EP3SE50F780C4N vs EP3SE110F780C4LN 对比
详细并排对比 EP3SE50F780C4N 出自 Intel 和 EP3SE110F780C4LN 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE50F780C4N | EP3SE110F780C4LN |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,430.00 | $3,450.00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 47,500 | 107,500 |
| Embedded Memory Bits | 5,760,000 | — |
| Embedded Memory (M9K/M144K blocks) | 488 (per family datasheet) | — |
| Number of LABs | 1900 | — |
| Maximum User I/Os | 488 | — |
| DSP Blocks (18x18 multipliers) | 432 | — |
| PLLs | 12 (per family datasheet) | — |
| Maximum Operating Frequency | 717 MHz | — |
| Transceiver Channels | Up to 12 (per family, model-dependent) | — |
| Transceiver Data Rate | Up to 6.375 Gbps (per Stratix III E family) | — |
| Process Node | 40 nm | — |
| 封装 | 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch | 780-BBGA, FCBGA (Fine-pitch) |
| 安装类型 | Surface Mount (BGA) | Surface Mount (SMT) |
| 电源电压 | Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) | — |
| 工作温度 | 0C to +85C (C4 commercial grade) | 0C to +85C (Commercial) |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel | — |
| RoHS 状态 | Lead-free / RoHS compliant | — |
| MSL 等级 | 3 (per JEDEC J-STD-020, FBGA package) | 3 (per JEDEC J-STD-020) |
| Hard Memory Controller | DDR2/DDR3 SDRAM (per Stratix III E family) | — |
| Logic Array Blocks (LABs) | — | 4,300 |
| Embedded Memory | — | 8,936,448 bits |
| User I/O Pins | — | 488 |
| Supply Voltage Core | — | 0.9 V (typical) |
| Speed Grade | — | C4 |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Process Technology | — | 40 nm TSMC |
| DSP Blocks | — | Yes (18x18 multipliers) |
| Tray Packaging | — | Yes (per distributor listings) |