TPSM82866C - 6A Step-Down Power Module I2C | Texas Instruments
MPN: TPSM82866C ✓ فعالTPSM82866C نمای کلی
A step-down power module is a complete DC-DC converter that integrates the controller, power FETs, inductor, and compensation into a single package. This integration simplifies design, reduces external component count, and minimizes PCB footprint compared to discrete buck regulator solutions. The TPSM82866C belongs to the TPSM8286xx family, which includes 4A (TPSM82864x) and 6A (TPSM82866x) variants, all pin-to-pin and BOM-to-BOM compatible, allowing easy scalability between current ratings.
Key features include a 200nH shielded inductor that enhances EMI performance, an I2C interface for dynamic voltage scaling and telemetry, and high efficiency across the load range. The module supports output voltage programming via I2C or external resistors, and includes soft-start, overcurrent protection, and thermal shutdown. The RCF MagPack package shields both the inductor and the IC, further improving EMI performance.
The TPSM82866C uses a synchronous buck topology with integrated MOSFETs, achieving high efficiency at light and full loads. The I2C interface allows real-time monitoring of output voltage, current, and temperature, enabling adaptive power management. The integrated, shielded inductor reduces EMI and simplifies layout.
Typical applications include FPGA, ASIC, and DSP power supplies, server and networking equipment, and industrial automation. The I2C interface is particularly useful in systems requiring dynamic voltage scaling or telemetry.
When designing with this module, ensure proper input and output capacitance for stability and transient response. Configure the I2C address and output voltage settings per system requirements, and provide adequate PCB copper area for heat dissipation.
جایگزین‌های drop-in برای TPSM82866C — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای TPSM82866C (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Input Voltage Range, Package, Protection Features, Topology, Family.
TPSM82864CA1PRCFR
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
TPSM82866CB2PRCFR
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
TPSM82866CB3PRCFR
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
TPSM82866AA1PRCFR
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشده📋 جایگزین مرجع (خارج از کاتالوگ)
TPSM82816SIER
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←TPSM82866C حداکثر مقادیر مجاز و مشخصات الکتریکی
| توپولوژی | Synchronous Step-Down (Buck) Module |
| محدوده ولتاژ ورودی | 2.4 V to 5.5 V |
| Output Current | 6 A |
| ولتاژ خروجی | Adjustable (variant dependent, e.g. 0.2 V to 0.838 V for A1 option) |
| Integrated Inductor | 200 nH shielded (MagPack) |
| رابط | I2C (dynamic voltage scaling and telemetry) |
| بسته‌بندی | MagPack QFN (RCF), 2.3 mm x 3 mm |
| Power Density | Approx. 1 A per 1 mm2 |
| Family | TPSM8286xx (4A/6A, pin-to-pin and BOM-to-BOM compatible) |
| Protection Features | Overcurrent protection, thermal shutdown, soft-start |
| Output Voltage Programming | I2C or external resistors |
| نوع نصب | Surface Mount |
| EMI Performance | Shielded inductor and shielded IC for improved EMI |
| Outputs | 1 |
| Switching Regulator Type | Non-Isolated PoL Module DC-DC Converter |
| وضعیت RoHS | Compliant |
پیکربندی پین TPSM82866C
| پین 1 | VIN — Input supply, 2.4V to 5.5V |
| پین 2 | GND — Ground |
| پین 3 | EN — Enable control |
| پین 4 | SCL — I2C clock |
| پین 5 | SDA — I2C data |
| پین 6 | VOSNS — Output voltage sense / feedback |
| پین 7 | VOUT — Regulated output, up to 6A |
| پین 8 | PGOOD — Power good indicator |
| پین EP | Thermal Pad / GND — Exposed pad for thermal and electrical ground connection |
کاربردهای معمول
TPSM82866C مناسب است برای 6 کاربردs: FPGA/ASIC Core Power, Server and Data Center PoL, Networking Equipment, Industrial Automation, Test and Measurement Instruments, Optical Modules and Small Form-Factor Systems.
FPGA/ASIC Core Power
The TPSM82866C fits FPGA and ASIC core rails because its 6A output covers typical core currents while the I2C interface enables dynamic voltage scaling for performance-power optimization. Placed close to the device with the integrated 200nH shielded inductor, it minimizes loop area and switching noise reaching sensitive load pins. Telemetry (voltage, current, temperature) lets a system controller verify rail health in real time, and the 2.3mm x 3mm footprint keeps dense multi-rail power trees compact.
