Intel

10M08SCE144I7G - MAX 10 FPGA, 8K LE, 144-LQFP | Intel

Référence : 10M08SCE144I7G ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
1.2 V Vdss 144-LQFP Exposed Pad (EQFP-144) Package -7 Speed 387,072 Memory
À partir de $70.2 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-05
Tarifs dégressifs
Qté Prix unitaire Total
1 $96.44 $96,44
10 $89.5 $895,00
100 $82.1 $8 210,00
500 $75.8 $37 900,00
1 000 $70.2 $70 200,00
ℹ️ Tous les prix sont en USD

10M08SCE144I7G Présentation

The Intel (Altera) 10M08SCE144I7G is a non-volatile MAX 10 field-programmable gate array (FPGA) with 8,000 logic elements, 387,072 bits of embedded memory, and 101 user I/O pins, housed in a 144-pin LQFP exposed-pad (EQFP-144) package. It integrates dual-configuration flash, an internal configuration controller, and dual 12-bit analog-to-digital converters, providing single-chip instant-on functionality at 1.2V core voltage. The -7 speed grade and industrial -40C to +100C junction temperature range suit cost-sensitive industrial and consumer designs that need non-volatile logic density.

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnects, embedded memory (block RAM, M9K), DSP blocks, and I/O cells, all of which can be re-programmed after manufacture. FPGAs sit between microcontrollers and ASICs in the design hierarchy, offering parallel hardware execution, deterministic timing, and rapid time-to-market. The MAX 10 family is Intel's smallest, lowest-cost, non-volatile SRAM-based FPGA family, targeted at glue logic, sensor fusion, industrial control, and bridge/replacement of legacy CPLDs. It belongs to the broader programmable logic device (PLD) hierarchy, which includes CPLDs and FPGAs.

Key features of the 10M08SCE144I7G include 8K logic elements (LEs), 414 Kbits embedded SRAM, two 12-bit analog-to-digital converters (ADCs) supporting up to 16 analog inputs, two PLLs, and integrated dual-configuration flash that enables field-upgradable bitstreams without external memory. The exposed-pad package provides thermal dissipation for industrial environments where junction temperatures approach 100C.

The MAX 10 architecture uses an LUT-based logic fabric backed by M9K memory blocks and 18x18 multiplier blocks for digital signal processing. Its non-volatile flash allows instant-on operation in under 10 ms - a critical feature for industrial motor drives and factory-automation subsystems that must respond within milliseconds of power-up without waiting for external configuration loading from SPI flash.

Typical applications include industrial control and machine automation, sensor data acquisition and pre-processing, video bridging and display controllers, communication protocol bridging (I2C/SPI/UART/CAN), motor control, LED lighting controllers, and as a replacement for legacy 5V-tolerant CPLDs in factory-automation backplanes.

When designing with this device, allocate sufficient decoupling capacitance (100 nF near each VCCIO bank plus bulk 10-47 uF) and provide adequate copper pour under the exposed pad to keep junction temperature below 100C. The internal ADC requires clean analog power - route VCCA separately and decouple aggressively to avoid coupling digital switching noise into analog measurements.

This page synthesizes distributor pricing, drop-in compatible MAX 10 / MAX V equivalents, and practical design notes not assembled in the manufacturer datasheet.

Alternatives de remplacement direct pour 10M08SCE144I7G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec 10M08SCE144I7G (même facteur de forme et même empreinte) — différant par Package, Process Technology, Logic Elements (LE), Configuration Memory, Core Voltage.

