10AS032H1F34E1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel (Altera)
Référence : 10AS032H1F34E1HG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2237.25 | $2 237,25 |
| 10 | $2150.5 | $21 505,00 |
| 100 | $1985 | $198 500,00 |
| 250 | $1860 | $465 000,00 |
| 500 | $1755 | $877 500,00 |
10AS032H1F34E1HG Présentation
An SoC FPGA is a single integrated circuit that combines a general-purpose processor subsystem (CPU, memory controller, peripherals) with a programmable FPGA fabric. The Arria 10 SX architecture places the ARM Cortex-A9 subsystem as a hard macro in the device's I/O column, giving developers deterministic shared-memory access to the FPGA fabric via a high-bandwidth AXI/ACP coherent interconnect — dramatically improving latency and throughput over soft-core SoC implementations. This hierarchy places the Arria 10 SX in the broader family of SoC FPGAs, programmable logic devices, and embedded processors.
Key features of the 10AS032H1F34E1HG include a 1.5 GHz Cortex-A9 dual-core hard processor system with NEON SIMD media engine and single/double precision floating-point unit, approximately 320K logic elements combined with roughly 21 Mb of on-chip M20K memory, hardened floating-point DSP blocks, up to 24 transceivers supporting data rates up to 17.4 Gbps, and integrated PCIe Gen3 x8 hard IP plus external memory interfaces supporting DDR4 at up to 2133 Mbps. Power consumption is optimized through the 20nm process and Smart Voltage ID-based adaptive body bias.
The architecture leverages a 20nm TSMC process with hard IP for memory controllers, PCIe, and the HPS, leaving the FPGA fabric free for application logic. Adaptive Body Bias reduces leakage at low activity, while smart routing and variable-precision DSP blocks accelerate DSP-heavy workloads such as wireless baseband or radar processing. The transceiver and memory subsystem are tightly coupled, making it well suited for line-rate streaming pipelines.
Typical applications include high-performance wireline and wireless baseband processing, software-defined radio, test and measurement instrumentation, broadcast video processing, industrial machine vision, and defense signal intelligence. The combination of ARM Cortex-A9 running an embedded OS plus a high-performance FPGA fabric lets teams implement complex control planes and data planes on a single device.
When designing with this part, pay close attention to PCB layout: the 1152-ball FCBGA requires a high-density multilayer PCB with microvia stack-ups, and proper decoupling per the Intel pin connection guidelines is essential. Thermal management is critical — the FC package dissipates significant power under heavy logic utilization, so a heatsink or thermal interface material is typically required in enclosed chassis.
This page synthesizes current distributor inventory, lifecycle signals, drop-in same-package alternatives, and practical PCB/thermal guidance not collected on a single manufacturer page.
Alternatives de remplacement direct pour 10AS032H1F34E1HG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AS032H1F34E1HG (même facteur de forme et même empreinte) — différant par Package, Mounting Type, DSP Blocks, Transceivers, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AS032H1F34E2HG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10AS032H1F34E3HG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10AS032H1F34I1HG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2077.26 / unité
Voir la fiche technique →10AS032H1F34I2HG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10AS032H1F34I3HG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10AS032H1F34E1HG Valeurs maximales et caractéristiques électriques
| Device Family | Arria 10 SX |
| Architecture | 20nm SoC FPGA (FPGA + hard ARM Cortex-A9 subsystem) |
| Logic Elements | 320,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| On-chip Memory | Approx. 21 Mb (M20K blocks) |
| Transceivers | Up to 24 channels, up to 17.4 Gbps |
| DSP Blocks | Variable-precision hardened DSP with floating-point |
| Hard Memory Controllers | DDR4 up to 2133 Mbps, DDR3, QDRII+, RLDRAM3 |
| PCIe Hard IP | PCIe Gen3 x8 |
| Boîtier | 1152-ball FCBGA (35 x 35 mm) |
| Operating Temperature (E1 suffix) | 0C to +100C (extended) |
| Type de montage | Surface Mount, flip-chip BGA |
| Statut RoHS | Compliant |
| Pin/Ball Count | 1152 |
Guide de configuration des broches du 10AS032H1F34E1HG 1152-ball fcbga (35 x 35 mm)
Configuration des broches du 10AS032H1F34E1HG (boîtier 1152-ball fcbga (35 x 35 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AS032H1F34E1HG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AS032H1F34E1HG convient pour 6 applications: Wireless Baseband Processing, Software-Defined Radio (SDR) Platforms, Test and Measurement Instrumentation, Broadcast Video Processing, Industrial Machine Vision, Defense Signal Intelligence.
Wireless Baseband Processing
The 10AS032H1F34E1HG's combination of approximately 320K logic elements and hardened floating-point DSP blocks makes it well suited for wireless baseband signal processing. Its 17.4 Gbps transceivers connect directly to RF ADCs/DACs and JESD204B/C interfaces, while the dual-core ARM Cortex-A9 HPS running at 1.5 GHz handles the MAC layer and protocol stack under Linux. The device sustains LTE and 5G NR physical-layer workloads at line rate, replacing discrete DSP + MCU architectures with a single SoC FPGA. AXI-coherent access between HPS and FPGA fabric eliminates DMA bottlenecks common in two-chip designs.
Recommandé
Software-Defined Radio (SDR) Platforms
The 10AS032H1F34E1HG is a workhorse for high-performance SDR platforms where reconfigurability across waveforms (LTE, Wi-Fi, custom OFDM) is essential. Its 24 transceivers support multiple antennas and RF chains simultaneously, while the FPGA fabric runs FFTs, channelizers, and modulators in real time. The HPS boots a Linux SDR stack (GNU Radio, custom frameworks) and exchanges samples with the fabric over the AXI/ACP bridge. Designers value the device's PCIe Gen3 x8 endpoint for host coupling in test and measurement chassis.
