10AS032H3F34E2SG - Arria 10 SX 320K LE SoC FPGA 1152-FBGA | Intel
Référence : 10AS032H3F34E2SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2850 | $2 850,00 |
| 10 | $2680 | $26 800,00 |
| 100 | $2475 | $247 500,00 |
| 500 | $2290 | $1 145 000,00 |
| 1 000 | $2120 | $2 120 000,00 |
10AS032H3F34E2SG Présentation
An SoC FPGA is a class of programmable logic device that integrates one or more hard processor cores, on-chip memory, and high-speed peripherals alongside the traditional FPGA fabric of logic elements, DSP blocks, and embedded memory. The Arria 10 SX series in particular targets applications that require deterministic real-time processing combined with CPU-based control planes. The hard processor system (HPS) includes peripherals such as Ethernet MAC, USB, SD/eMMC controllers, and DDR memory controllers, while the FPGA fabric implements custom datapaths and high-bandwidth interfaces. This dual nature simplifies board design by eliminating a discrete companion processor.
Key features of the 10AS032H3F34E2SG include 320K logic elements, integrated transceivers supporting multi-gigabit serial protocols, embedded DSP blocks for fixed- and floating-point signal processing, distributed and block RAM for on-chip storage, and the hard ARM Cortex-A9 dual-core subsystem. The FC (flip-chip) BGA package enables the high pin density required for the 1152-ball interface, supporting high-speed SERDES, parallel DDR3/DDR4 memory interfaces, and the HPS peripheral set. Speed grade H3 indicates a mid-bin timing closure profile, balancing Fmax and power.
The Arria 10 architecture is built on a 20 nm process with hardened floating-point DSP blocks, partial reconfiguration support, and transceiver data rates up to 17.4 Gbps (depending on transceiver grade). The SoC variant integrates dual ARM Cortex-A9 cores running up to 1.5 GHz with NEON media processing, single- or double-precision floating-point hardware, and coherent memory access to the FPGA fabric. Security features include AES bitstream encryption, JTAG lock, and tamper-detection circuitry for protected deployments.
Typical applications for the 10AS032H3F34E2SG include wireless baseband processing, software-defined radio (SDR), industrial machine vision, medical imaging accelerators, and military/aerospace signal processing. The combination of ARM processing with FPGA fabric makes it well-suited for protocol bridging, motor control with custom interfaces, and embedded compute nodes where offloading CPU-intensive kernels to hardware accelerates overall throughput.
When designing with this device, plan power delivery carefully: a SoC FPGA in the 320K-LE class typically draws 10-25 W depending on utilization and transceiver activity. Use the Quartus Prime PowerPlay early power estimator before committing to the PCB stackup. DDR3/DDR4 interfaces require matched-length routing and proper termination; consult Intel's external memory interface documentation for topology guidelines.
This page synthesizes distributor pricing, alternative-device cross-reference data, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for procurement and engineering decisions on the 10AS032H3F34E2SG.
Alternatives de remplacement direct pour 10AS032H3F34E2SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AS032H3F34E2SG (même facteur de forme et même empreinte) — différant par Package, Mounting Type, Package Code, RoHS Status, Hard Processor System.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AS032H3F34E2LG
✅ Remplacement direct✓ En stock
$1650 / unité
Voir la fiche technique →10AS032H3F34I2SG
✅ Remplacement direct✓ En stock
$3450 / unité
Voir la fiche technique →10AS032H2F34E2SG
✅ Remplacement direct✓ En stock
$1410 / unité
Voir la fiche technique →10AS032H2F34E2LG
✅ Remplacement direct✓ En stock
$1380 / unité
Voir la fiche technique →10AS032H1F34E1HG
✅ Remplacement direct✓ En stock
$1755 / unité
Voir la fiche technique →10AS032H3F34E2SG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | 1.5 GHz |
| Boîtier | 1152-ball FBGA, FC (35x35 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +100C (industrial) |
| Speed Grade | H3 |
| Statut RoHS | Compliant |
| Lead Free | Yes |
| Process Node | 20 nm |
| Transceivers | Integrated multi-gigabit transceivers |
| DSP Blocks | Hardened floating-point DSP blocks |
| Memory Interfaces | DDR3 / DDR4 with hard controllers |
| Configuration | AES-encrypted bitstream support |
Guide de configuration des broches du 10AS032H3F34E2SG 1152-ball fbga, fc (35x35 mm)
Configuration des broches du 10AS032H3F34E2SG (boîtier 1152-ball fbga, fc (35x35 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AS032H3F34E2SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AS032H3F34E2SG convient pour 6 applications: Wireless Baseband Processing, Software-Defined Radio (SDR), Industrial Machine Vision, Medical Imaging Accelerator, Protocol Bridging and Industrial Networking, Embedded Compute and Edge Acceleration.
