10M50DAF484I7G - MAX 10 FPGA 50K LE 484-FBGA Industrial | Intel
Référence : 10M50DAF484I7G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $82.5 | $82,50 |
| 10 | $78.4 | $784,00 |
| 100 | $70.15 | $7 015,00 |
| 500 | $64.8 | $32 400,00 |
| 1 000 | $58.2 | $58 200,00 |
10M50DAF484I7G Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and dedicated hardened IP blocks such as PLLs, transceivers, multipliers, and (in MAX 10) an on-die dual-configuration flash and ADC. Within the broader taxonomy, the MAX 10 belongs to Intel's low-density, non-volatile FPGA family, sitting below Cyclone V/10 and above MAX II/MAX V. It bridges the gap between CPLDs and traditional SRAM-based FPGAs by eliminating external boot memory, simplifying board design and reducing BOM cost.
Key features include 50K logic elements, 312 Kbits (1,677,312 bits) of embedded user flash, dual on-die configuration flash for instant-on operation, an integrated 12-bit 1 MSPS ADC with up to 18 analog inputs, and a wide variety of I/O standards (LVDS, LVCMOS, SSTL, HSTL) on 360 user I/O pins. The device supports Nios II soft-core embedded processors and is programmable via the Quartus Prime design software.
The MAX 10 architecture pairs an SRAM-based logic fabric with non-volatile on-die flash, allowing single-chip configuration in under 10 ms and dual-boot for fail-safe field upgrades. Hardened IP includes PLLs, embedded multipliers (DSP blocks), memory controllers, and the unique analog-to-digital converter subsystem that eliminates external mixed-signal ICs.
Typical applications include industrial motor control, factory automation I/O hubs, portable test and measurement equipment, video bridging for surveillance and broadcast, automotive driver assistance subsystems (with the AEC-Q100 qualified -A7G grade), and low-cost display controllers. The on-die flash and ADC make MAX 10 especially attractive for system-level designs requiring minimum component count.
When designing with the 484-pin FBGA variant, pay close attention to PCB stackup and microvia capability, since the 1.0 mm pitch and 23x23 mm body require controlled-impedance escape routing. Power sequencing on the VCCIO banks must follow the Intel pin connection guidelines to avoid in-rush latch-up. This page synthesizes distributor pricing, drop-in alternatives within the MAX 10 family, and practical design notes not aggregated on any single manufacturer page.
Alternatives de remplacement direct pour 10M50DAF484I7G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M50DAF484I7G (même facteur de forme et même empreinte) — différant par Package, PLLs, Operating Temperature, Mounting Type, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M50DAF484C7G
✅ Remplacement direct✓ En stock
$65.8 / unité
Voir la fiche technique →10M50DAF484I7P
✅ Remplacement direct✓ En stock
$112 / unité
Voir la fiche technique →10M50DCF484I7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$99.6 / unité
Voir la fiche technique →10M40DAF484I7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M50DAF256I7G
✅ Remplacement direct✓ En stock
$155.2 / unité
Voir la fiche technique →10M50DAF484I7G Valeurs maximales et caractéristiques électriques
| Family | MAX 10 |
| Logic Elements (LE) | 50,000 |
| Embedded Memory (bits) | 1,677,312 |
| Embedded User Flash (bits) | 1,677,312 (dual configuration) |
| User I/O Count | 360 |
| Boîtier | 484-ball FBGA (F484) |
| Package Pitch | 1.0 mm |
| Package Body Size | 23 x 23 mm |
| Process Technology | TSMC 55 nm |
| Supply Voltage - Core | 1.2 V |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| On-die Configuration Flash | Yes (dual-boot) |
| Integrated ADC | 12-bit, 1 MSPS, up to 18 channels |
| DSP Blocks | 144 (18x18 multipliers) |
| PLLs | 4 |
| Configuration Mode | Single-chip (no external boot device required) |
| Type de montage | Surface Mount (FBGA) |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
| Lead-free / Halogen-free | Yes / Yes |
Guide de configuration des broches du 10M50DAF484I7G 23 x 23 mm
Configuration des broches du 10M50DAF484I7G (boîtier 23 x 23 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10M50DAF484I7G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10M50DAF484I7G convient pour 6 applications: Industrial Motor Control, Factory Automation I/O Hub, Portable Test and Measurement, Video Bridging and Display Controllers, Automotive Driver Assistance Subsystems, IoT Edge Gateways.
Industrial Motor Control
The 10M50DAF484I7G fits industrial motor control by integrating a 12-bit 1 MSPS ADC, 144 DSP blocks, and 360 LVDS-capable I/Os in a single non-volatile FPGA. In a typical 3-phase FOC drive the MAX 10 samples phase currents through the on-die ADC, executes Clarke/Park transforms and SVPWM in dedicated DSP blocks, and drives IGBT gate signals via level-shifted GPIO - all without an external boot PROM. Industrial temperature grade (-40C to +100C) and instant-on flash make it ideal for factory-floor drives that must boot within milliseconds after a brown-out reset.
Recommandé
Factory Automation I/O Hub
Factory automation hubs require aggregation of dozens of digital and analog sensors into industrial Ethernet (Profinet, EtherCAT) backbones. The 10M50DAF484I7G's 360 user I/Os allow direct connection to multi-bank opto-isolated inputs without external bus expanders, while 1,677,312 bits of embedded user flash store configuration and diagnostic logs locally. The on-die ADC subsystem reads 4-20 mA analog sensors through current-sense resistors, eliminating separate mixed-signal ICs. Single-chip instant-on operation is critical when PLC racks are hot-swapped mid-cycle.