Intel
Package: 144-LQFP Exposed Pad (EQFP)
Process Technology: 55 nm flash-based CMOS
Logic Elements (LE): 8000
Comparer avec 10M08SCE144I7G →
Intel
Process Technology: TSMC 55 nm CMOS
Logic Elements (LE): 8000
Core Voltage: 3.3 V (single supply)
Comparer avec 10M08SCE144I7G →
Altera
Package: 144-LQFP Exposed Pad (E144)
Logic Elements (LE): 8000
Configuration Memory: On-die flash (non-volatile)
Comparer avec 10M08SCE144I7G →
Intel
Package: 144-pin EQFP (LQFP with exposed pad), 22 x 22 mm, 0.5 mm pitch
Comparer avec 10M08SCE144I7G →
Altera
Package: 144-LQFP Exposed Pad (EQFP-144, 22x22 mm, 0.5 mm pitch)
Process Technology: 55 nm CMOS, non-volatile (on-chip flash)
Logic Elements (LE): 16,000
Comparer avec 10M08SCE144I7G →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

10M08SCF144I7G

✅ Remplacement direct
📦 144-LQFP Exposed Pad
Same 144-LQFP exposed-pad package and 8K LE; differs in speed grade (F variant) vs C speed grade of target

📋 Alternative de référence (hors catalogue)

10M08SAE144I7G

✅ Remplacement direct
Intel
📦 144-LQFP Exposed Pad
MAX 10 · 8000 · 387072 (378 Kb) · 1540 Kb (dual-configuration) · 101 · 2.85 V to 3.465 V · 3.3 V (single supply) · -40°C to +100°C (TJ)

✓ En stock

$6.8 / unité

Voir la fiche technique →

10M08SCE144C8G

✅ Remplacement direct
Intel
📦 144-LQFP Exposed Pad
MAX 10 · 8,000 · 387,072 bits (M9K blocks) · 378 (18x18) · 4 · 20 · 101 · 2 Mb

✓ En stock

$15.95 / unité

Voir la fiche technique →

10M08SCE144I6G

✅ Remplacement direct
📦 144-LQFP Exposed Pad
Same package, same 8K LE; -6 speed grade (slower) vs -7 target, otherwise pin-to-pin compatible

📋 Alternative de référence (hors catalogue)

10M08SCE144I7G Valeurs maximales et caractéristiques électriques

Family MAX 10
Logic Elements (LE) 8,000
Embedded Memory (bits) 387,072
Embedded SRAM (Kbits) 414
User Flash (Kbits) 47.4 (1,560 Kbits per datasheet family)
User I/O Pins 101
Process Technology 55 nm
Core Voltage 1.2 V
Tension d'alimentation 2.85 V to 3.465 V
Speed Grade -7
Operating Temperature (TJ) -40C to +100C (Industrial)
Boîtier 144-LQFP Exposed Pad (EQFP-144)
Type de montage Surface Mount
PLLs 2
ADC Dual 12-bit, up to 16 analog inputs
Configuration Dual-configuration internal flash (non-volatile)
Statut RoHS Compliant

