10AS032E4F29I3SG - Arria 10 SX SoC FPGA, 320K LE, 1.5GHz | Intel
MPN: 10AS032E4F29I3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2695 | $26,950.00 |
| 100 | $2540 | $254,000.00 |
| 500 | $2395 | $1,197,500.00 |
| 1,000 | $2250 | $2,250,000.00 |
Drop-in alternatives for 10AS032E4F29I3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS032E4F29I3LG
✅ Drop-In✓ In Stock
$1920 / Unit
View Datasheet →10AS032E4F29E3SG
✅ Drop-In✓ In Stock
$1920 / Unit
View Datasheet →10AS032E4F29E3LG
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$2295 / Unit
View Datasheet →10AS032E3F29I2SG
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$1295 / Unit
View Datasheet →10AS032E3F29I2LG
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$1390 / Unit
View Datasheet →10AS032E4F29I3SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Device Type | SoC FPGA with dual ARM Cortex-A9 MPCore + CoreSight |
| Logic Elements | 320,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | 1.5 GHz |
| Core Supply Voltage | 0.9 V |
| Package | 780-ball FBGA, FC (flip-chip), 29 mm × 29 mm |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C) |
| Speed Grade | 4 |
| Mounting Type | Surface Mount (BGA) |
| Packaging | Tray |
| Lifecycle Status | Active |
| RoHS Status | Compliant |
| Process Node | 20 nm (Tri-Gate) |
| Programming Toolchain | Intel Quartus Prime |
10AS032E4F29I3SG 780-ball fbga, fc (flip-chip), 29 mm × 29 mm Pin Configuration Guide
Complete pinout information for 10AS032E4F29I3SG (780-ball fbga, fc (flip-chip), 29 mm × 29 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032E4F29I3SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032E4F29I3SG is suitable for 7 applications: Wireless Baseband Processing, Software Defined Radio (SDR), Broadcast Video Infrastructure, Industrial Machine Vision, Military Signal Intelligence, Medical Imaging Accelerator, High-Performance Protocol Bridging.
Wireless Baseband Processing
The 10AS032E4F29I3SG fits wireless baseband processing because its 320K logic elements and ARM Cortex-A9 HPS jointly execute PHY-layer DSP, MAC scheduling, and protocol-stack processing on a single device. The 1.5 GHz HPS clock drives LTE/5G NR layer-2/3 stacks under Linux, while the FPGA fabric accelerates FFT, channel estimation, and MIMO matrix operations in parallel. Industrial temperature grading enables outdoor small-cell and macro deployments.
Recommended
Software Defined Radio (SDR)
The 10AS032E4F29I3SG is well matched to software-defined radio platforms where wideband DSP pipelines must coexist with Linux-based waveform control. The Arria 10 SX fabric hosts multi-rate digital down-conversion, FIR filtering, and modulation/demodulation cores, while the dual ARM Cortex-A9 HPS runs GNU Radio or custom waveforms. Transceiver-rich device variants in the same F29 footprint deliver multi-Gsps ADC interfacing for tactical radio systems.
Recommended
Broadcast Video Infrastructure
The 10AS032E4F29I3SG enables broadcast video processing equipment such as contribution encoders, playout servers, and IP gateway blades. Its 320K LE fabric is large enough to handle multi-stream 4K/UHD HEVC pipeline stages, color-space conversion, and SDI-to-IP bridging concurrently. The integrated HPS runs control-plane software for NMOS IS-04/IS-05 discovery and PTP timing, eliminating the need for a separate SBC in the chassis.
Recommended
Industrial Machine Vision
The 10AS032E4F29I3SG serves high-speed industrial inspection systems where multi-camera CoaXPress or GigE Vision streams must be processed in real time. The FPGA fabric hosts image preprocessing (debayer, defect detection, color correction) while the dual ARM Cortex-A9 HPS manages camera control protocols and factory-floor networking. Industrial temperature grading makes the part suitable for factory-side installations without active cooling.
Recommended
Military Signal Intelligence
The 10AS032E4F29I3SG's combination of hardened ARM Cortex-A9 HPS, 320K LE fabric, and industrial temperature range fits deployable SIGINT and EW platforms. Sensitive signal-detection and direction-finding algorithms run in the fabric for deterministic latency, while classification and database lookups execute on the HPS under a secure operating system. The 780-FBGA flip-chip package supports dense, vibration-tolerant board assemblies.
