EP3SE50F780C4N vs EP3SE110F780C4LN Comparison

Detailed side-by-side comparison of EP3SE50F780C4N by Intel and EP3SE110F780C4LN by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE50F780C4N EP3SE110F780C4LN
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $1,430.00 $3,450.00
Family Stratix III E Stratix III E
Logic Elements (LE) 47,500 107,500
Embedded Memory Bits 5,760,000 β€”
Embedded Memory (M9K/M144K blocks) 488 (per family datasheet) β€”
Number of LABs 1900 β€”
Maximum User I/Os 488 β€”
DSP Blocks (18x18 multipliers) 432 β€”
PLLs 12 (per family datasheet) β€”
Maximum Operating Frequency 717 MHz β€”
Transceiver Channels Up to 12 (per family, model-dependent) β€”
Transceiver Data Rate Up to 6.375 Gbps (per Stratix III E family) β€”
Process Node 40 nm β€”
Package 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch 780-BBGA, FCBGA (Fine-pitch)
Mounting Type Surface Mount (BGA) Surface Mount (SMT)
Supply Voltage Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) β€”
Operating Temperature 0C to +85C (C4 commercial grade) 0C to +85C (Commercial)
Configuration Modes JTAG, Passive Serial, Fast Passive Parallel β€”
RoHS Status Lead-free / RoHS compliant β€”
MSL Level 3 (per JEDEC J-STD-020, FBGA package) 3 (per JEDEC J-STD-020)
Hard Memory Controller DDR2/DDR3 SDRAM (per Stratix III E family) β€”
Logic Array Blocks (LABs) β€” 4,300
Embedded Memory β€” 8,936,448 bits
User I/O Pins β€” 488
Supply Voltage Core β€” 0.9 V (typical)
Speed Grade β€” C4
Lead-Free / RoHS β€” Yes (N suffix)
Process Technology β€” 40 nm TSMC
DSP Blocks β€” Yes (18x18 multipliers)
Tray Packaging β€” Yes (per distributor listings)

Datasheets & Resources

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