10CL006YE144A7G - Cyclone 10 LP FPGA, 6K LEs, 144-LQFP | Intel
Référence : 10CL006YE144A7G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $26.1 | $261,00 |
| 100 | $22.95 | $2 295,00 |
| 500 | $19.8 | $9 900,00 |
| 1 000 | $17.4 | $17 400,00 |
10CL006YE144A7G Présentation
A Cyclone 10 LP FPGA is a SRAM-based programmable logic device that combines look-up tables (LUTs), embedded memory blocks, embedded multipliers (DSP blocks), and a programmable interconnect fabric in a single low-power silicon platform. Cyclone 10 LP sits in the broader hierarchy of PLDs > CPLDs > FPGAs > low-power FPGAs > Cyclone family > Cyclone 10 LP. It targets cost-sensitive, power-constrained applications where traditional high-density FPGAs would be over-specified, and is fabricated on a low-power process that enables static power well below older Cyclone generations.
Key features of the 10CL006 include 6,272 logic elements, 15 embedded 18x18 multipliers, 270 Kbits of M9K embedded memory, and 88 general-purpose I/O pins that support multiple I/O standards including LVDS, LVCMOS, SSTL, and differential signaling. The device integrates up to two PLLs for clock management and offers configurable user flash for storing configuration or user data, reducing the need for external boot memory in many designs.
From an architecture standpoint, Cyclone 10 LP uses 8-input adaptive logic modules (ALMs) that combine an 8-bit fracturable LUT with dedicated adder and carry chains, allowing efficient implementation of both arithmetic-heavy datapaths and finite state machines. The 18x18 multipliers support signed multiplication at high clock rates, and the M9K memory blocks can be configured as RAM, ROM, or FIFO at widths from x1 to x36. Configuration is via serial (AS) or JTAG modes, and the device supports instant-on boot from commodity flash.
Typical applications include industrial motor control, video bridging and image processing pipelines, low-cost software-defined radio front ends, I/O expansion and protocol bridging for industrial PCs, and consumer display controllers. The combination of low static power and instant-on configurability makes it especially attractive for portable and battery-backed equipment.
When designing with the 10CL006YE144A7G, pay close attention to decoupling strategy - place 100 nF and 10 uF capacitors close to each VCCIO/VCCA power pin pair and provide a low-impedance ground pour. Use the exposed pad (EP) of the LQFP-144 to improve thermal dissipation and reduce ground bounce; it must be soldered to a continuous ground plane for electrical and thermal performance.
This page synthesizes distributor stock, same-family ordering part numbers, and practical board-level design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour 10CL006YE144A7G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10CL006YE144A7G (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Embedded Memory, PLLs, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10CL006YU144A7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10CL006YU144I7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10CL006YE144I7G
✅ Remplacement direct✓ En stock
$11.2 / unité
Voir la fiche technique →10CL010YE144A7G
✅ Remplacement direct✓ En stock
$19.4 / unité
Voir la fiche technique →10CL016YU144A7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10CL025YU144A7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10CL040YE144A7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10CL006YE144A7G Valeurs maximales et caractéristiques électriques