پیشنهادی
Server and Data Center PoL
In server baseboard and NIC designs, board area near processors is scarce; the TPSM82866C integrates the inductor into its MagPack package to deliver nearly 1A per 1mm2 power density. Operating from 2.4V to 5.5V intermediate rails, it converts to sub-1V core or SOC rails at 6A. I2C telemetry supports rack-level health monitoring, while shielded construction reduces EMI in high-speed signal environments common to server platforms.
پیشنهادی
Networking Equipment
Routers and switches pack many ASICs and PHYs needing compact, efficient low-voltage rails. The TPSM82866C's 2.4V to 5.5V input accepts the 5V or 3.3V board rails, and its adjustable output (set by variant or I2C) matches diverse ASIC requirements. The integrated shielded inductor limits radiated emissions near sensitive receive paths, and BOM-to-BOM scalability with the 4A TPSM82864x lets one layout serve multiple rail currents.
پیشنهادی
Industrial Automation
Industrial controllers and drives require robust point-of-load conversion with monitoring. The TPSM82866C provides overcurrent protection, thermal shutdown, and soft-start for fault-tolerant operation, while I2C telemetry enables predictive maintenance by reporting rail current and temperature. Its surface-mount MagPack package withstands vibration better than through-hole inductors, and the shielded 200nH inductor keeps EMI within limits in electrically noisy factory environments.
پیشنهادی
Test and Measurement Instruments
Bench instruments and modular test cards need small, low-noise, programmable rails. The TPSM82866C's I2C-controlled output allows software-adjustable supply levels during calibration or characterization, useful when exciting devices under test at different voltages. High efficiency across the load range reduces internal heating in enclosed instruments, and telemetry logs rail conditions for diagnostics and compliance reporting.
پیشنهادی
Optical Modules and Small Form-Factor Systems
Optical transceiver modules and other small form-factor systems are severely space constrained, yet still require efficient sub-1V or 1V-class rails at multi-amp loads. The TPSM82866C's 2.3mm x 3mm MagPack footprint and integration of the inductor remove the tallest external component from the assembly, aiding low-profile designs. Its 2.4V to 5.5V input covers common module supply rails, and shielded construction limits EMI near high-speed serial links.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای TPSM82866C — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | TPSM82864CA1PRCFR | TPSM82866CB2PRCFR | TPSM82816 |
|---|---|---|---|---|
| Package | MagPack QFN (RCF) 2.3mm x 3mm | MagPack QFN (RCF) 2.3mm x 3mm - same | MagPack QFN (RCF) 2.3mm x 3mm - same | MagPack QFN - similar footprint |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Output Current | 6 A | 4 A | 6 A | 6 A |
| I2C Interface | Yes (DVS + telemetry) | Yes | Yes | No |
| Integrated Inductor | 200 nH shielded (MagPack) | 200 nH shielded (MagPack) | 200 nH shielded (MagPack) | Integrated, proprietary material |
| Pin/BOM Compatibility | TPSM8286xx family, pin-to-pin and BOM-to-BOM | Pin-to-pin and BOM-to-BOM compatible | Pin-to-pin compatible (same die family) | Not BOM-to-BOM; check layout |
تفاوت‌های کلیدی
- I2C dynamic voltage scaling and telemetry (در مقابلTPSM82866A)
- Higher output voltage option available (در مقابلTPSM82866CB2PRCFR)
- 6A in the same footprint as 4A (در مقابلTPSM82864CA1PRCFR)
یادداشت‌های طراحی
Place input capacitance (e.g., 22uF ceramic) as close to the VIN and GND pins as possible to minimize input ripple and EMI. Use a solid ground plane and connect the exposed thermal pad to multiple ground vias - this pad is both the thermal path and the power ground return for the 6A output. Follow the layout section of TI datasheet (tpsm82866c.pdf) for recommended land pattern and via stitching.
At high VIN-VOUT differentials and full 6A load, power loss concentrates in the small 2.3mm x 3mm package. Provide at least 1 square inch of copper pour connected to the exposed pad, and verify junction temperature stays within the datasheet limit for your airflow condition. Use I2C temperature telemetry to validate thermal margin during system-level testing.
The TPSM8286xx family has multiple VOUT option variants (e.g., CA1: 0.2-0.838V, CB2: 0.4-1.675V). Ordering the wrong VOUT option is a common error - verify the ordering code against your rail voltage before release. Also configure the I2C address to avoid bus conflicts, and do not omit the recommended output capacitance, which affects loop stability and transient response.
اطلاعات انطباق
RoHS compliance per TI product page and DigiKey listing. Other compliance details not stated in provided data.