Wireless Baseband Processing
The 10AS032H3F34E2SG's 320K logic elements and dual ARM Cortex-A9 cores at 1.5 GHz deliver the throughput needed for mid-range wireless baseband DSP and protocol stack processing. Its hardened floating-point DSP blocks accelerate FFT, channel estimation, and turbo-decoding kernels, while the HPS handles MAC-layer scheduling and upper-stack software. With transceiver rates up to 17.4 Gbps, it interfaces directly to RF front-ends and CPRI/OBSAI links. The 1152-ball F34 package provides the I/O budget required for multiple antenna streams and parallel ADC/DAC interfaces, making it a strong fit for small-cell LTE and 5G NR baseband units.
Recommandé
Software-Defined Radio (SDR)
Software-defined radio platforms benefit from the 10AS032H3F34E2SG's combination of reprogrammable FPGA fabric and the dual ARM Cortex-A9 hard processor system running up to 1.5 GHz. The FPGA implements wideband DDC/DUC, channelizers, and waveform-specific modulators, while the HPS runs the radio control plane, network stack, and waveform selection logic. Integrated transceivers up to 17.4 Gbps connect directly to wideband ADC/DAC pairs. The SoC architecture eliminates a companion processor, reducing board area and BOM cost for portable SDR applications in defense and commercial wireless test equipment.
Recommandé
Industrial Machine Vision
The 10AS032H3F34E2SG is well-suited for high-speed machine vision inspection systems where multi-camera sensor fusion and real-time image processing must run concurrently. Its 320K logic elements and hardened floating-point DSP accelerate Bayer demosaicing, convolution kernels, and feature extraction at line rates exceeding 10 Gbps. The dual ARM Cortex-A9 cores run the vision application stack, PLC interface, and network protocols. The HPS DDR controller supports simultaneous buffering from multiple high-resolution sensors without taxing FPGA fabric memory bandwidth, while the F34 BGA package provides the GPIO and SERDES lanes needed for Camera Link, CoaXPress, or GigE Vision aggregation.
Recommandé
Medical Imaging Accelerator
The 10AS032H3F34E2SG's hard floating-point DSP and high logic density make it an effective accelerator for medical imaging modalities including ultrasound beamforming, CT reconstruction, and MRI FFT pipelines. The ARM Cortex-A9 subsystem manages the user interface, DICOM networking, and image post-processing while the FPGA fabric performs the parallel beamforming or back-projection math. The hardened memory controllers drive DDR3 or DDR4 buffer memory directly from the FPGA, eliminating external bridge chips. With proper medical-grade design practices, the 10AS032H3F34E2SG serves as the compute core for portable and mid-tier imaging systems.
Recommandé
Protocol Bridging and Industrial Networking
Industrial gateways benefit from the 10AS032H3F34E2SG's combination of FPGA-accelerated protocol conversion and the ARM Cortex-A9 HPS running a Linux or RTOS control plane. The FPGA fabric implements deterministic EtherCAT, PROFINET, or TSN endpoints with sub-microsecond jitter, while the HPS hosts the application logic, OPC-UA server, and cloud connectivity. Integrated multi-gigabit transceivers enable 10G uplinks without external PHY chips. The wide operating temperature range and robust BGA package suit industrial cabinet mounting where mechanical and thermal stress is significant.
