TPSM82866C - 6A Step-Down Power Module I2C | Texas Instruments
부품 번호: TPSM82866C ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.1 | $4.10 |
| 10 | $3.7 | $37.00 |
| 100 | $3.25 | $325.00 |
| 500 | $2.9 | $1,450.00 |
| 1,000 | $2.55 | $2,550.00 |
TPSM82866C 개요
A step-down power module is a complete DC-DC converter that integrates the controller, power FETs, inductor, and compensation into a single package. This integration simplifies design, reduces external component count, and minimizes PCB footprint compared to discrete buck regulator solutions. The TPSM82866C belongs to the TPSM8286xx family, which includes 4A (TPSM82864x) and 6A (TPSM82866x) variants, all pin-to-pin and BOM-to-BOM compatible, allowing easy scalability between current ratings.
Key features include a 200nH shielded inductor that enhances EMI performance, an I2C interface for dynamic voltage scaling and telemetry, and high efficiency across the load range. The module supports output voltage programming via I2C or external resistors, and includes soft-start, overcurrent protection, and thermal shutdown. The RCF MagPack package shields both the inductor and the IC, further improving EMI performance.
The TPSM82866C uses a synchronous buck topology with integrated MOSFETs, achieving high efficiency at light and full loads. The I2C interface allows real-time monitoring of output voltage, current, and temperature, enabling adaptive power management. The integrated, shielded inductor reduces EMI and simplifies layout.
Typical applications include FPGA, ASIC, and DSP power supplies, server and networking equipment, and industrial automation. The I2C interface is particularly useful in systems requiring dynamic voltage scaling or telemetry.
When designing with this module, ensure proper input and output capacitance for stability and transient response. Configure the I2C address and output voltage settings per system requirements, and provide adequate PCB copper area for heat dissipation.
드롭인 대체품: TPSM82866C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: TPSM82866C (동일 폼 팩터 및 풋프린트) — 차이점: Input Voltage Range, Package, Protection Features, Topology, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
TPSM82864CA1PRCFR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TPSM82866CB2PRCFR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TPSM82866CB3PRCFR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TPSM82866AA1PRCFR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
TPSM82816SIER
✅ 드롭인✓ 재고 있음
$2.85 / 개
데이터시트 보기 →TPSM82866C 최대 정격 & 전기적 특성
| 토폴로지 | Synchronous Step-Down (Buck) Module |
| 입력 전압 범위 | 2.4 V to 5.5 V |
| Output Current | 6 A |
| 출력 전압 | Adjustable (variant dependent, e.g. 0.2 V to 0.838 V for A1 option) |
| Integrated Inductor | 200 nH shielded (MagPack) |
| 인터페이스 | I2C (dynamic voltage scaling and telemetry) |
| 패키지 | MagPack QFN (RCF), 2.3 mm x 3 mm |
| Power Density | Approx. 1 A per 1 mm2 |
| Family | TPSM8286xx (4A/6A, pin-to-pin and BOM-to-BOM compatible) |
| Protection Features | Overcurrent protection, thermal shutdown, soft-start |
| Output Voltage Programming | I2C or external resistors |
| 실장 유형 | Surface Mount |
| EMI Performance | Shielded inductor and shielded IC for improved EMI |
| Outputs | 1 |
| Switching Regulator Type | Non-Isolated PoL Module DC-DC Converter |
| RoHS 상태 | Compliant |
TPSM82866C 핀 구성
| 핀 1 | VIN — Input supply, 2.4V to 5.5V |
| 핀 2 | GND — Ground |
| 핀 3 | EN — Enable control |
| 핀 4 | SCL — I2C clock |
| 핀 5 | SDA — I2C data |
| 핀 6 | VOSNS — Output voltage sense / feedback |
| 핀 7 | VOUT — Regulated output, up to 6A |
| 핀 8 | PGOOD — Power good indicator |
| 핀 EP | Thermal Pad / GND — Exposed pad for thermal and electrical ground connection |
일반적인 애플리케이션
TPSM82866C 적합 용도: 6 애플리케이션s: FPGA/ASIC Core Power, Server and Data Center PoL, Networking Equipment, Industrial Automation, Test and Measurement Instruments, Optical Modules and Small Form-Factor Systems.
FPGA/ASIC Core Power
The TPSM82866C fits FPGA and ASIC core rails because its 6A output covers typical core currents while the I2C interface enables dynamic voltage scaling for performance-power optimization. Placed close to the device with the integrated 200nH shielded inductor, it minimizes loop area and switching noise reaching sensitive load pins. Telemetry (voltage, current, temperature) lets a system controller verify rail health in real time, and the 2.3mm x 3mm footprint keeps dense multi-rail power trees compact.