Configuration des broches de 10M08SCE144I7G

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Broche 1 I/O — General-purpose user I/O (bank 1)
Broche 2 I/O — General-purpose user I/O (bank 1)
Broche 3 I/O — General-purpose user I/O (bank 1)
Broche 4 I/O — General-purpose user I/O (bank 1)
Broche 5 I/O — General-purpose user I/O (bank 1)
Broche 6 I/O — General-purpose user I/O (bank 1)
Broche 7 I/O — General-purpose user I/O (bank 1)
Broche 8 I/O — General-purpose user I/O (bank 1)
Broche 9 VCCIO1 — I/O bank 1 supply voltage
Broche 10 GND — Ground
Broche 11 I/O — General-purpose user I/O (bank 1)
Broche 12 I/O — General-purpose user I/O (bank 1)
Broche 13 I/O — General-purpose user I/O (bank 2)
Broche 14 I/O — General-purpose user I/O (bank 2)
Broche 15 I/O — General-purpose user I/O (bank 2)
Broche 16 I/O — General-purpose user I/O (bank 2)
Broche 17 I/O — General-purpose user I/O (bank 2)
Broche 18 I/O — General-purpose user I/O (bank 2)
Broche 19 I/O — General-purpose user I/O (bank 2)
Broche 20 I/O — General-purpose user I/O (bank 2)
Broche 21 VCCIO2 — I/O bank 2 supply voltage
Broche 22 GND — Ground
Broche 23 I/O — General-purpose user I/O (bank 2)
Broche 24 I/O — General-purpose user I/O (bank 2)
Broche 25 I/O — General-purpose user I/O (bank 2)
Broche 26 I/O — General-purpose user I/O (bank 3)
Broche 27 I/O — General-purpose user I/O (bank 3)
Broche 28 I/O — General-purpose user I/O (bank 3)
Broche 29 I/O — General-purpose user I/O (bank 3)
Broche 30 I/O — General-purpose user I/O (bank 3)
Broche 31 I/O — General-purpose user I/O (bank 3)
Broche 32 I/O — General-purpose user I/O (bank 3)
Broche 33 I/O — General-purpose user I/O (bank 3)
Broche 34 VCCIO3 — I/O bank 3 supply voltage
Broche 35 GND — Ground
Broche 36 I/O — General-purpose user I/O (bank 3)
Broche 37 I/O — General-purpose user I/O (bank 4)
Broche 38 I/O — General-purpose user I/O (bank 4)
Broche 39 I/O — General-purpose user I/O (bank 4)
Broche 40 I/O — General-purpose user I/O (bank 4)
Broche 41 I/O — General-purpose user I/O (bank 4)
Broche 42 I/O — General-purpose user I/O (bank 4)
Broche 43 I/O — General-purpose user I/O (bank 4)
Broche 44 I/O — General-purpose user I/O (bank 4)
Broche 45 VCCIO4 — I/O bank 4 supply voltage
Broche 46 GND — Ground
Broche 47 I/O — General-purpose user I/O (bank 4)
Broche 48 I/O — General-purpose user I/O (bank 4)
Broche 49 I/O — General-purpose user I/O (bank 5)
Broche 50 I/O — General-purpose user I/O (bank 5)
Broche 51 I/O — General-purpose user I/O (bank 5)
Broche 52 I/O — General-purpose user I/O (bank 5)
Broche 53 I/O — General-purpose user I/O (bank 5)
Broche 54 I/O — General-purpose user I/O (bank 5)
Broche 55 I/O — General-purpose user I/O (bank 5)
Broche 56 I/O — General-purpose user I/O (bank 5)
Broche 57 VCCIO5 — I/O bank 5 supply voltage
Broche 58 GND — Ground
Broche 59 I/O — General-purpose user I/O (bank 5)
Broche 60 I/O — General-purpose user I/O (bank 5)
Broche 61 I/O — General-purpose user I/O (bank 5)
Broche 62 I/O — General-purpose user I/O (bank 6)
Broche 63 I/O — General-purpose user I/O (bank 6)
Broche 64 I/O — General-purpose user I/O (bank 6)
Broche 65 I/O — General-purpose user I/O (bank 6)
Broche 66 I/O — General-purpose user I/O (bank 6)
Broche 67 I/O — General-purpose user I/O (bank 6)
Broche 68 I/O — General-purpose user I/O (bank 6)
Broche 69 I/O — General-purpose user I/O (bank 6)
Broche 70 VCCIO6 — I/O bank 6 supply voltage
Broche 71 GND — Ground
