10AX115H2F34E2SG vs 10AX115H2F34I2LG 비교
다음의 상세 나란히 비교: 10AX115H2F34E2SG 제조: Intel 및 10AX115H2F34I2LG 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | 10AX115H2F34E2SG | 10AX115H2F34I2LG |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $5,500.00 | $4,995.00 |
| Series | Arria 10 GX | — |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory (M20K blocks) | 2,713 blocks / 68,857,600 bits | — |
| User I/O Pins | 504 | — |
| Transceivers | 24 channels up to 14.1 Gbps | 24 channels, up to 14.4 Gbps |
| PCIe Hard IP | Gen3 x4 / Gen2 x8 | PCI Express Gen3 x8 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | — |
| DSP Blocks | Hardened IEEE 754 single/double-precision floating-point | Hard floating-point DSP |
| 18x19 Multipliers | 2,150 | — |
| PLLs | Fractional, up to 24 | — |
| Memory Interfaces | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| 패키지 | 1152-ball FCBGA (F34) 35x35 mm | 1152-ball FCBGA (BBGA) |
| Speed/Operating Temperature Grade | -2 / 0 C to 100 C (E2 = industrial, enhanced) | — |
| Process Node | 20 nm Tri-Gate (Intel) | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS 상태 | Compliant | Compliant (per distributor listing) |
| Family | — | Arria 10 GX |
| Embedded Memory Bits | — | 68,857,560 |
| Maximum User I/O | — | 504 |
| Process Technology | — | 20 nm TSMC |
| Core Voltage | — | 0.9 V (nominal) |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Speed Grade | — | -2 |
| Memory Controller | — | Hardened external memory interface (DDR4/QDR-IV) |
| Configuration | — | FPGA (SRAM-based, volatile) |