10AX115H2F34E2SG vs 10AX115H2F34I2LG Vergleich
Detaillierter Direktvergleich von 10AX115H2F34E2SG von Intel und 10AX115H2F34I2LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115H2F34E2SG | 10AX115H2F34I2LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5.500,00 | $4.995,00 |
| Series | Arria 10 GX | — |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory (M20K blocks) | 2,713 blocks / 68,857,600 bits | — |
| User I/O Pins | 504 | — |
| Transceivers | 24 channels up to 14.1 Gbps | 24 channels, up to 14.4 Gbps |
| PCIe Hard IP | Gen3 x4 / Gen2 x8 | PCI Express Gen3 x8 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | — |
| DSP Blocks | Hardened IEEE 754 single/double-precision floating-point | Hard floating-point DSP |
| 18x19 Multipliers | 2,150 | — |
| PLLs | Fractional, up to 24 | — |
| Memory Interfaces | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| Gehäuse | 1152-ball FCBGA (F34) 35x35 mm | 1152-ball FCBGA (BBGA) |
| Speed/Operating Temperature Grade | -2 / 0 C to 100 C (E2 = industrial, enhanced) | — |
| Process Node | 20 nm Tri-Gate (Intel) | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant (per distributor listing) |
| Family | — | Arria 10 GX |
| Embedded Memory Bits | — | 68,857,560 |
| Maximum User I/O | — | 504 |
| Process Technology | — | 20 nm TSMC |
| Core Voltage | — | 0.9 V (nominal) |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Speed Grade | — | -2 |
| Memory Controller | — | Hardened external memory interface (DDR4/QDR-IV) |
| Configuration | — | FPGA (SRAM-based, volatile) |