EP20K600CF672
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
Intel EP20K600CF672 is an APEX-20KC field-programmable gate array in a 672-ball BGA package, providing 508 user I/O lines according to the supplied distributor references. The target belongs to a programmable-logic hierarchy spanning FPGA, programmable logic device, CMOS IC, and integrated circuit. It is a surface-mount device built for configurable digital logic rather than fixed application-specific functionality. Its APEX 20KC architecture supports general-purpose logic, interface, control, and signal-processing implementations when paired with the appropriate configuration data and design toolchain.
A field-programmable gate array is a semiconductor device containing programmable logic resources that engineers can configure after manufacture. FPGAs occupy the broader taxonomy programmable logic device -> field-programmable gate array -> programmable logic -> digital integrated circuit -> semiconductor. Unlike a fixed ASIC, an FPGA can be reprogrammed during development, prototyping, or field updates. This flexibility reduces mask and fabrication risk and enables rapid design iteration, but usually results in higher unit cost, greater power use, and more demanding signal-integrity and power-distribution requirements.
The verified references identify 508 user I/O lines and a 672-ball BGA, FCBGA package. The search data also reports a 45 mm x 45 mm package, 1.27 mm pitch, and 488 user I/Os for speed-grade suffixes; the target-family product description reports 508 I/O lines. These values should not be conflated: suffix-level listings can reflect different catalog or package interpretations. The provided data does not establish the target's exact core voltage, logic-element count, embedded-memory capacity, configuration-interface details, operating-temperature grade, or compliance status.
The APEX 20KC family is a CMOS programmable-logic platform historically positioned for high-density designs and high-speed digital implementation. A BGA package supplies a large ball grid for power, configuration, clock, and user signals, making printed-circuit-board escape routing and simultaneous-switching-noise analysis important. The available web snippets do not provide enough verified timing, electrical, or architectural data to support additional performance claims. Engineers should use the manufacturer's complete device handbook and specific suffix documentation for final implementation limits.
Typical applications include industrial control systems, communications infrastructure, test and measurement equipment, and legacy digital platforms. The large I/O count can help consolidate parallel buses, control interfaces, and state-machine functions into one configurable device. Existing APEX 20KC designs may use it to preserve an established board footprint while retaining programmable logic. Legacy replacement planning must verify speed grade, temperature grade, configuration method, voltage rails, and exact package-ball assignment before substitution.
For design, confirm the ordering code carefully because suffixes such as C7, C8, C9N, and I-7 can denote different grades or package details. Preserve the original ball map and supply sequencing until equivalence has been demonstrated. BGA assembly requires controlled impedance, short power paths, adequate decoupling, and thermal profiling; exact capacitor values and timing constraints must be selected from manufacturer reference documentation.
This product page separates the verified target-family facts from unavailable parameters, marks unsupported claims explicitly, and provides same-family comparison guidance without presenting non-equivalent FPGAs as drop-in replacements. Pricing shown is as of 2026-09-08 and is represented conservatively where no quote or stock value was supplied.
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