추천
Server and Data Center PoL
In server baseboard and NIC designs, board area near processors is scarce; the TPSM82866C integrates the inductor into its MagPack package to deliver nearly 1A per 1mm2 power density. Operating from 2.4V to 5.5V intermediate rails, it converts to sub-1V core or SOC rails at 6A. I2C telemetry supports rack-level health monitoring, while shielded construction reduces EMI in high-speed signal environments common to server platforms.
추천
Networking Equipment
Routers and switches pack many ASICs and PHYs needing compact, efficient low-voltage rails. The TPSM82866C's 2.4V to 5.5V input accepts the 5V or 3.3V board rails, and its adjustable output (set by variant or I2C) matches diverse ASIC requirements. The integrated shielded inductor limits radiated emissions near sensitive receive paths, and BOM-to-BOM scalability with the 4A TPSM82864x lets one layout serve multiple rail currents.
추천
Industrial Automation
Industrial controllers and drives require robust point-of-load conversion with monitoring. The TPSM82866C provides overcurrent protection, thermal shutdown, and soft-start for fault-tolerant operation, while I2C telemetry enables predictive maintenance by reporting rail current and temperature. Its surface-mount MagPack package withstands vibration better than through-hole inductors, and the shielded 200nH inductor keeps EMI within limits in electrically noisy factory environments.
추천
Test and Measurement Instruments
Bench instruments and modular test cards need small, low-noise, programmable rails. The TPSM82866C's I2C-controlled output allows software-adjustable supply levels during calibration or characterization, useful when exciting devices under test at different voltages. High efficiency across the load range reduces internal heating in enclosed instruments, and telemetry logs rail conditions for diagnostics and compliance reporting.
추천
Optical Modules and Small Form-Factor Systems
Optical transceiver modules and other small form-factor systems are severely space constrained, yet still require efficient sub-1V or 1V-class rails at multi-amp loads. The TPSM82866C's 2.3mm x 3mm MagPack footprint and integration of the inductor remove the tallest external component from the assembly, aiding low-profile designs. Its 2.4V to 5.5V input covers common module supply rails, and shielded construction limits EMI near high-speed serial links.
추천
추천 제품 요약
엔지니어링 참조 데이터: TPSM82866C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | TPSM82864CA1PRCFR | TPSM82866CB2PRCFR | TPSM82816 |
|---|---|---|---|---|
| Package | MagPack QFN (RCF) 2.3mm x 3mm | MagPack QFN (RCF) 2.3mm x 3mm - same | MagPack QFN (RCF) 2.3mm x 3mm - same | MagPack QFN - similar footprint |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Output Current | 6 A | 4 A | 6 A | 6 A |
| I2C Interface | Yes (DVS + telemetry) | Yes | Yes | No |
| Integrated Inductor | 200 nH shielded (MagPack) | 200 nH shielded (MagPack) | 200 nH shielded (MagPack) | Integrated, proprietary material |
| Pin/BOM Compatibility | TPSM8286xx family, pin-to-pin and BOM-to-BOM | Pin-to-pin and BOM-to-BOM compatible | Pin-to-pin compatible (same die family) | Not BOM-to-BOM; check layout |
주요 차별점
- I2C dynamic voltage scaling and telemetry (vs TPSM82866A)
- Higher output voltage option available (vs TPSM82866CB2PRCFR)
- 6A in the same footprint as 4A (vs TPSM82864CA1PRCFR)
설계 노트
Place input capacitance (e.g., 22uF ceramic) as close to the VIN and GND pins as possible to minimize input ripple and EMI. Use a solid ground plane and connect the exposed thermal pad to multiple ground vias - this pad is both the thermal path and the power ground return for the 6A output. Follow the layout section of TI datasheet (tpsm82866c.pdf) for recommended land pattern and via stitching.
At high VIN-VOUT differentials and full 6A load, power loss concentrates in the small 2.3mm x 3mm package. Provide at least 1 square inch of copper pour connected to the exposed pad, and verify junction temperature stays within the datasheet limit for your airflow condition. Use I2C temperature telemetry to validate thermal margin during system-level testing.
The TPSM8286xx family has multiple VOUT option variants (e.g., CA1: 0.2-0.838V, CB2: 0.4-1.675V). Ordering the wrong VOUT option is a common error - verify the ordering code against your rail voltage before release. Also configure the I2C address to avoid bus conflicts, and do not omit the recommended output capacitance, which affects loop stability and transient response.
규정 준수 정보
RoHS compliance per TI product page and DigiKey listing. Other compliance details not stated in provided data.