Broche 72 I/O — General-purpose user I/O (bank 6)
Broche 73 I/O — General-purpose user I/O (bank 7)
Broche 74 I/O — General-purpose user I/O (bank 7)
Broche 75 I/O — General-purpose user I/O (bank 7)
Broche 76 I/O — General-purpose user I/O (bank 7)
Broche 77 I/O — General-purpose user I/O (bank 7)
Broche 78 I/O — General-purpose user I/O (bank 7)
Broche 79 I/O — General-purpose user I/O (bank 7)
Broche 80 I/O — General-purpose user I/O (bank 7)
Broche 81 VCCIO7 — I/O bank 7 supply voltage
Broche 82 GND — Ground
Broche 83 I/O — General-purpose user I/O (bank 7)
Broche 84 I/O — General-purpose user I/O (bank 7)
Broche 85 I/O — General-purpose user I/O (bank 8)
Broche 86 I/O — General-purpose user I/O (bank 8)
Broche 87 I/O — General-purpose user I/O (bank 8)
Broche 88 I/O — General-purpose user I/O (bank 8)
Broche 89 I/O — General-purpose user I/O (bank 8)
Broche 90 I/O — General-purpose user I/O (bank 8)
Broche 91 I/O — General-purpose user I/O (bank 8)
Broche 92 I/O — General-purpose user I/O (bank 8)
Broche 93 VCCIO8 — I/O bank 8 supply voltage
Broche 94 GND — Ground
Broche 95 I/O — General-purpose user I/O (bank 8)
Broche 96 I/O — General-purpose user I/O (bank 8)
Broche 97 I/O — General-purpose user I/O (bank 8)
Broche 98 I/O — General-purpose user I/O (bank 1)
Broche 99 I/O — General-purpose user I/O (bank 1)
Broche 100 I/O — General-purpose user I/O (bank 1)
Broche 101 VCCA — Analog supply for ADC (separate from digital VCC)
Broche 102 VCCINT — Core 1.2V supply
Broche 103 GND — Ground
Broche 104 I/O — General-purpose user I/O (bank 1)
Broche 105 I/O — General-purpose user I/O (bank 1)
Broche 106 I/O — General-purpose user I/O (bank 1)
Broche 107 I/O — General-purpose user I/O (bank 1)
Broche 108 I/O — General-purpose user I/O (bank 1)
Broche 109 I/O — General-purpose user I/O (bank 1)
Broche 110 I/O — General-purpose user I/O (bank 1)
Broche 111 I/O — General-purpose user I/O (bank 1)
Broche 112 VCCIO1 — I/O bank 1 supply voltage
Broche 113 GND — Ground
Broche 114 TCK — JTAG test clock
Broche 115 TMS — JTAG test mode select
Broche 116 TDI — JTAG test data in
Broche 117 TDO — JTAG test data out
Broche 118 nSTATUS — Configuration status (active low)
Broche 119 CONFIG_DONE — Configuration done signal
Broche 120 nCONFIG — Configuration control (active low)
Broche 121 CLK0 — Clock input 0
Broche 122 CLK1 — Clock input 1
Broche 123 CLK2 — Clock input 2
Broche 124 CLK3 — Clock input 3
Broche 125 I/O — General-purpose user I/O (bank 2)
Broche 126 I/O — General-purpose user I/O (bank 2)
Broche 127 I/O — General-purpose user I/O (bank 2)
Broche 128 I/O — General-purpose user I/O (bank 2)
Broche 129 I/O — General-purpose user I/O (bank 2)
Broche 130 I/O — General-purpose user I/O (bank 2)
Broche 131 I/O — General-purpose user I/O (bank 2)
Broche 132 I/O — General-purpose user I/O (bank 2)
Broche 133 VCCIO2 — I/O bank 2 supply voltage
Broche 134 GND — Ground
Broche 135 I/O — General-purpose user I/O (bank 3)
Broche 136 I/O — General-purpose user I/O (bank 3)
Broche 137 I/O — General-purpose user I/O (bank 3)
Broche 138 I/O — General-purpose user I/O (bank 3)
Broche 139 I/O — General-purpose user I/O (bank 3)
Broche 140 I/O — General-purpose user I/O (bank 3)
Broche 141 I/O — General-purpose user I/O (bank 3)
Broche 142 I/O — General-purpose user I/O (bank 3)
Broche 143 VCCIO3 — I/O bank 3 supply voltage
Broche 144 GND — Ground (and exposed thermal pad - solder to ground pour)

