10AS032H1F34E1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel (Altera)
MPN: 10AS032H1F34E1HG β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2237.25 | $2,237.25 |
| 10 | $2150.5 | $21,505.00 |
| 100 | $1985 | $198,500.00 |
| 250 | $1860 | $465,000.00 |
| 500 | $1755 | $877,500.00 |
Drop-in alternatives for 10AS032H1F34E1HG β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10AS032H1F34E2HG
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10AS032H1F34E3HG
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10AS032H1F34I1HG
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$2077.26 / Unit
View Datasheet β10AS032H1F34I2HG
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10AS032H1F34I3HG
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10AS032H1F34E1HG Maximum Ratings & Electrical Characteristics
| Device Family | Arria 10 SX |
| Architecture | 20nm SoC FPGA (FPGA + hard ARM Cortex-A9 subsystem) |
| Logic Elements | 320,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| On-chip Memory | Approx. 21 Mb (M20K blocks) |
| Transceivers | Up to 24 channels, up to 17.4 Gbps |
| DSP Blocks | Variable-precision hardened DSP with floating-point |
| Hard Memory Controllers | DDR4 up to 2133 Mbps, DDR3, QDRII+, RLDRAM3 |
| PCIe Hard IP | PCIe Gen3 x8 |
| Package | 1152-ball FCBGA (35 x 35 mm) |
| Operating Temperature (E1 suffix) | 0C to +100C (extended) |
| Mounting Type | Surface Mount, flip-chip BGA |
| RoHS Status | Compliant |
| Pin/Ball Count | 1152 |
10AS032H1F34E1HG 1152-ball fcbga (35 x 35 mm) Pin Configuration Guide
Complete pinout information for 10AS032H1F34E1HG (1152-ball fcbga (35 x 35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H1F34E1HG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H1F34E1HG is suitable for 6 applications: Wireless Baseband Processing, Software-Defined Radio (SDR) Platforms, Test and Measurement Instrumentation, Broadcast Video Processing, Industrial Machine Vision, Defense Signal Intelligence.
Wireless Baseband Processing
The 10AS032H1F34E1HG's combination of approximately 320K logic elements and hardened floating-point DSP blocks makes it well suited for wireless baseband signal processing. Its 17.4 Gbps transceivers connect directly to RF ADCs/DACs and JESD204B/C interfaces, while the dual-core ARM Cortex-A9 HPS running at 1.5 GHz handles the MAC layer and protocol stack under Linux. The device sustains LTE and 5G NR physical-layer workloads at line rate, replacing discrete DSP + MCU architectures with a single SoC FPGA. AXI-coherent access between HPS and FPGA fabric eliminates DMA bottlenecks common in two-chip designs.
Recommended
Software-Defined Radio (SDR) Platforms
The 10AS032H1F34E1HG is a workhorse for high-performance SDR platforms where reconfigurability across waveforms (LTE, Wi-Fi, custom OFDM) is essential. Its 24 transceivers support multiple antennas and RF chains simultaneously, while the FPGA fabric runs FFTs, channelizers, and modulators in real time. The HPS boots a Linux SDR stack (GNU Radio, custom frameworks) and exchanges samples with the fabric over the AXI/ACP bridge. Designers value the device's PCIe Gen3 x8 endpoint for host coupling in test and measurement chassis.
Recommended
Test and Measurement Instrumentation
For oscilloscopes, signal analyzers, and protocol testers, the 10AS032H1F34E1HG delivers the parallel logic capacity to capture and process multi-gigasample-per-second ADC data streams. Its 21 Mb of M20K memory buffers long acquisitions, while the FPGA fabric implements custom trigger logic and decoders. The Cortex-A9 HPS manages the user interface, display, and Ethernet/USB connectivity, running an embedded OS for instrument control. Compared with discrete FPGA + processor designs, this single-chip approach shrinks PCB area and reduces BOM cost in high-channel-count instruments.
Recommended
Broadcast Video Processing
The 10AS032H1F34E1HG accelerates broadcast video workloads including 4K/8K upconversion, frame-rate conversion, and HDR mapping. Its DSP blocks implement scaling and color-space conversion pipelines, while H.265/HEVC codecs run in the FPGA fabric for real-time contribution encoding. The ARM HPS manages IP transport streams (SMPTE 2022, SMPTE 2110) over Ethernet and orchestrates channel playout. The 1.5 GHz Cortex-A9 also handles captioning and graphics overlay, replacing separate control MCUs.
