10AX090U2F45E1SG - Arria 10 GX 900K LE FPGA | Intel | 1932-FCBGA
MPN: 10AX090U2F45E1SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7250 | $7,250.00 |
| 10 | $6900 | $69,000.00 |
| 100 | $6450 | $645,000.00 |
| 250 | $6180 | $1,545,000.00 |
| 500 | $5895 | $2,947,500.00 |
Drop-in alternatives for 10AX090U2F45E1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090U1F45E1SG
✅ Drop-In✓ In Stock
$8750 / Unit
View Datasheet →10AX090U1F45I1SG
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View Datasheet →10AX090U2F45I1SG
✅ Drop-In✓ In Stock
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View Datasheet →10AX090N2F45E1SG
✅ Drop-In✓ In Stock
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View Datasheet →10AX090S2F45E1SG
✅ Drop-In✓ In Stock
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View Datasheet →10AX090U2F45E1SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory | 59,234,304 bits (~28.05 Mbit) |
| User I/O Pins | 480 |
| Transceiver Channels | Up to 24 |
| Max Transceiver Data Rate | 17.4 Gbps (chip-to-chip) |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Package | 1932-BBGA, FCBGA |
| Package Code | F45 (45x45 mm) |
| Operating Temperature Grade | Industrial (E1) |
| Mounting Type | Surface Mount (BGA) |
| Hard IP | PCIe Gen3, memory controllers |
10AX090U2F45E1SG f45 (45x45 mm) Pin Configuration Guide
Complete pinout information for 10AX090U2F45E1SG (f45 (45x45 mm) package) with 480 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090U2F45E1SG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 480 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090U2F45E1SG is suitable for 7 applications: 4K Video Broadcasting and Processing, Wireless Baseband and 5G Infrastructure, Software Defined Radio (SDR), ASIC Prototyping and Emulation, Medical Imaging Acceleration, High-Speed Data Acquisition and Test Equipment, Defense and Radar Signal Processing.
4K Video Broadcasting and Processing
The 10AX090U2F45E1SG is ideal for 4K video broadcast equipment where 900K logic elements and 28 Mbit embedded memory enable real-time video processing pipelines. Its 24 transceiver channels at 17.4 Gbps carry uncompressed 4K video over SDI or Ethernet, while 480 user I/O pins interface HDMI, DisplayPort, and audio subsystems. The hardened floating-point DSP blocks accelerate color-space conversion and HDR tone-mapping at line rate.
Recommended
Wireless Baseband and 5G Infrastructure
The 10AX090U2F45E1SG's 900K logic elements and 3,378-class DSP block count deliver sufficient compute for LTE/5G baseband PHY processing, including channel coding, FFT/iFFT, and MIMO detection. Its up to 24 transceivers at 17.4 Gbps support CPRI and JESD204B/C fronthaul links to radio units. The 1932-ball F45 FCBGA provides the routing density needed for high-lane-count antenna interfaces.
Recommended
Software Defined Radio (SDR)
For SDR platforms, the 10AX090U2F45E1SG pairs wideband ADC/DAC interfaces via its 17.4 Gbps transceivers with on-chip DSP resources sufficient for digital down-conversion, filtering, and demodulation across multiple channels simultaneously. The 59 Mbit embedded memory buffers IQ samples at high sample rates without external SRAM, reducing BOM cost and latency. PCIe Gen3 hard IP simplifies integration with host processors.
Recommended
ASIC Prototyping and Emulation
The 10AX090U2F45E1SG with 900K logic elements and 480 user I/O pins is well-suited for prototyping large ASIC designs, especially those with multi-gigabit serial interfaces. Quartus Prime's incremental compilation and partition-based debug flow let teams map an ASIC RTL across one or more FPGAs. The F45 FCBGA package's signal-integrity characteristics preserve timing closure at high clock rates.
Recommended
Medical Imaging Acceleration
Medical imaging systems (ultrasound, CT, MRI reconstruction) require dense DSP and high-bandwidth memory access - exactly what the 10AX090U2F45E1SG provides. Its floating-point DSP blocks accelerate beamforming and back-projection algorithms, while 28 Mbit of embedded memory holds working datasets close to compute. Industrial temperature grading (E1) supports use in clinical equipment enclosures.
