10AS048H4F34I3LG - Arria 10 SX SoC FPGA 480K LE | Intel
MPN: 10AS048H4F34I3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5200 | $5,200.00 |
| 10 | $4950 | $49,500.00 |
| 100 | $4600 | $460,000.00 |
| 250 | $4380 | $1,095,000.00 |
| 500 | $4150 | $2,075,000.00 |
| 1,000 | $3920 | $3,920,000.00 |
Drop-in alternatives for 10AS048H4F34I3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS048H4F34E3LG
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View Datasheet →10AS048H4F34E3SG
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View Datasheet →10AS048H2F34I2SG
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View Datasheet →10AS048H4F34I3LG Maximum Ratings & Electrical Characteristics
| Device Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Hard Processor System Frequency | Up to 1.5 GHz |
| Package | 1152-ball FCBGA (F34) |
| Package Size | 35 x 35 mm |
| Process Technology | 20 nm |
| Operating Temperature | Industrial grade |
| Mounting Type | Surface Mount (BGA) |
| Supply Voltage - Minimum | 0.87 V (core, per Intel DB) |
| Memory Controller | Hardened DDR4/DDR3/LPDDR3/QDRII+/RLDRAM3 controller |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10AS048H4F34I3LG 35 x 35 mm Pin Configuration Guide
Complete pinout information for 10AS048H4F34I3LG (35 x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048H4F34I3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048H4F34I3LG is suitable for 6 applications: Software-Defined Radio Baseband, Industrial Machine Vision, Real-Time Motor and Motion Control, Military and Aerospace Signal Intelligence, Medical Imaging and Diagnostics, High-Speed Networking and Packet Processing.
Software-Defined Radio Baseband
The 10AS048H4F34I3LG is well-suited to software-defined radio baseband processing where the dual ARM Cortex-A9 cores handle protocol stacks and scheduling while the FPGA fabric executes FFT, channelization, and demodulation pipelines. With 480K logic elements and embedded DSP blocks, the device can implement multi-carrier LTE or 5G NR physical-layer processing at baseband. The integrated transceiver array supports multi-gigabit serial links to RF front-end ADCs and DACs. Using the HPS, engineers run embedded Linux with real-time extensions to manage MAC scheduling, while the FPGA accelerates DSP kernels at deterministic throughput. Compared with pure-software approaches, the heterogeneous compute architecture reduces latency by an order of magnitude.
Recommended
Industrial Machine Vision
In machine-vision and automated optical inspection systems, the 10AS048H4F34I3LG combines high-speed image-sensor interfaces with FPGA-accelerated pre-processing. The HPS runs the vision-application software stack (OpenCV, TensorFlow Lite) while the FPGA fabric executes real-time Bayer demosaic, edge detection, and feature extraction at line rate. The 480K LE fabric supports simultaneous processing of multiple 4K sensor streams. Hardened memory controllers drive DDR4 buffers for frame storage, and integrated transceivers stream results to centralized servers. Compared with CPU-only designs, the SoC FPGA reduces per-frame latency by 5-10x and enables deterministic sub-millisecond response for in-line factory QA systems.
Recommended
Real-Time Motor and Motion Control
The dual Cortex-A9 cores in the 10AS048H4F34I3LG handle motion trajectory planning and supervisory control loops while the FPGA fabric executes deterministic current, velocity, and position loops at multi-MHz rates. The 480K LEs support multi-axis field-oriented control of up to 8 servos simultaneously, with hard DSP blocks delivering sub-microsecond PID update periods. Industrial temperature grade (the I3 designation) supports operation in factory environments from -40C to +100C. The hardened memory controllers and integrated transceivers enable EtherCAT, PROFINET, or SERCOS III industrial networking. Compared with microcontroller-based motor controllers, this SoC FPGA scales to multi-axis robotics with deterministic jitter below 100 ns.
Recommended
Military and Aerospace Signal Intelligence
The 10AS048H4F34I3LG supports signal-intelligence and electronic-warfare applications requiring FPGA-accelerated wideband DSP plus ARM-based mission software. With 480K logic elements, the device implements digital down-conversion, pulse compression, and direction-finding algorithms at multi-GSPS sample rates. The HPS runs security-hardened operating systems and crypto stacks while the FPGA executes real-time SIGINT kernels. The 20 nm process delivers high performance-per-watt, which is critical for size-, weight-, and power-constrained platforms. Integrated transceivers accept direct RF-ADC data streams and drive high-speed recording or networking links.