Recommandé
Portable Test and Measurement
Portable T&M instruments (handheld oscilloscopes, bench DMMs, protocol analyzers) demand low power, high logic density, and instant-on boot. The 10M50DAF484I7G consumes only 150-300 mW of static core power at 1.2 V, supports on-die DSP for FFT/filtering, and boots its bitstream from flash in under 10 ms - fast enough that an instrument is functional by the time the user releases the power button. The integrated 12-bit ADC also doubles as a low-speed auxiliary input for the instrument's own self-calibration routines.
Recommandé
Video Bridging and Display Controllers
The 10M50DAF484I7G's 360 LVDS-capable I/Os are well matched to multi-lane MIPI-to-LVDS bridges, HDMI pre-processing pipelines, and industrial panel timing controllers. Embedded memory (1.6 Mbits) holds two full HD frame buffers at reduced bit depth, and 144 DSP blocks enable on-the-fly scaling and color-space conversion. Designers benefit from the MAX 10's instant-on because video walls and HMI panels must display a splash screen within 200 ms of power-on.
Recommandé
Automotive Driver Assistance Subsystems
Although the 10M50DAF484I7G is industrial-grade, its sibling 10M50DAF484A7G is AEC-Q100 qualified and uses the same F484 footprint and 50K LE silicon. Sensor-fusion pre-processing for ADAS - camera LVDS deserialization, radar FFT, ultrasonic echo timestamping - fits comfortably in 50K logic elements with margin. The integrated 12-bit ADC handles rear-view camera analog test patterns, and dual-configuration flash enables fail-safe OTA firmware rollback, a hard requirement for functional-safety automotive subsystems.
Recommandé
IoT Edge Gateways
IoT edge gateways aggregate wireless sensor data (BLE, LoRa, Wi-Fi) and forward filtered streams to cloud brokers over Ethernet. The 10M50DAF484I7G fits this role by hosting a Nios II soft-core processor that runs an embedded TCP/IP stack and TLS termination, while programmable logic offloads crypto accelerators and sensor-bus controllers (SPI, I2C, UART). The on-die ADC also reads battery voltage and temperature for power-management telemetry, and dual-boot flash allows safe OTA rollback if a firmware update fails.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M50DAF484I7G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M50DAF484C7G | 10M50DAF484I7P | 10M50DCF484I7G | 10M40DAF484I7G | 10M50DAF256I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 256-ball FBGA (F256) - smaller |
| Logic Elements | 50,000 | 50,000 | 50,000 | 50,000 | 40,000 (-20%) | 50,000 |
| Embedded Memory (bits) | 1,677,312 | 1,677,312 | 1,677,312 | 1,677,312 | 1,260,000 | 1,677,312 |
| User I/O Count | 360 | 360 | 360 | 360 | 360 | 178 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| On-die Configuration Flash | Yes (dual-boot) | Yes (dual-boot) | Yes (dual-boot) | Yes (dual-boot) | Yes (dual-boot) | Yes (dual-boot) |
| Integrated ADC | 12-bit, 1 MSPS, 18 channels | 12-bit, 1 MSPS, 18 channels | 12-bit, 1 MSPS, 18 channels | 12-bit, 1 MSPS, 18 channels | 12-bit, 1 MSPS, 18 channels | 12-bit, 1 MSPS, 18 channels |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principaux différenciateurs
- Largest 50K-LE MAX 10 in 484-FBGA with 360 I/Os (vs 10M40DAF484I7G)
- Industrial temperature grade (-40C to +100C) vs commercial (vs 10M50DAF484C7G)
- Highest I/O count in MAX 10 family (vs 10M50DAF256I7G)
Notes de conception
Estimated: the 484-ball FBGA at 1.0 mm pitch and 23x23 mm body requires a 4-layer PCB minimum, with microvias in-pad (0.4 mm pitch BGA escape). Trace impedance of 50 ohm single-ended must be verified for LVDS pairs. Per Intel pin connection guidelines, all VCC and GND balls must be connected to power planes with at least 8 thermal vias per quadrant for heat dissipation. Decoupling: 100 nF X7R within 2 mm of every VCCIO/VCCINT ball plus 4.7 uF bulk caps on each bank supply.
Estimated: core current at 50K LE full toggle activity is approximately 300 mA at 1.2 V (about 360 mW); add 50 mA per active I/O bank. Recommend a 1.2 V LDO with 1 A headroom (e.g., TPS7A4701) for noise-sensitive analog subsystems. Sequence VCCINT first, then VCCIO banks, to prevent in-rush latch-up. Refer to the MAX 10 power management user guide for ramp-rate recommendations.
Estimated: at 100C ambient and worst-case toggling, junction temperature can approach 110-115C. Derate by 50% toggling activity if no airflow is present. The exposed die (no integrated heat spreader) couples directly to the PCB; provide a continuous GND pour under the BGA and stitch with 0.3 mm thermal vias to bottom layer copper for spreading. For sealed enclosures, derate to 70% toggle activity or add a small aluminum heatsink.
Do not assume the 10M50DAF484I7G and 10M50DAF484A7G are interchangeable - only the A7G is AEC-Q100 qualified for automotive. JTAG pins are shared with user I/O on some banks; double-check pin-out spreadsheet before assigning GPIO to bank 8 or bank 2 JTAG pins. Dual-configuration flash is partitioned; do not exceed per-region bitstream size limit or factory-image boot will fail.
Informations de conformité
RoHS and REACH compliant per Intel MAX 10 material declaration datasheet. AEC-Q100 NOT qualified - select the A7G (AEC-Q100 Grade 3) variant for automotive. Lead-free and halogen-free per JEDEC J-STD-020 MSL3 classification.