IRLR3636TRPBF vs IRFZ48NSTRLPBF Comparaison
Comparaison détaillée côte à côte de IRLR3636TRPBF par Infineon et IRFZ48NSTRLPBF par Infineon. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | IRLR3636TRPBF | IRFZ48NSTRLPBF |
|---|---|---|
| Marque | Infineon | Infineon |
| Catégorie | MOSFETs | MOSFETs |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $2,38 | $1,18 |
| FET Type | N-Channel MOSFET, Metal Oxide | N-Channel Power MOSFET |
| Drain-to-Source Voltage (V_DSS) | 60 V | — |
| Continuous Drain Current (I_D) at T_C = 25C | 50 A | — |
| Continuous Drain Current (I_D) at T_C = 100C | [DATA_NEEDED: I_D at 100C] | — |
| Pulsed Drain Current (I_DM) | [DATA_NEEDED: pulsed drain current] | — |
| Maximum R_DS(on) at V_GS = 10V | 6.8 mOhm | — |
| Typical R_DS(on) at V_GS = 10V | 5.4 mOhm | — |
| Gate Threshold Voltage (V_GS(th)) | [DATA_NEEDED: V_GS(th) range] | — |
| Total Gate Charge (Q_G) | 33 nC | — |
| Maximum Power Dissition (P_D) at T_C = 25C | 143 W | — |
| Plage de température de fonctionnement | -55C to +175C | — |
| Boîtier | TO-252AA (DPAK) | D2PAK (TO-263) Surface Mount |
| Type de montage | Surface Mount | Surface Mount |
| Technology | IR HEXFET / IR MOSFET | — |
| Statut RoHS | Compliant | Compliant |
| Lead-Free | Yes (PBF suffix) | — |
| Drain-to-Source Voltage (VDS) | — | 55 V |
| Continuous Drain Current (ID) @ Tc=25C | — | 64 A |
| Pulsed Drain Current (IDM) | — | [DATA_NEEDED: pulsed drain current] |
| Static Drain-to-Source On-Resistance (Rds(on)) | — | 14 mΩ at VGS = 10 V |
| Gate-to-Source Threshold Voltage (VGS(th)) | — | 2.0 V to 4.0 V |
| Total Gate Charge (Qg) | — | 54 nC |
| Gate-to-Source Voltage (VGS) max | — | ±20 V |
| Power Dissipation (Pd) @ Tc=25C | — | 130 W |
| Power Dissipation (Pd) @ Ta=25C on FR-4 | — | 3.8 W |
| Température de jonction en fonctionnement | — | -55C to +175C |
| Packaging | — | Tape & Reel (13-inch reel, TRL) |
| Lead Finish | — | Lead-free (PBF) matte tin |
| Technology Family | — | HEXFET advanced process technology |