Recommended
High-Speed Data Acquisition and Test Equipment
Test and measurement instruments (digitizers, protocol analyzers, ATE) leverage the 10AX090U2F45E1SG's 24 transceivers to capture multi-channel high-speed data and its DSP fabric for real-time triggering and analysis. The 0.9V core and 20nm process yield better power efficiency than previous-generation Arria V devices, important for densely-packed PXI/AXIe instruments.
Recommended
Defense and Radar Signal Processing
Radar preprocessing chains (pulse compression, MTI, beamforming) map efficiently onto the 10AX090U2F45E1SG's hardened DSP blocks. The Arria 10 GX family meets the throughput and latency requirements for phased-array radar while the F45 FCBGA package's rugged construction suits deployed military hardware. Multiple transceiver channels connect directly to ADC/DAC front-ends.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090U2F45E1SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090U1F45E1SG | 10AX090U1F45I1SG | 10AX090U2F45I1SG | 10AX090N2F45E1SG | 10AX090S2F45E1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-BBGA, FCBGA (F45, 45x45 mm) | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory | 59,234,304 bits (~28.05 Mbit) | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits |
| User I/O Pins | 480 | 480 | 480 | 480 | 480 | 480 |
| Speed Grade | 2 | 1 (slower) | 1 | 2 | 2 | 2 |
| Temperature Grade | Extended (E1) | Extended (E1) | Industrial (I1) | Industrial (I1) | Extended (E1) | Extended (E1) |
| Transceiver Tier | U2 (highest count) | U1 | U1 | U2 | N2 (reduced) | S2 (reduced) |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Key Differentiators
- Highest transceiver tier within the 10AX090 F45 family (vs 10AX090N2F45E1SG)
- Extended temperature grade (E1) for harsher environments (vs 10AX090U2F45I1SG)
- Speed grade 2 balances timing margin and cost (vs 10AX090U1F45E1SG)
Design Notes
Estimated: The 10AX090U2F45E1SG in a 1932-ball FCBGA can dissipate 25-40W under full utilization. With a typical theta_JA of 8-12 C/W on a standard 8-layer PCB, junction temperature can rise 200-400C above ambient without thermal management. A heatsink with thermal interface material, plus internal PCB copper planes bonded to BGA thermal balls, is required for reliable operation. Use Quartus Prime's PowerPlay analyzer to estimate power before finalizing thermal design.
Route all 24 high-speed transceivers with controlled impedance (100 ohm differential) and matched length within each transceiver group. Use the Arria 10 GX pin connection guidelines for via count and antipad dimensions. Decouple every power rail with a combination of bulk, ceramic, and high-frequency capacitors placed within 100 mils of the relevant BGA balls. The 0.9V core rail requires at least 4-6 low-ESR ceramic caps per device.
Maintain at least 4 PCB layers with dedicated ground and power planes. Place configuration flash memory within 2 inches of the FPGA configuration pins to ensure signal integrity for MSEL/AS_DATA signals. Separate analog and digital grounds if the design mixes RF transceivers with baseband logic. Use Intel's board design guidelines for the F45 package to determine breakout via pattern and escape routing topology.
Do not confuse the Arria 10 GX (10AX) with Arria V (10AS) or Cyclone 10 families - pinouts are not compatible even in the same package code. Confirm the exact ordering code matches your Quartus Prime device selection before PCB fab. Also, the 'U'/'N'/'S' transceiver tier letter is a fabric-level choice; verify the number of active transceiver channels matches your IP usage.
For 17.4 Gbps transceivers, use Megtron 6 or equivalent low-loss PCB material with a smooth copper profile. Simulate channels with the Arria 10 GX transceiver IBIS-AMI models before committing to PCB fab. Pre-emphasis and equalization settings in Quartus Prime can compensate for moderate channel loss, but excessive loss forces a re-spin.
Compliance Information
RoHS and lead-free compliance per Intel/Altera product page. AEC-Q100 not applicable (this is an FPGA IC, not an automotive-grade qualified component).
