thái RoHS | Compliant |
Hướng dẫn cấu hình chân PIC18F65K80-I/MR 64-vqfn (9x9 mm) with exposed pad
Cấu hình chân cho PIC18F65K80-I/MR (64-vqfn (9x9 mm) with exposed pad gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho PIC18F65K80-I/MR.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
PIC18F65K80-I/MR phù hợp cho 7 Áp dụngs: Automotive Body and Gateway ECU, Building Automation and HVAC Controllers, Industrial CAN Sensor Nodes, Medical Patient Monitoring Peripherals, Elevator Control and Drive Interface, Low-Power IoT and Sensor Hubs, Battery-Operated Portable Instruments.
Automotive Body and Gateway ECU
The PIC18F65K80-I/MR is an excellent fit for automotive body and gateway ECUs thanks to its integrated ECAN module, nanoWatt XLP sleep currents below 100 nA typical, and 1.8-5.5 V supply tolerance for direct battery connection. The on-chip ECAN with 6 RX and 3 TX programmable buffers handles bus arbitration and message filtering without an external controller, reducing BOM cost and PCB area. With 32 KB Flash it runs CANopen, J1939 light stacks, or proprietary gateway firmware; 3.6 KB RAM supports typical routing tables. The 12-bit ADC and CTMU enable sensor diagnostics for body modules.
Được đề xuất
Building Automation and HVAC Controllers
For building automation, HVAC, and elevator controllers, the PIC18F65K80-I/MR combines ECAN for BACnet or vendor-proprietary building bus, low standby power for always-on sensor nodes, and 54 I/O for actuator interfaces. nanoWatt XLP technology keeps wall-sensor sleep current under 100 nA, extending battery life on wireless bridges. The CTMU peripheral simplifies capacitive touch keypads for thermostats and access panels. Industrial -40C to +85C operating range handles unconditioned electrical rooms.
Được đề xuất
Industrial CAN Sensor Nodes
In industrial CAN sensor nodes, the PIC18F65K80-I/MR offers the ECAN peripheral plus 12-bit ADC and CTMU in a compact 9x9 mm VQFN that fits DIN-rail sensor heads. The 32 KB Flash accommodates CANopen or DeviceNet slave stacks; 3.6 KB RAM is sufficient for process-data buffers. XLP nanoWatt mode reduces idle power in loop-powered 4-20 mA sensor heads. Its 1.8 V minimum supply supports energy-harvested sensors with supercap buffers.
Được đề xuất
Medical Patient Monitoring Peripherals
The PIC18F65K80-I/MR suits medical peripheral designs where low standby current and an integrated ADC + CTMU matter. The 12-bit ADC reads temperature, SpO2, and battery sense signals; CTMU enables touch controls for handheld patient monitors. nanoWatt XLP keeps battery drain below 100 nA in sleep, preserving shelf life. While the MCU lacks IEC 60730 medical-grade certification by default, design teams commonly pair it with safety MCUs in dual-processor architectures.
Được đề xuất
Elevator Control and Drive Interface
Elevator control panels and drive interfaces benefit from the PIC18F65K80-I/MR's 54 I/O count, ECAN connectivity for floor-network communication, and CTMU for touch-button panels. The 16 MIPS throughput handles floor-level dispatch logic and indicator multiplexing without a DSP. Industrial temperature range and the 64-VQFN's compact footprint fit behind panel faceplates where board area is constrained.
Được đề xuất
Low-Power IoT and Sensor Hubs
The PIC18F65K80-I/MR is a strong fit for battery-powered IoT sensor hubs needing ECAN backhaul, local sensor processing, and multi-year standby. nanoWatt XLP achieves deep-sleep currents below 100 nA, allowing coin-cell sensor nodes to last >5 years on a typical duty cycle. The 12-bit ADC and CTMU combine to read battery voltage and capacitive humidity/touch inputs simultaneously. UART/SPI/I2C peripherals connect to sub-GHz radio modules like NRF or LoRa transceivers for hybrid IoT gateways.