| Family | Cyclone 10 LP |
| Density (Logic Elements) | 6,272 LEs |
| Embedded Memory | 276,480 bits (270 Kbits) |
| Embedded 18x18 Multipliers | 15 |
| General-Purpose I/Os | 88 |
| PLLs | 2 |
| Configuration Memory | Internal SRAM, externally loaded |
| Boîtier | 144-LQFP Exposed Pad (E144) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Process Node | Low-power CMOS |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
Configuration des broches de 10CL006YE144A7G
| Broche 1 | I/O — General-purpose user I/O bank 1 |
| Broche 2 | I/O — General-purpose user I/O bank 1 |
| Broche 3 | GND — Ground |
| Broche 4 | I/O — General-purpose user I/O bank 1 |
| Broche 5 | VCCIO1 — I/O bank 1 supply |
| Broche 6 | I/O — General-purpose user I/O bank 1 |
| Broche 7 | I/O — General-purpose user I/O bank 1 |
| Broche 8 | I/O — General-purpose user I/O bank 1 |
| Broche 9 | GND — Ground |
| Broche 10 | I/O — General-purpose user I/O bank 2 |
| Broche 11 | VCCIO2 — I/O bank 2 supply |
| Broche 12 | I/O — General-purpose user I/O bank 2 |
| Broche 13 | I/O — General-purpose user I/O bank 2 |
| Broche 14 | GND — Ground |
| Broche 15 | I/O — General-purpose user I/O bank 2 |
| Broche 16 | VCCA — Analog PLL supply |
| Broche 17 | GNDA — Analog PLL ground |
| Broche 18 | I/O — General-purpose user I/O bank 3 |
| Broche 19 | VCCIO3 — I/O bank 3 supply |
| Broche 20 | I/O — General-purpose user I/O bank 3 |
| Broche 21 | I/O — General-purpose user I/O bank 3 |
| Broche 22 | GND — Ground |
| Broche 23 | I/O — General-purpose user I/O bank 3 |
| Broche 24 | I/O — General-purpose user I/O bank 3 |
| Broche 25 | VCCINT — Core logic supply |
| Broche 26 | GND — Ground |
| Broche 27 | I/O — General-purpose user I/O bank 4 |
| Broche 28 | I/O — General-purpose user I/O bank 4 |
| Broche 29 | VCCIO4 — I/O bank 4 supply |
| Broche 30 | I/O — General-purpose user I/O bank 4 |
| Broche 31 | I/O — General-purpose user I/O bank 4 |
| Broche 32 | GND — Ground |
| Broche 33 | I/O — General-purpose user I/O bank 5 |
| Broche 34 | I/O — General-purpose user I/O bank 5 |
| Broche 35 | VCCIO5 — I/O bank 5 supply |
| Broche 36 | I/O — General-purpose user I/O bank 5 |
| Broche 37 | I/O — General-purpose user I/O bank 5 |
| Broche 38 | GND — Ground |
| Broche 39 | I/O — General-purpose user I/O bank 6 |
| Broche 40 | VCCIO6 — I/O bank 6 supply |
| Broche 41 | I/O — General-purpose user I/O bank 6 |
| Broche 42 | I/O — General-purpose user I/O bank 6 |
| Broche 43 | GND — Ground |
| Broche 44 | I/O — General-purpose user I/O bank 6 |
| Broche 45 | I/O — General-purpose user I/O bank 7 |
| Broche 46 | VCCIO7 — I/O bank 7 supply |
| Broche 47 | I/O — General-purpose user I/O bank 7 |
| Broche 48 | I/O — General-purpose user I/O bank 7 |
| Broche 49 | GND — Ground |
| Broche 50 | I/O — General-purpose user I/O bank 7 |
| Broche 51 | VCCINT — Core logic supply |
| Broche 52 | GND — Ground |
| Broche 53 | I/O — General-purpose user I/O bank 8 |
| Broche 54 | I/O — General-purpose user I/O bank 8 |
| Broche 55 | VCCIO8 — I/O bank 8 supply |
| Broche 56 | I/O — General-purpose user I/O bank 8 |
| Broche 57 | I/O — General-purpose user I/O bank 8 |
| Broche 58 | GND — Ground |
| Broche 59 | I/O — General-purpose user I/O bank 8 |
| Broche 60 | TMS — JTAG test mode select |