Recommended
Medical Imaging and Diagnostics
In ultrasound, CT, and MRI systems, the 10AS048H4F34I3LG provides FPGA-accelerated beamforming and image reconstruction alongside ARM-based patient-interface and display software. The 480K LEs and DSP blocks support real-time beamformed channel processing at 64-256 channels simultaneously. The HPS handles DICOM networking, user interface, and database access while the FPGA does pixel-rate image rendering. The industrial temperature grade supports medical equipment operating rooms. Compared with discrete CPU + GPU architectures, the integrated SoC reduces BOM cost and PCB area by 40-60% while delivering deterministic image latency.
Recommended
High-Speed Networking and Packet Processing
The 10AS048H4F34I3LG enables line-rate packet processing at 100G and beyond in network switches, routers, and security appliances. The integrated multi-gigabit transceivers interface directly with QSFP28 optical modules, while the FPGA fabric executes packet parsing, classification, and deep-packet inspection. The dual Cortex-A9 cores run control-plane protocols (BGP, OSPF) and management software. The hardened DDR4 memory controllers buffer packets at line rate. Compared with merchant-silicon switch ASICs, this SoC FPGA delivers full programmability for custom protocol support and proprietary features while maintaining multi-gigabit throughput.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048H4F34I3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048H4F34E3LG | 10AS048H3F34I2SG | 10AS048H2F34I2LG | 10AS032H4F34I3LG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA (F34) 35x35 mm | 1152-FCBGA (F34) 35x35 mm - same | 1152-FCBGA (F34) 35x35 mm - same | 1152-FCBGA (F34) 35x35 mm - same | 1152-FCBGA (F34) 35x35 mm - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 320,000 |
| Speed Grade | H4 (fastest) | H4 | H3 (one step slower) | H2 (slower) | H4 |
| Temperature Grade | Industrial (I3) | Extended (E3) | Industrial (I2) | Industrial (I2) | Industrial (I3) |
| ARM Cortex-A9 Cores | 2 | 2 | 2 | 2 | 2 |
| HPS Max Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Single-Unit Price (USD) | 5200 | 5300 (estimated) | 4950 (estimated) | 4700 (estimated) | 3500 (estimated) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Key Differentiators
- Highest speed grade available in 480K LE Arria 10 SX F34 package (vs 10AS048H3F34I2SG)
- Maximum density for the F34 footprint (vs 10AS032H4F34I3LG)
- Industrial temperature grade support (vs 10AS048H4F34E3SG)
Design Notes
The 1152-ball FCBGA at 35x35 mm requires a high-layer-count PCB (at least 12 layers) with microvia stack-ups. BGA escape routing demands 0.4-0.5 mm trace pitch, so-called HDI (High-Density Interconnect) construction. Designers should follow Intel's Arria 10 SX board design guidelines for via-in-pad, decoupling capacitor placement, and reference-plane stitching to ensure signal-integrity compliance. Failure to use proper stack-up will cause power-supply noise coupling into transceiver channels and timing-margin loss on DDR interfaces.
Estimated: At full FPGA and HPS utilization, the 10AS048H4F34I3LG can dissipate 15-25 W. Without a heat spreader or heatsink, junction temperature can exceed 100 C in enclosed industrial enclosures. Engineers should use the Quartus Prime Early Power Estimator (EPE) tool to model activity-factor-based dissipation, and select a thermal solution rated for at least 30 W continuous. Industrial-grade parts must stay below the 100 C junction limit for long-term reliability per Intel's reliability datasheet.
Common pitfalls when designing with the 10AS048H4F34I3LG include: (1) omitting the required POR (power-on-reset) sequencing circuit for the HPS and FPGA rails; (2) failing to assign the MSEL pins for the desired configuration mode, leading to factory-default Quad SPI boot; (3) using LPDDR2 instead of LPDDR3 or DDR4 in the memory interface, which is not supported on Arria 10 SX. Designers should reference the Arria 10 SX pin connection guidelines and Pin-Out File (POF) early in the schematic capture cycle.
Compliance Information
RoHS compliant per Intel product page. Halogen-free status not explicitly confirmed in the verified web data - marked as DATA_NEEDED.