Recommandé
Test and Measurement Instrumentation
For oscilloscopes, signal analyzers, and protocol testers, the 10AS032H1F34E1HG delivers the parallel logic capacity to capture and process multi-gigasample-per-second ADC data streams. Its 21 Mb of M20K memory buffers long acquisitions, while the FPGA fabric implements custom trigger logic and decoders. The Cortex-A9 HPS manages the user interface, display, and Ethernet/USB connectivity, running an embedded OS for instrument control. Compared with discrete FPGA + processor designs, this single-chip approach shrinks PCB area and reduces BOM cost in high-channel-count instruments.
Recommandé
Broadcast Video Processing
The 10AS032H1F34E1HG accelerates broadcast video workloads including 4K/8K upconversion, frame-rate conversion, and HDR mapping. Its DSP blocks implement scaling and color-space conversion pipelines, while H.265/HEVC codecs run in the FPGA fabric for real-time contribution encoding. The ARM HPS manages IP transport streams (SMPTE 2022, SMPTE 2110) over Ethernet and orchestrates channel playout. The 1.5 GHz Cortex-A9 also handles captioning and graphics overlay, replacing separate control MCUs.
Recommandé
Industrial Machine Vision
In factory automation and inspection systems, the 10AS032H1F34E1HG performs real-time image processing on multiple high-resolution camera streams. Its transceivers accept MIPI CSI-2, CoaXPress, or GigE Vision inputs, while the FPGA fabric runs convolution, edge detection, and AI inference accelerators. The Cortex-A9 HPS hosts a Linux-based vision stack (OpenCV, ROS 2) and drives EtherCAT or PROFINET industrial Ethernet to coordinate with PLCs and robots. The extended industrial temperature grade (E1) supports factory-floor environments from 0C to +100C.
Recommandé
Defense Signal Intelligence
The 10AS032H1F34E1HG is widely adopted in electronic-warfare and signals-intelligence systems where wideband capture and real-time demodulation are critical. Its 17.4 Gbps transceivers digitize GHz-bandwidth RF directly, the FPGA fabric runs channelizers and demodulators at full rate, and the HPS coordinates spectrum scanning and recording. The 1152-ball FCBGA's high pin count supports the dense digital I/O needed for multi-channel RF front ends, and the device's security features (AES, secure boot) protect classified waveforms. Its mature ecosystem and long-life program status make it a low-risk choice for defense platforms.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AS032H1F34E1HG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AS032H1F34E2HG | 10AS032H1F34E3HG | 10AS032H1F34I1HG | 10AS032H1F34I2HG | 10AS032H1F34I3HG |
|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA (35x35) | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 320K | 320K | 320K | 320K | 320K | 320K |
| Hard Processor System | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz |
| Operating Temperature | 0C to +100C (E1) | 0C to +100C (E2) | 0C to +100C (E3) | -40C to +100C (I1) | -40C to +100C (I2) | -40C to +100C (I3) |
| Transceivers (max) | 24 ch up to 17.4 Gbps | 24 ch up to 17.4 Gbps | 24 ch up to 17.4 Gbps | 24 ch up to 17.4 Gbps | 24 ch up to 17.4 Gbps | 24 ch up to 17.4 Gbps |
| Lead-Free / RoHS | Yes (HG suffix) | Yes (HG suffix) | Yes (HG suffix) | Yes (HG suffix) | Yes (HG suffix) | Yes (HG suffix) |
Principaux différenciateurs
- Same silicon as 1152-ball FCBGA family siblings across temperature grades (vs 10AS032H1F34I3HG)
- Higher pin count than 780-ball BGA siblings, supporting more transceiver channels and wider memory interface (vs 10AS032E4F29I3SG)
- Dual-core ARM Cortex-A9 HPS integrated on die (vs Logic-only Arria 10 GX parts)
Notes de conception
The 1152-ball FCBGA requires an HDI PCB with microvia stack-ups and matched-length routing for high-speed transceivers. Use the Arria 10 pin connection guidelines to assign power-pin decoupling: bulk caps within 50 mils of the pin, plus 0.1 uF and 0.01 uF ceramics at each power pin per the Intel FPGA power delivery network design guide. Estimated via-in-pad microvia count exceeds 1,000; expect 8-12 layer stack-up with buried capacitance.
Estimated: at full FPGA fabric utilization (320K LE, ~85% toggle rate) plus active HPS, expect 12-18 W power dissipation. The 35x35 mm FCBGA package has theta_JA around 8-12 C/W with a properly designed heatsink; without a heatsink, junction temperature can exceed 100C in still air. Use a thermal interface material rated for the package height, and consider a clip-mounted heatsink per the Arria 10 thermal design guide.
Do not assume all 10AS032H1F34 variants are drop-in: only same-suffix code (E1/E2/E3 or I1/I2/I3 in F34) parts share the identical pinout. The 10AS032E4F29I3SG and similar 780-ball BGA siblings share silicon but use a different footprint and are NOT pin-compatible. Always verify the order code against the Arria 10 device handbook before PCB respin.
Transceiver channels up to 17.4 Gbps require strict impedance control (100 ohm differential with 5% tolerance) and length matching within the budget published in the Arria 10 transceiver user guide. Keep AC-coupling capacitors within 200 mils of the FPGA pin, and isolate high-speed transceiver regions from the HPS peripherals and DDR4 interfaces with a solid ground plane to minimize crosstalk and EMI.
Informations de conformité
Lead-free / RoHS-compliant per the HG suffix in the order code. AEC-Q100 not qualified (industrial-grade part); for automotive applications use an explicitly qualified Intel FPGA part. REACH, halogen-free, and conflict-minerals status not explicitly stated in the verified distributor data.