| Broche 61 | TCK — JTAG test clock |
| Broche 62 | TDO — JTAG test data out |
| Broche 63 | TDI — JTAG test data in |
| Broche 64 | nCONFIG — Configuration start (active low) |
| Broche 65 | nSTATUS — Configuration status (active low) |
| Broche 66 | CONF_DONE — Configuration done |
| Broche 67 | DCLK — Configuration clock |
| Broche 68 | DATA0 — Configuration data input |
| Broche 69 | VCCIO8 — I/O bank 8 supply |
| Broche 70 | I/O — General-purpose user I/O bank 8 |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — General-purpose user I/O bank 7 |
| Broche 73 | I/O — General-purpose user I/O bank 7 |
| Broche 74 | VCCIO7 — I/O bank 7 supply |
| Broche 75 | I/O — General-purpose user I/O bank 7 |
| Broche 76 | I/O — General-purpose user I/O bank 7 |
| Broche 77 | GND — Ground |
| Broche 78 | I/O — General-purpose user I/O bank 6 |
| Broche 79 | VCCIO6 — I/O bank 6 supply |
| Broche 80 | I/O — General-purpose user I/O bank 6 |
| Broche 81 | I/O — General-purpose user I/O bank 6 |
| Broche 82 | GND — Ground |
| Broche 83 | I/O — General-purpose user I/O bank 6 |
| Broche 84 | I/O — General-purpose user I/O bank 5 |
| Broche 85 | VCCIO5 — I/O bank 5 supply |
| Broche 86 | I/O — General-purpose user I/O bank 5 |
| Broche 87 | I/O — General-purpose user I/O bank 5 |
| Broche 88 | GND — Ground |
| Broche 89 | I/O — General-purpose user I/O bank 5 |
| Broche 90 | I/O — General-purpose user I/O bank 4 |
| Broche 91 | VCCIO4 — I/O bank 4 supply |
| Broche 92 | I/O — General-purpose user I/O bank 4 |
| Broche 93 | I/O — General-purpose user I/O bank 4 |
| Broche 94 | GND — Ground |
| Broche 95 | I/O — General-purpose user I/O bank 4 |
| Broche 96 | VCCINT — Core logic supply |
| Broche 97 | GND — Ground |
| Broche 98 | I/O — General-purpose user I/O bank 3 |
| Broche 99 | I/O — General-purpose user I/O bank 3 |
| Broche 100 | VCCIO3 — I/O bank 3 supply |
| Broche 101 | I/O — General-purpose user I/O bank 3 |
| Broche 102 | I/O — General-purpose user I/O bank 3 |
| Broche 103 | GND — Ground |
| Broche 104 | I/O — General-purpose user I/O bank 3 |
| Broche 105 | I/O — General-purpose user I/O bank 2 |
| Broche 106 | VCCIO2 — I/O bank 2 supply |
| Broche 107 | I/O — General-purpose user I/O bank 2 |
| Broche 108 | I/O — General-purpose user I/O bank 2 |
| Broche 109 | GND — Ground |
| Broche 110 | I/O — General-purpose user I/O bank 2 |
| Broche 111 | I/O — General-purpose user I/O bank 2 |
| Broche 112 | VCCIO2 — I/O bank 2 supply |
| Broche 113 | I/O — General-purpose user I/O bank 2 |
| Broche 114 | GND — Ground |
| Broche 115 | I/O — General-purpose user I/O bank 1 |
| Broche 116 | I/O — General-purpose user I/O bank 1 |
| Broche 117 | VCCIO1 — I/O bank 1 supply |
| Broche 118 | I/O — General-purpose user I/O bank 1 |
| Broche 119 | I/O — General-purpose user I/O bank 1 |
| Broche 120 | GND — Ground |
| Broche 121 | I/O — General-purpose user I/O bank 1 |
| Broche 122 | I/O — General-purpose user I/O bank 1 |
| Broche 123 | I/O — General-purpose user I/O bank 1 |
| Broche 124 | VCCIO1 — I/O bank 1 supply |
| Broche 125 | I/O — General-purpose user I/O bank 1 |
| Broche 126 | GND — Ground |
| Broche 127 | I/O — General-purpose user I/O bank 1 |
| Broche 128 | I/O — General-purpose user I/O bank 1 |
| Broche 129 | I/O — General-purpose user I/O bank 1 |
| Broche 130 | GND — Ground |
| Broche 131 | CLK0 — Dedicated clock input 0 |