Được đề xuất
Battery-Operated Portable Instruments
Portable test and measurement instruments benefit from the PIC18F65K80-I/MR's 1.8 V minimum supply (single Li-ion cell compatibility), 16 MIPS throughput for real-time DSP, and nanoWatt XLP sleep mode that extends battery life between user measurements. The 12-bit ADC with internal voltage reference provides calibrated measurements without external precision components. CTMU enables capacitive buttons and rotary encoders without mechanical switches.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho PIC18F65K80-I/MR — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | PIC18F66K80-I/MR | PIC18F65K40-I/MR | PIC18F65K80-I/MRVAO | PIC18F65K80T-I/MR | PIC18F66K80-I/MRVAO |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) | 64-VQFN (9x9) | 64-VQFN (9x9) | 64-VQFN (9x9) | 64-VQFN (9x9) |
| Flash Memory | 32 KB | 64 KB | 32 KB | 32 KB | 32 KB | 64 KB |
| RAM | 3.6 KB | 3.6 KB | 3.6 KB | 3.6 KB | 3.6 KB | 3.6 KB |
| EEPROM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| Maximum CPU Speed | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS |
| ECAN Module | Yes (6 RX / 3 TX buffers) | Yes | No (MCCP/SCCP instead) | Yes | Yes | Yes |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +125C (Automotive) | -40C to +85C | -40C to +125C (Automotive) |
| Unit Price (qty 1000) | $3.12 (approx, as of 2026-10-09) | $3.50 (approx, higher Flash cost) | $3.05 (approx, newer family) | $4.10 (approx, automotive) | $3.12 (approx, same die, T&R) | $4.55 (approx, automotive) |
Bảo phân biệt quan trọng
- Doubled Flash for upgrade headroom (vsPIC18F66K80-I/MR)
- Newer CWG/WWDT/CRC peripherals (vsPIC18F65K40-I/MR)
- Automotive temperature grade option (vsPIC18F65K80-I/MRVAO)
Ghi chú thiết kế
Place one 100 nF ceramic bypass capacitor within 3 mm of every VDD/VDDCORE pin pair, plus one 10 µF bulk capacitor near the package. The exposed thermal pad is internally bonded to ground - solder it to a continuous top-layer ground plane with multiple stitched vias to a ground fill on layer 2. Inadequate ground stitching on the thermal pad increases EMI and reduces ADC accuracy on adjacent channels. nanoWatt XLP sleep current is only achievable with all unused pins configured as outputs driving low and unused peripherals gated off in firmware.
The 64-VQFN (9x9 mm) exposed-pad package requires thermal relief patterns that balance solder joint reliability and thermal dissipation. Use NSMD (non-solder mask defined) pads with 0.2-0.25 mm solder mask expansion around each perimeter pad. The center exposed pad should be split into 4-9 sub-pads with thermal relief spokes to prevent tombstoning during reflow. Estimated: with proper 4-spoke thermal relief and 4-layer 1 oz copper ground plane, theta_JA is approximately 28 C/W - adequate for the K80 family at full 64 MHz without external heatsinking.
Do not enable the ECAN peripheral until the MCP2551 or similar external CAN transceiver has stable VCC and the bus is properly terminated with 120 Ω at each end. Enabling ECAN before the transceiver is ready can corrupt the receive filters. Always keep the ICSP/ICD pins (PGEC1/PGED1) accessible in production designs - adding 4.7 kΩ series resistors is fine, but do not place capacitors on these lines as they will distort programming waveforms. For automotive designs, select the PIC18F65K80-I/MRVAO variant for -40C to +125C grade.
Thông tin tuân thủ
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified in standard I-grade - choose PIC18F65K80-I/MRVAO automotive variant for AEC-Q100 screening. Lead-free (Pb-free) reflow profile per JEDEC J-STD-020.