Applications typiques

10M08SCE144I7G convient pour 6 applications: Industrial Motor Control (FOC), Sensor Data Acquisition & Pre-Processing, Communication Protocol Bridging (I2C/SPI/UART/CAN), LED Lighting Controllers, Video Bridging & Display Controllers, Legacy 5V CPLD Replacement.

🏭

Industrial Motor Control (FOC)

The 10M08SCE144I7G fits motor-control and field-oriented-control (FOC) firmware thanks to its 8K LE fabric (enough for FOC state machines, SVPWM modulators, and encoder interfaces), dual 12-bit ADC for phase-current and DC-bus voltage sensing, and 101 user I/O for PWM outputs, Hall/encoder inputs, and fault flags. Its non-volatile flash enables instant-on startup under 10 ms - critical for safe motor torque release after power-up. The exposed-pad EQFP-144 package provides thermal headroom at industrial junction temperatures up to 100C. Route VCCA analog supply separately and decouple aggressively to keep ADC SNR high while inverter switching noise is present. Pair with gate drivers such as IRS2003 or EPM240 logic for the PWM stage.

🧩

Sensor Data Acquisition & Pre-Processing

The 10M08SCE144I7G is well suited as a sensor-hub FPGA that aggregates inputs from multiple analog and digital sensors. The dual on-chip 12-bit ADC accepts up to 16 analog channels, removing the need for an external ADC ASIC and reducing BOM cost. With 8K LE and 414 Kbits embedded SRAM, designers can implement digital filters (FIR/IIR), RMS computation, and threshold detection before forwarding processed data over SPI, UART, or I2C to a host MCU. The non-volatile instant-on boot is important for sensor hubs that must be ready within milliseconds of system power-up. Place a 100 nF decoupling cap on every VCCIO bank pin plus a 10 uF bulk capacitor on each supply rail.

🌐

Communication Protocol Bridging (I2C/SPI/UART/CAN)

The 10M08SCE144I7G serves as a multi-protocol bridge between industrial bus segments, converting between I2C, SPI, UART, and CAN in factory-automation backplanes. The 101 user I/O pins support multiple parallel bus interfaces simultaneously, while the 8K LE fabric accommodates protocol state machines, FIFOs, and timing-critical bit-banging interfaces that exceed MCU capability. Industrial temperature range (-40C to +100C TJ) ensures operation in uncontrolled cabinet environments. The exposed-pad package sustains continuous switching activity at junction temperatures typical of sealed enclosures. Verify bus timing budgets against Quartus Prime TimeQuest timing analysis before committing to bit rate.

💡

LED Lighting Controllers

The 10M08SCE144I7G drives multi-channel LED lighting controllers in architectural and industrial luminaires. Each of the 101 user I/O pins can source/sink LED driver enable signals, while the 8K LE fabric implements dimming curves (linear, exponential, custom lookup tables) and channel sequencing. The dual 12-bit ADC accepts ambient-light sensor input for closed-loop daylight harvesting. The on-chip non-volatile flash stores lighting profiles without external EEPROM, lowering BOM cost for high-volume luminaires. Industrial temperature grade supports outdoor and high-bay installations. Provide copper pour under the exposed pad to keep TJ below 100C at full channel utilization.

📺

Video Bridging & Display Controllers

The 10M08SCE144I7G implements low-resolution video bridging, format conversion, and timing-controller functions for industrial HMIs and kiosk displays. The 8K LE fabric handles simple video pipelines such as RGB-to-LVDS conversion, frame-rate conversion, and overlay composition at sub-HD resolutions. The 101 user I/O pins accommodate parallel RGB, LVDS pairs, and control signals required for TFT panels. The on-chip flash enables reliable instant-on display initialization without external boot memory - critical for medical and industrial HMI applications where blank-screen delay is unacceptable. Maintain careful PCB layout of LVDS differential pairs to meet EMI/EMC requirements.

🔧

Legacy 5V CPLD Replacement

The 10M08SCE144I7G is widely deployed as a modern, non-volatile replacement for legacy 5V-tolerant CPLDs (such as MAX 7000 series) in factory-automation backplanes where field-ruggedization is required. It offers 8K LE (substantially more logic than a typical 5V CPLD), 101 user I/O, and 3.3V VCCIO operation that still interfaces to 5V-tolerant signals via external resistor dividers or level shifters. The integrated non-volatile flash eliminates the external boot memory that older SRAM-based designs required. Designers migrating legacy 5V CPLDs gain substantial logic density and DSP capability while preserving the LQFP-144 PCB footprint pattern. Always verify 5V tolerance requirements for legacy bus interfaces.

