10AX115H2F34E2SG vs 10AX115H2F34I2LG Comparaison
Comparaison détaillée côte à côte de 10AX115H2F34E2SG par Intel et 10AX115H2F34I2LG par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | 10AX115H2F34E2SG | 10AX115H2F34I2LG |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $5 500,00 | $4 995,00 |
| Series | Arria 10 GX | — |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory (M20K blocks) | 2,713 blocks / 68,857,600 bits | — |
| User I/O Pins | 504 | — |
| Transceivers | 24 channels up to 14.1 Gbps | 24 channels, up to 14.4 Gbps |
| PCIe Hard IP | Gen3 x4 / Gen2 x8 | PCI Express Gen3 x8 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | — |
| DSP Blocks | Hardened IEEE 754 single/double-precision floating-point | Hard floating-point DSP |
| 18x19 Multipliers | 2,150 | — |
| PLLs | Fractional, up to 24 | — |
| Memory Interfaces | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| Boîtier | 1152-ball FCBGA (F34) 35x35 mm | 1152-ball FCBGA (BBGA) |
| Speed/Operating Temperature Grade | -2 / 0 C to 100 C (E2 = industrial, enhanced) | — |
| Process Node | 20 nm Tri-Gate (Intel) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Statut RoHS | Compliant | Compliant (per distributor listing) |
| Family | — | Arria 10 GX |
| Embedded Memory Bits | — | 68,857,560 |
| Maximum User I/O | — | 504 |
| Process Technology | — | 20 nm TSMC |
| Core Voltage | — | 0.9 V (nominal) |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Speed Grade | — | -2 |
| Memory Controller | — | Hardened external memory interface (DDR4/QDR-IV) |
| Configuration | — | FPGA (SRAM-based, volatile) |