EP3SE50F780C4N vs EP3SE110F780C4LN Comparaison
Comparaison détaillée côte à côte de EP3SE50F780C4N par Intel et EP3SE110F780C4LN par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SE50F780C4N | EP3SE110F780C4LN |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 430,00 | $3 450,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 47,500 | 107,500 |
| Embedded Memory Bits | 5,760,000 | — |
| Embedded Memory (M9K/M144K blocks) | 488 (per family datasheet) | — |
| Number of LABs | 1900 | — |
| Maximum User I/Os | 488 | — |
| DSP Blocks (18x18 multipliers) | 432 | — |
| PLLs | 12 (per family datasheet) | — |
| Maximum Operating Frequency | 717 MHz | — |
| Transceiver Channels | Up to 12 (per family, model-dependent) | — |
| Transceiver Data Rate | Up to 6.375 Gbps (per Stratix III E family) | — |
| Process Node | 40 nm | — |
| Boîtier | 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch | 780-BBGA, FCBGA (Fine-pitch) |
| Type de montage | Surface Mount (BGA) | Surface Mount (SMT) |
| Tension d'alimentation | Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) | — |
| Température de fonctionnement | 0C to +85C (C4 commercial grade) | 0C to +85C (Commercial) |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel | — |
| Statut RoHS | Lead-free / RoHS compliant | — |
| Niveau MSL | 3 (per JEDEC J-STD-020, FBGA package) | 3 (per JEDEC J-STD-020) |
| Hard Memory Controller | DDR2/DDR3 SDRAM (per Stratix III E family) | — |
| Logic Array Blocks (LABs) | — | 4,300 |
| Embedded Memory | — | 8,936,448 bits |
| User I/O Pins | — | 488 |
| Supply Voltage Core | — | 0.9 V (typical) |
| Speed Grade | — | C4 |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Process Technology | — | 40 nm TSMC |
| DSP Blocks | — | Yes (18x18 multipliers) |
| Tray Packaging | — | Yes (per distributor listings) |