IRLR3636TRPBF vs IRFZ48NSTRLPBF Comparação
Comparação detalhada lado a lado de IRLR3636TRPBF por Infineon e IRFZ48NSTRLPBF por Infineon. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | IRLR3636TRPBF | IRFZ48NSTRLPBF |
|---|---|---|
| Marca | Infineon | Infineon |
| Categoria | MOSFETs | MOSFETs |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $2,38 | $1,18 |
| FET Type | N-Channel MOSFET, Metal Oxide | N-Channel Power MOSFET |
| Drain-to-Source Voltage (V_DSS) | 60 V | — |
| Continuous Drain Current (I_D) at T_C = 25C | 50 A | — |
| Continuous Drain Current (I_D) at T_C = 100C | [DATA_NEEDED: I_D at 100C] | — |
| Pulsed Drain Current (I_DM) | [DATA_NEEDED: pulsed drain current] | — |
| Maximum R_DS(on) at V_GS = 10V | 6.8 mOhm | — |
| Typical R_DS(on) at V_GS = 10V | 5.4 mOhm | — |
| Gate Threshold Voltage (V_GS(th)) | [DATA_NEEDED: V_GS(th) range] | — |
| Total Gate Charge (Q_G) | 33 nC | — |
| Maximum Power Dissition (P_D) at T_C = 25C | 143 W | — |
| Faixa de temperatura de operação | -55C to +175C | — |
| Encapsulamento | TO-252AA (DPAK) | D2PAK (TO-263) Surface Mount |
| Tipo de montagem | Surface Mount | Surface Mount |
| Technology | IR HEXFET / IR MOSFET | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes (PBF suffix) | — |
| Drain-to-Source Voltage (VDS) | — | 55 V |
| Continuous Drain Current (ID) @ Tc=25C | — | 64 A |
| Pulsed Drain Current (IDM) | — | [DATA_NEEDED: pulsed drain current] |
| Static Drain-to-Source On-Resistance (Rds(on)) | — | 14 mΩ at VGS = 10 V |
| Gate-to-Source Threshold Voltage (VGS(th)) | — | 2.0 V to 4.0 V |
| Total Gate Charge (Qg) | — | 54 nC |
| Gate-to-Source Voltage (VGS) max | — | ±20 V |
| Power Dissipation (Pd) @ Tc=25C | — | 130 W |
| Power Dissipation (Pd) @ Ta=25C on FR-4 | — | 3.8 W |
| Temperatura de junção de operação | — | -55C to +175C |
| Packaging | — | Tape & Reel (13-inch reel, TRL) |
| Lead Finish | — | Lead-free (PBF) matte tin |
| Technology Family | — | HEXFET advanced process technology |