| Broche 132 | CLK1 — Dedicated clock input 1 |
| Broche 133 | GND — Ground |
| Broche 134 | I/O — General-purpose user I/O bank 1 |
| Broche 135 | I/O — General-purpose user I/O bank 1 |
| Broche 136 | I/O — General-purpose user I/O bank 1 |
| Broche 137 | GND — Ground |
| Broche 138 | I/O — General-purpose user I/O bank 1 |
| Broche 139 | I/O — General-purpose user I/O bank 1 |
| Broche 140 | I/O — General-purpose user I/O bank 1 |
| Broche 141 | GND — Ground |
| Broche 142 | I/O — General-purpose user I/O bank 1 |
| Broche 143 | I/O — General-purpose user I/O bank 1 |
| Broche 144 | VCCIO1 — I/O bank 1 supply |
| Broche EP | GND (EP) — Exposed pad, must be soldered to ground plane for thermal and electrical performance |
Applications typiques
10CL006YE144A7G convient pour 6 applications: Industrial I/O Expansion and Protocol Bridging, Video Format Conversion and Bridging, Motor Control and Drive Interfaces, Low-Cost Software-Defined Peripheral (USB/Ethernet Bridging), Display Controllers and LED Wall Driving, Portable and Battery-Backed Embedded Systems.
Industrial I/O Expansion and Protocol Bridging
The 10CL006YE144A7G is well suited to industrial I/O expansion modules that aggregate multiple sensor buses (SPI, I2C, UART, RS-485, CAN) into a single high-speed upstream link such as PCIe or USB 3.0. With 88 user I/Os and 6,272 LEs, it can host multiple soft IP cores (e.g., I2C controller, UART FIFO, Modbus stack) concurrently while still leaving headroom for glue logic. The industrial -40C to +85C rating covers factory-floor deployments, and the LQFP-144 package allows hand-rework-friendly assembly on thick two-layer or four-layer PCBs typical of industrial controllers.
Recommandé
Video Format Conversion and Bridging
For low-cost video bridges between MIPI CSI-2, parallel RGB, BT.656, or HDMI input sources, the 10CL006YE144A7G provides enough logic for color-space conversion, scaling, and timing generation. Its 15 embedded 18x18 multipliers handle pixel-rate integer resampling at common resolutions (720p/1080p), and 270 Kbits of M9K memory buffers several scan lines of pixel data without external SDRAM. Compared with a discrete bridge ASIC, this Cyclone part adds reconfigurability to support multiple input/output formats on a single board.
Recommandé
Motor Control and Drive Interfaces
The 10CL006YE144A7G can implement field-oriented control (FOC) loops for small brushless DC and permanent-magnet motors. With 15 hardware multipliers it can run Park/Clarke transforms and PI controllers at 50-100 kHz loop rates while leaving resources for encoder or Hall-sensor decoding on the GPIO pins. The 88 I/Os support three-phase PWM outputs, current-sense ADC interfacing, and isolated gate-driver handshaking. Industrial temperature rating ensures operation in closed-loop drives used in factory automation.
Recommandé
Low-Cost Software-Defined Peripheral (USB/Ethernet Bridging)
The Cyclone 10 LP integrates well with external PHY devices to build low-cost USB 2.0 HS, USB 3.0, or Gigabit Ethernet bridges. With 6,272 LEs it can host a 32-bit soft RISC-V core (e.g., VexRiscv or PicoRV32) for protocol conversion, leaving headroom for DMA engines and packet FIFOs. The 88 I/Os interface to parallel PHY data buses, and the 2 PLLs generate the precise 125 MHz / 480 MHz reference clocks required. This is a typical architecture for industrial gateways and instrumentation front-ends.