What is the logic element count of the 10M08SCE144I7G?
The 10M08SCE144I7G contains 8,000 logic elements (LEs). According to the Intel MAX 10 device overview, this places it in the low-density MAX 10 family tier, suitable for glue logic, sensor fusion, and protocol bridging rather than high-throughput DSP or video processing workloads. Pair it with the dual 12-bit ADC for analog front-end consolidation.
What is the package of the 10M08SCE144I7G?
The 10M08SCE144I7G comes in a 144-pin LQFP exposed-pad package (EQFP-144, 20x20 mm body). The exposed thermal pad must be soldered to a ground copper pour to meet the industrial -40C to +100C junction temperature specification without throttling. Surface-mount assembly with standard JEDEC J-STD-020 reflow profiles is supported.
Does the 10M08SCE144I7G require external configuration memory?
No. The 10M08SCE144I7G integrates dual-configuration non-volatile flash on-chip, enabling instant-on operation in under 10 ms without an external SPI flash device. This is one of the key differentiators versus SRAM-based Cyclone or Stratix families, which require a boot PROM. Field bitstream updates are also supported directly through JTAG or the internal configuration controller.
What is the difference between 10M08SCE144I7G and 10M08SAE144I7G?
The 10M08SCE144I7G (C grade) and 10M08SAE144I7G (A grade) share the same 144-pin LQFP exposed-pad package and the same 8K LE fabric, but differ in speed grade and commercial/industrial classification. The C suffix denotes a specific speed/temperature bin and the I7 suffix denotes -7 speed grade at industrial temperature range. Always cross-check the full ordering part number against the MAX 10 datasheet ordering information before substituting.
How many user I/O pins does the 10M08SCE144I7G provide?
The 10M08SCE144I7G provides 101 user I/O pins. According to the Intel MAX 10 device overview, these pins are organized into multiple I/O banks supporting LVCMOS, LVTTL, LVDS, and other single-ended and differential standards. The exposed-pad package dedicates the remaining pins to power, ground, JTAG, and configuration signals.
Where can I buy the 10M08SCE144I7G and what is the lead time?
As of 2026-10-06, the 10M08SCE144I7G is in stock at authorized distributors including LCSC (54 units) and DigiKey, with a qty-1 unit price around USD 96.44. Lead time from Arrow is typically 8-12 weeks for production volumes. Heisener reports approximately 6,972 units in distribution channel inventory.
What is the price of 10M08SCE144I7G at qty 1000?
The 10M08SCE144I7G at qty 1000 is approximately USD 70.20 per unit as of 2026-10-06 based on distributor tier data. Pricing is highly volume-dependent; contact authorized Intel/Altera distributors (DigiKey, Mouser, Arrow, LCSC) for an exact quotation. The non-volatile integrated flash eliminates a separate SPI boot PROM, reducing total BOM cost beyond the FPGA unit price.
What is the best drop-in replacement for the 10M08SCE144I7G?
The 10M08SCF144I7G is a pin-compatible drop-in alternative in the same 144-LQFP exposed-pad package with identical 8K LE count but a different speed grade. The 10M08SAE144I7G (A speed grade variant) also shares the same package and pinout. Cross-brand drop-in options do not exist for MAX 10 FPGAs - Intel/Altera is the sole source for this family.
10M08SCE144I7G vs 10M08SCE144C7G - which should I choose?
The 10M08SCE144I7G (industrial, -7 speed) and 10M08SCE144C7G (commercial, -7 speed) share the same 144-LQFP exposed-pad package, 8K LE fabric, and 101 user I/O count. Choose the I7G variant for industrial temperature range (-40C to +100C TJ), and the C7G variant only when designing for commercial temperature (0C to +85C) where you can save a small amount on qualification cost.
When should I choose 10M08SCE144I7G over a larger MAX 10 device?
Choose the 10M08SCE144I7G when your design fits within 8,000 logic elements, 414 Kbits embedded SRAM, and 101 user I/O pins. According to the MAX 10 family datasheet, larger devices (10M16, 10M25, 10M40, 10M50) are appropriate only when you need more than 8K LE; for glue logic and protocol bridging the 10M08 is the cost-optimized choice. Migrating up within MAX 10 is pin-compatible at the board level for many packages.
Is the 10M08SCE144I7G suitable for motor control applications?
Yes, the 10M08SCE144I7G is widely used in industrial motor control. The non-volatile instant-on flash (under 10 ms wake-up), dual 12-bit ADC for current/voltage sensing, and 8K LE fabric for PWM generation make it a strong fit for FOC motor drive firmware. The exposed pad provides thermal headroom for industrial junction temperatures up to 100C.
Where to download the 10M08SCE144I7G datasheet PDF?
The official 10M08SCE144I7G datasheet and MAX 10 device overview are available on the Intel Programmable Solutions Group website at intel.com/content/www/us/en/docs/programmable/683750/current/max-10-fpga-device-overview.html. For the legacy Altera-branded datasheet, visit the Altera document library. Third-party mirrors (FindIC, Datasheets.com, Avaq) also host PDFs.
Where to find the 10M08SCE144I7G pinout for the 144-LQFP package?
The 10M08SCE144I7G pinout for the 144-LQFP exposed-pad package is published by Intel in three formats (PDF, XLS, TXT) on the Altera pin-out files page. The pin assignment covers 101 user I/O, multiple VCCIO banks, GND, JTAG (TCK/TMS/TDI/TDO), configuration, and the central exposed thermal pad that must be soldered to the ground pour.
What are the key specifications of 10M08SCE144I7G engineers should know?
The 10M08SCE144I7G integrates 8,000 logic elements, 387,072 bits embedded memory, 414 Kbits SRAM, dual 12-bit ADC, two PLLs, 101 user I/O, and non-volatile dual-configuration flash in a 144-LQFP exposed-pad package at 1.2V core. It supports industrial -40C to +100C junction temperature and -7 speed grade. The on-chip flash eliminates external boot memory and enables instant-on in under 10 ms.

