10AX115H2F34E2SG vs 10AX115H2F34I2LG 对比
详细并排对比 10AX115H2F34E2SG 出自 Intel 和 10AX115H2F34I2LG 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10AX115H2F34E2SG | 10AX115H2F34I2LG |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $5,500.00 | $4,995.00 |
| Series | Arria 10 GX | — |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory (M20K blocks) | 2,713 blocks / 68,857,600 bits | — |
| User I/O Pins | 504 | — |
| Transceivers | 24 channels up to 14.1 Gbps | 24 channels, up to 14.4 Gbps |
| PCIe Hard IP | Gen3 x4 / Gen2 x8 | PCI Express Gen3 x8 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | — |
| DSP Blocks | Hardened IEEE 754 single/double-precision floating-point | Hard floating-point DSP |
| 18x19 Multipliers | 2,150 | — |
| PLLs | Fractional, up to 24 | — |
| Memory Interfaces | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| 封装 | 1152-ball FCBGA (F34) 35x35 mm | 1152-ball FCBGA (BBGA) |
| Speed/Operating Temperature Grade | -2 / 0 C to 100 C (E2 = industrial, enhanced) | — |
| Process Node | 20 nm Tri-Gate (Intel) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS 状态 | Compliant | Compliant (per distributor listing) |
| Family | — | Arria 10 GX |
| Embedded Memory Bits | — | 68,857,560 |
| Maximum User I/O | — | 504 |
| Process Technology | — | 20 nm TSMC |
| Core Voltage | — | 0.9 V (nominal) |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Speed Grade | — | -2 |
| Memory Controller | — | Hardened external memory interface (DDR4/QDR-IV) |
| Configuration | — | FPGA (SRAM-based, volatile) |