Recommandé
Embedded Compute and Edge Acceleration
For edge-compute nodes requiring hardware acceleration of AI inference, video transcoding, or sensor-fusion pipelines, the 10AS032H3F34E2SG delivers 320K logic elements plus dual ARM Cortex-A9 cores to handle control-plane and data-plane workloads simultaneously. The FPGA fabric accelerates CNN layers, FFT pipelines, and custom DSP kernels while the HPS runs the application framework, file system, and network stack. The integrated transceivers connect to high-speed sensors and backhaul links, and the DDR4 controller supports large working-set memories for batch processing. The SoC integration reduces board complexity and power compared to discrete CPU + FPGA designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AS032H3F34E2SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AS032H3F34E2LG | 10AS032H3F34I2SG | 10AS032H2F34E2SG | 10AS032H2F34E2LG | 10AS032H1F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FBGA, FC (35x35 mm) | 1152-ball FBGA, FC (35x35 mm) - same | 1152-ball FBGA, FC (35x35 mm) - same | 1152-ball FBGA, FC (35x35 mm) - same | 1152-ball FBGA, FC (35x35 mm) - same | 1152-ball FBGA, FC (35x35 mm) - same |
| Speed Grade | H3 | H3 | H3 | H2 | H2 | H1 |
| Temperature Grade | E2 (industrial) | E2 (industrial) | I2 (industrial) | E2 (industrial) | E2 (industrial) | E1 (industrial) |
| Ball Finish | SG (SnPb) | LG (lead-free) | SG (SnPb) | SG (SnPb) | LG (lead-free) | HG (lead-free) |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| HPS Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Max Core Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | ~1.4 GHz (H2 bin) | ~1.4 GHz (H2 bin) | ~1.3 GHz (H1 bin) |
Principaux différenciateurs
- Speed grade H3 bin delivers the highest Fmax in the Arria 10 SX F34 family (vs 10AS032H2F34E2SG)
- Dual ARM Cortex-A9 HPS integrated with 320K LE FPGA fabric in a single SoC (vs 10AS032H3F34E2LG)
- 1152-ball FCBGA package supports 17.4 Gbps transceivers and DDR3/DDR4 interfaces (vs Cyclone 10 GX)
Notes de conception
Estimated: At typical 40-60% logic utilization plus active HPS and 8 transceivers, the 10AS032H3F34E2SG draws approximately 15-22 W. Plan a multi-rail supply: 0.85V core, 1.1V HPS, 1.5V DDR, 2.5V aux, plus the 1.8V/3.3V I/O bank voltages. Use the Quartus Prime PowerPlay early estimator before committing to PCB stackup. Place bulk ceramic capacitors within 5 mm of each BGA power pin pair to suppress transient droop.
The 1152-ball FCBGA package has a typical junction-to-ambient theta-JA of approximately 8-12 C/W with proper PCB thermal design, but this requires a 12-layer or thicker PCB with a continuous ground plane and thermal vias under the die. Without these, junction temperature can exceed 100C and trigger thermal throttling. For sustained high utilization, attach a heat sink with thermal interface material rated for the package's 35x35 mm footprint. Junction temperature must stay below 100C for industrial-grade operation.
The 1.0 mm pitch 1152-ball BGA requires HDI PCB fabrication with microvias and a 12-layer or thicker stackup for signal-integrity compliance. Match-length all DDR3/DDR4 traces within the channel skew tolerance (typically 25 ps for DDR4), and use 100-ohm differential routing for SERDES lanes. The HPS boot configuration requires a dedicated QSPI or SD card interface routed on inner signal layers with proper decoupling on the boot power rail.
Do not confuse speed grades: H3 is fastest, H2 is mid-bin, H1 is slowest; substituting a lower grade after PCB fab typically fails timing closure. Always validate the chosen part's pinout against the current Quartus pin-out file before tape-out, as Intel occasionally revises pin assignments. Ensure the HPS boot mode strapping resistors are correctly set before first power-up, or the device may not boot. Finally, verify that any third-party IP cores support the specific Arria 10 SX device ID.
Informations de conformité
SG suffix denotes SnPb ball finish; LG/HG variants are lead-free. RoHS compliance refers to overall product - verify ball-finish code for RoHS-strict assemblies. AEC-Q100 is not applicable as Arria 10 SX is not an automotive-qualified part.