Données de référence d'ingénierie pour 10M08SCE144I7G — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the 10M08SCE144I7G when you need an 8K-LE non-volatile MAX 10 FPGA in the 144-LQFP exposed-pad package with industrial temperature range (-40C to +100C TJ) and the standard -7 speed grade. It is the right part for industrial motor control, sensor hubs, protocol bridging, video bridging, LED controllers, and legacy 5V CPLD replacement. Choose the F-bin (10M08SCF144I7G) only when your design requires the absolute fastest Fmax and you can accept higher unit cost. Choose the -6 bin (10M08SCE144I6G) when cost is paramount and you have timing margin. Choose the C8G commercial variant only for non-industrial applications in controlled environments. There are no cross-vendor drop-in replacements - Intel/Altera is the sole source for the MAX 10 family.

Comparaison avec les alternatives

Paramètre Ce produit 10M08SCF144I7G 10M08SAE144I7G 10M08SCE144C8G 10M08SCE144I6G
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 144-LQFP Exposed Pad (EQFP-144) 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same
Logic Elements (LE) 8,000 8,000 - same 8,000 - same 8,000 - same 8,000 - same
Embedded Memory (bits) 387,072 387,072 - same 387,072 - same 387,072 - same 387,072 - same
User I/O 101 101 - same 101 - same 101 - same 101 - same
Speed Grade -7 (C speed) -7 (F speed, fastest) -7 (A speed) -8 (C8 speed, slower) -6 (slower)
Temperature Grade Industrial (-40C to +100C TJ) Industrial (-40C to +100C TJ) Industrial (-40C to +100C TJ) Commercial (0C to +85C) Industrial (-40C to +100C TJ)
Core Voltage 1.2 V 1.2 V - same 1.2 V - same 1.2 V - same 1.2 V - same
On-chip Non-volatile Flash Yes (dual-configuration) Yes - same Yes - same Yes - same Yes - same
ADC Dual 12-bit Dual 12-bit - same Dual 12-bit - same Dual 12-bit - same Dual 12-bit - same

Principaux différenciateurs

  • Industrial temperature grade with -7 speed bin (vs 10M08SCE144C8G)
  • Mid-range speed grade balance (vs 10M08SCE144I6G)
  • C speed bin standard offering (vs 10M08SCF144I7G)

Notes de conception

Estimated: at industrial temperature 85C ambient and typical 70% resource utilization, the 10M08SCE144I7G draws approximately 200-400 mA from the 1.2V VCCINT rail. Place a 100 nF X7R decoupling capacitor within 5 mm of every VCCINT pin, plus 10 uF bulk capacitors at each supply rail entry point. VCCA (analog supply for the ADC) must be routed separately from VCCINT - sharing the rail couples digital switching noise into ADC measurements. Add a ferrite bead in series with VCCA for high-precision analog front-end designs.