Recommended
Medical Imaging Accelerator
The 10AS032E4F29I3SG accelerates CT, MRI, and ultrasound image reconstruction by offloading back-projection and beamforming kernels to the FPGA fabric, while the dual-core ARM Cortex-A9 HPS manages DICOM networking and operator interface logic. Real-time reconstruction at clinically required frame rates benefits from the device's 1.5 GHz HPS clock and high on-die memory bandwidth, and the industrial temperature grade supports mobile cart-based imaging systems.
Recommended
High-Performance Protocol Bridging
The 10AS032E4F29I3SG enables low-latency protocol bridging between PCIe Gen3, 10/25/40/100 Gigabit Ethernet, SATA, and custom serial interfaces in hyperscale data center and telecom equipment. The FPGA fabric terminates line-rate MAC, IPsec, or compression pipelines, while the dual ARM Cortex-A9 HPS runs Linux for management, telemetry, and routing-protocol stacks. The 780-ball BGA supports dense serializer/deserializer routing.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032E4F29I3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032E4F29I3LG | 10AS032E4F29E3SG | 10AS032E4F29E3LG | 10AS032E3F29I2SG | 10AS032E3F29I2LG |
|---|---|---|---|---|---|---|
| Package | 780-ball FBGA, FC, 29x29 mm | 780-ball FBGA, FC, 29x29 mm - same | 780-ball FBGA, FC, 29x29 mm - same | 780-ball FBGA, FC, 29x29 mm - same | 780-ball FBGA, FC, 29x29 mm - same | 780-ball FBGA, FC, 29x29 mm - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| Speed Grade | I3 (industrial, speed 3-class) | I3 | E3 (extended temperature) | E3 | I2 (slower speed) | I2 |
| Temperature Grade | Industrial | Industrial / lead-free | Extended | Extended / lead-free | Industrial | Industrial / lead-free |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Maximum Core Frequency | 1.5 GHz | 1.5 GHz | ~1.4 GHz (E3) | ~1.4 GHz (E3) | ~1.25 GHz (I2) | ~1.25 GHz (I2) |
| Unit Price (USD, qty 1) | $2,850 | $2,750 | $2,650 | $2,600 | $2,300 | $2,250 |
Key Differentiators
- Higher speed-grade Fmax for the most demanding transceiver and DSP workloads (vs 10AS032E3F29I2SG)
- Standard industrial temperature grade for harsh-environment deployment (vs 10AS032E4F29E3SG)
- Tray packaging as stocked by major distributors (vs 10AS032E4F29E3LG)
Design Notes
The 780-ball F29 BGA at 1.0 mm pitch requires escape routing on a high-layer-count PCB (typically 8–12 layers) with 50 Ω controlled-impedance traces for high-speed transceiver channels. Use the Intel/Altera BGA escape routing guidelines and stack the top layers with microvia-in-pad construction (laser-drilled) so the inner-row balls can be fanned out without dog-bone stubs. Maintain a continuous solid ground plane directly under the BGA to provide both return-current paths and thermal spreading.
The 20 nm Arria 10 SX device dissipates 10–25 W in typical applications; design a thermal solution sized for the worst-case workload (e.g., fully utilized transceiver channels and high DSP block toggle rate). Use a heat-spreader or heatsink with thermal interface material rated for the industrial temperature range (-40 °C to +100 °C) and provide 200 LFM minimum airflow across the package. Estimated junction-to-ambient thermal resistance θ_JA is approximately 8–10 °C/W with a high-performance heatsink; verify with the Arria 10 thermal model before finalizing the mechanical design.
Arria 10 SX devices require multiple regulated rails (0.9 V core, 1.8 V/2.5 V/3.3 V I/O, and transceiver supplies) with strict sequencing and ramp-time requirements. Use the Intel/Altera reference power tree with the dedicated controller (e.g., LTC/TI PMBus sequencer) and follow the in-rush current limit guidelines to avoid tripping the SmartVID controller. Decouple each rail with a 4.7 µF bulk + 0.1 µF + 0.01 µF capacitor network placed as close to each BGA ball cluster as possible.
Do not migrate between F29 and F27/F31 Arria 10 SX packages without a full PCB re-spin: ball maps differ between package outlines even though silicon is identical. Also, the I3, I2, and E3 speed grades have different Fmax guarantees for DSP blocks and transceivers; downgrading a design from I3 to I2 may fail timing closure without re-running Quartus Prime place-and-route. Always verify temperature-grade part numbering carefully - SG denotes industrial and LG denotes lead-free tray variant (not 'lower grade').
Compliance Information
RoHS and lead-free compliance stated on Altera/Intel product page. AEC-Q100 not applicable - this is a programmable logic device, not an automotive-grade IC. Reach and conflict-minerals compliance standard for Intel/Altera FPGAs.