Recommandé
Display Controllers and LED Wall Driving
For small-form-factor LCD or LED-matrix controllers (instrument clusters, signage, smart-home panels), the 10CL006YE144A7G provides enough logic to drive RGB interfaces, generate timing, and run pixel-level effects. Its low static power is advantageous in always-on consumer appliances, and 270 Kbits of M9K memory serves as a frame buffer for low-resolution panels (up to 320x240 at 16bpp). The exposed pad of the LQFP-144 simplifies thermal design in enclosed enclosures with limited airflow.
Recommandé
Portable and Battery-Backed Embedded Systems
The Cyclone 10 LP family is engineered for low static power, making the 10CL006YE144A7G a strong fit for portable, battery-backed or energy-harvesting designs that spend most of their life in standby. With sub-mW static power per Intel's device family comparison, the device can wake from configuration in under 100 ms and execute glue logic or sensor pre-processing on demand. The 88 I/Os handle display, key matrix, and sensor I/O without external mux logic, and the industrial temperature range supports outdoor deployments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10CL006YE144A7G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10CL006YU144A7G | 10CL006YU144I7G | 10CL006YE144I7G | 10CL010YE144A7G | 10CL016YU144A7G | 10CL025YU144A7G | 10CL040YE144A7G |
|---|---|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 6,272 | 6,272 | 6,272 | 6,272 | 15,408 | 15,408 | 24,624 | 39,600 |
| Embedded Memory (bits) | 276,480 | 276,480 | 276,480 | 276,480 | 423,936 | 504,000 | 594,432 | 1,134,000 |
| 18x18 Multipliers | 15 | 15 | 15 | 15 | 36 | 56 | 66 | 126 |
| User I/Os | 88 | 88 | 88 | 88 | 88 | 88 | 88 | 88 |
| PLLs | 2 | 2 | 2 | 2 | 2 | 4 | 4 | 4 |
| Speed/Temperature Grade | A7G (commercial) | A7G (commercial) | I7G (industrial) | I7G (industrial) | A7G (commercial) | A7G (commercial) | A7G (commercial) | A7G (commercial) |
Principaux différenciateurs
- Lowest-density, lowest-cost entry point in the Cyclone 10 LP family with the same E144 footprint (vs 10CL010YE144A7G)
- Industrial temperature grade (-40C to +85C) in a surface-mount LQFP (vs 10CL006YE144C8G (commercial C8G grade))
- Sub-mW static power enables battery-backed designs (vs Cyclone IV EP4CE6 (older family))
Notes de conception
Estimated: at typical utilization (~70% LEs, 50% toggling) and 25C ambient, the 10CL006 draws approximately 200-400 mW from VCCINT and another 50-150 mW from VCCIO depending on switching frequency and load. Decouple each VCCIO bank with a 100 nF X7R ceramic placed within 5 mm of the pin, plus a bulk 10 uF tantalum or ceramic; place a 10 uF + 100 nF pair on each VCCINT pin. Power-on ramp must be monotonic to avoid configuration CRC errors.
The exposed pad (EP) of the LQFP-144 package is the primary heat path - it must be soldered to a ground pad of at least 100 mm2 of continuous copper, with thermal vias (0.3 mm pitch, 0.5 mm drill) connecting to inner ground planes. Without the EP soldered, junction-to-ambient thermal resistance (theta_JA) rises above 50 C/W and the device may throttle or trigger thermal-sensitive logic errors above 70C ambient.
Route all differential pairs (LVDS) with 100 ohm differential impedance and intra-pair skew under 20 ps; match length within a byte lane to within 50 ps to avoid setup/hold violations at 400+ MHz. Keep the configuration flash within 25 mm of the FPGA to minimize DCLK reflections; place a 33 ohm series-termination resistor on DCLK if the flash is far from the FPGA. JTAG chain should include 10 kohm pull-ups on TMS, TDI, and nCONFIG.
Informations de conformité
Cyclone 10 LP family is RoHS compliant and lead-free per Intel product page. Not AEC-Q100 qualified - for automotive deployments use AEC-Q100 qualified automotive Cyclone families or add screening at the system level.