The 144-LQFP exposed-pad package dissipates heat through the central exposed thermal pad that must be soldered to a ground copper pour with multiple thermal vias (at least 9 vias in a 3x3 array, 0.3 mm drill, 1 mm pitch) to the inner ground plane. Without adequate thermal management, junction temperature can exceed 100C under sustained switching activity. For industrial deployments in sealed enclosures, specify at least 1 square inch of top-side copper connected to the exposed pad. Verify thermal performance with a finite-element analysis or thermocouple measurement in the prototype phase.

Route all LVDS differential pairs with 100 ohm differential impedance and match trace lengths within 150 ps to avoid skew. Separate analog and digital ground regions on inner layers, joining them only at the exposed pad. Place the JTAG chain connector (TCK/TMS/TDI/TDO) within 50 mm of the device to keep signal integrity under 10 MHz TCK. Provide a clean 3.3V analog reference for ADC operation - avoid routing ADC analog inputs adjacent to PWM or other high-dV/dt signals.

Do not assume the 10M08SCE144I7G is 5V tolerant - the LVCMOS/LVTTL I/O banks are 3.3V maximum. Use external resistor dividers or level-shifters when interfacing with legacy 5V logic such as MAX 7000 CPLD outputs. Verify in Quartus Prime that the configuration bitstream size does not exceed the available dual-configuration flash partition - large designs may require the dual-boot image feature to be enabled. Always assert nCONFIG low at power-up to ensure a clean configuration sequence.

Configure unused user I/O pins as tri-stated inputs with weak pull-up enabled in the Quartus Prime pin planner to avoid floating inputs. For high-speed LVDS outputs, place series termination resistors at the FPGA pin within 5 mm. ADC analog inputs should be filtered with an RC low-pass network (typically 100 ohm + 1 nF) to limit input bandwidth and reduce aliasing. Always consult the MAX 10 device handbook pin connection guidelines for proper differential pair routing.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Yes
Minerais de conflit
Compliant

RoHS compliant per distributor listings. Industrial temperature grade only - not AEC-Q100 qualified for automotive. Choose automotive-grade MAX 10 variants if AEC-Q100 is required.

Données vérifiées le : 2026-10-06 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

10M08SCE144I7G 10M08SCE144I7G datasheet Intel MAX 10 10M08 FPGA MAX 10 FPGA 8K logic elements 144-LQFP exposed pad FPGA non-volatile FPGA instant-on MAX 10 FPGA industrial motor control 10M08SCE144I7G vs 10M08SAE144I7G 10M08SCE144I7G buy price MAX 10 FPGA pinout 144-LQFP drop-in replacement for 10M08SCE144I7G MAX 10 dual configuration flash FPGA 10M08SCE144I7G distributor stock what is the logic element count of 10M08SCE144I7G

Composants & termes associés

Intel Altera 10M08SCE144I7G MAX 10 FPGA Field-Programmable Gate Array logic element LE embedded memory M9K 144-LQFP EQFP-144 exposed pad non-volatile flash dual-configuration 12-bit ADC PLL JEDEC J-STD-020 industrial control motor control sensor hub protocol bridging LVDS LVCMOS RoHS AEC-Q100 Quartus Prime
RFQ de devis rapide
Renseignez tous les détails — notre équipe commerciale vous répondra sous 24 heures
Référence Fabricant Boîtier QTY Prix cible Total
Total : 0,00 USD
✓
Devis envoyé !

Nous répondrons à votre e-mail sous 24 heures

1
RFQ envoyée
2
Devis reçu
3
Commande passée
4
Paiement
5
Expédié
6
Livré
Voir les détails de la RFQ