Recommended
Industrial Machine Vision
In factory automation and inspection systems, the 10AS032H1F34E1HG performs real-time image processing on multiple high-resolution camera streams. Its transceivers accept MIPI CSI-2, CoaXPress, or GigE Vision inputs, while the FPGA fabric runs convolution, edge detection, and AI inference accelerators. The Cortex-A9 HPS hosts a Linux-based vision stack (OpenCV, ROS 2) and drives EtherCAT or PROFINET industrial Ethernet to coordinate with PLCs and robots. The extended industrial temperature grade (E1) supports factory-floor environments from 0C to +100C.
Recommended
Defense Signal Intelligence
The 10AS032H1F34E1HG is widely adopted in electronic-warfare and signals-intelligence systems where wideband capture and real-time demodulation are critical. Its 17.4 Gbps transceivers digitize GHz-bandwidth RF directly, the FPGA fabric runs channelizers and demodulators at full rate, and the HPS coordinates spectrum scanning and recording. The 1152-ball FCBGA's high pin count supports the dense digital I/O needed for multi-channel RF front ends, and the device's security features (AES, secure boot) protect classified waveforms. Its mature ecosystem and long-life program status make it a low-risk choice for defense platforms.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H1F34E1HG β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H1F34E2HG | 10AS032H1F34E3HG | 10AS032H1F34I1HG | 10AS032H1F34I2HG | 10AS032H1F34I3HG |
|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA (35x35) | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same | 1152-ball FCBGA (35x35) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 320K | 320K | 320K | 320K | 320K | 320K |
| Hard Processor System | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz |
| Operating Temperature | 0C to +100C (E1) | 0C to +100C (E2) | 0C to +100C (E3) | -40C to +100C (I1) | -40C to +100C (I2) | -40C to +100C (I3) |
| Transceivers (max) | 24 ch up to 17.4 Gbps | 24 ch up to 17.4 Gbps | 24 ch up to 17.4 Gbps | 24 ch up to 17.4 Gbps | 24 ch up to 17.4 Gbps | 24 ch up to 17.4 Gbps |
| Lead-Free / RoHS | Yes (HG suffix) | Yes (HG suffix) | Yes (HG suffix) | Yes (HG suffix) | Yes (HG suffix) | Yes (HG suffix) |
Key Differentiators
- Same silicon as 1152-ball FCBGA family siblings across temperature grades (vs 10AS032H1F34I3HG)
- Higher pin count than 780-ball BGA siblings, supporting more transceiver channels and wider memory interface (vs 10AS032E4F29I3SG)
- Dual-core ARM Cortex-A9 HPS integrated on die (vs Logic-only Arria 10 GX parts)
Design Notes
The 1152-ball FCBGA requires an HDI PCB with microvia stack-ups and matched-length routing for high-speed transceivers. Use the Arria 10 pin connection guidelines to assign power-pin decoupling: bulk caps within 50 mils of the pin, plus 0.1 uF and 0.01 uF ceramics at each power pin per the Intel FPGA power delivery network design guide. Estimated via-in-pad microvia count exceeds 1,000; expect 8-12 layer stack-up with buried capacitance.
Estimated: at full FPGA fabric utilization (320K LE, ~85% toggle rate) plus active HPS, expect 12-18 W power dissipation. The 35x35 mm FCBGA package has theta_JA around 8-12 C/W with a properly designed heatsink; without a heatsink, junction temperature can exceed 100C in still air. Use a thermal interface material rated for the package height, and consider a clip-mounted heatsink per the Arria 10 thermal design guide.
Do not assume all 10AS032H1F34 variants are drop-in: only same-suffix code (E1/E2/E3 or I1/I2/I3 in F34) parts share the identical pinout. The 10AS032E4F29I3SG and similar 780-ball BGA siblings share silicon but use a different footprint and are NOT pin-compatible. Always verify the order code against the Arria 10 device handbook before PCB respin.
Transceiver channels up to 17.4 Gbps require strict impedance control (100 ohm differential with 5% tolerance) and length matching within the budget published in the Arria 10 transceiver user guide. Keep AC-coupling capacitors within 200 mils of the FPGA pin, and isolate high-speed transceiver regions from the HPS peripherals and DDR4 interfaces with a solid ground plane to minimize crosstalk and EMI.
Compliance Information
Lead-free / RoHS-compliant per the HG suffix in the order code. AEC-Q100 not qualified (industrial-grade part); for automotive applications use an explicitly qualified Intel FPGA part. REACH, halogen-free, and conflict-minerals status not explicitly stated in the verified distributor data.
