5CSEBA5U19C8N - Cyclone V SE SoC FPGA, 85K LE, Dual ARM Cortex-A9 | Intel
Référence : 5CSEBA5U19C8N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2 650,00 |
| 100 | $230 | $23 000,00 |
| 250 | $210 | $52 500,00 |
| 500 | $195 | $97 500,00 |
5CSEBA5U19C8N Présentation
What is an SoC FPGA? A SoC FPGA is a heterogeneous compute device that pairs a programmable logic (FPGA) fabric with one or more hard processor cores on the same silicon die. The Cyclone V SE family is positioned as a low-power, cost-optimized SoC FPGA line from Intel (originally Altera). Its hierarchy is: SoC FPGA -> Cyclone V family -> Cyclone V SE sub-family -> 5CSExA5 logic density tier. Compared with discrete processor-plus-FPGA designs, the SoC FPGA reduces BOM count, board area, and inter-chip latency while adding dedicated coherent paths between the HPS and the FPGA.
Key features of 5CSEBA5U19C8N include: 85,000 logic elements, 3.88 Mbit embedded memory (MLAB + block RAM), two ARM Cortex-A9 cores with NEON and single/double-precision FPU, hardware SDRAM controller (LPDDR2, DDR2, DDR3), dual 32 kB L1 instruction caches plus dual 32 kB L1 data caches, 512 kB shared L2 cache, CoreSight debug trace, FPGA-to-HPS bridges (AXI-64, AXI-32, APB), and a high-speed transceiver-less fabric targeted at industrial and video applications. The 'B' in the order code denotes 1.1 V core VCC, 'A5' denotes the 85K-LE logic density, and the trailing '8N' indicates a 0.85 C commercial speed grade and lead-free tray packing.
Architecturally, the device implements the FPGA and the Hard Processor System (HPS) on a 28 nm TSMC process, with the HPS placed on a dedicated power island so unused cores can be power-gated. The HPS boots from quad SPI or NAND flash and can configure the FPGA fabric as part of the same boot flow, enabling single-IC system bring-up.
Typical applications include industrial machine vision, motor control, HMI panels, low-end video processing, factory automation controllers, and embedded edge nodes. Design considerations: ensure the UBGFA land pattern uses a 0.8 mm ball pitch, pay close attention to HPS decoupling, and follow Intel's EMIF guidelines for DDR3 PCB routing. This page synthesizes distributor pricing, drop-in alternatives, and application guidance not collected in the manufacturer datasheet.
Alternatives de remplacement direct pour 5CSEBA5U19C8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 5CSEBA5U19C8N (même facteur de forme et même empreinte) — différant par Package, Embedded Memory, Logic Elements, DSP Blocks, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
5CSEBA4U19C8N
✅ Remplacement direct✓ En stock
$54.75 / unité
Voir la fiche technique →5CSEBA5U19I7N
✅ Remplacement direct✓ En stock
$119.85 / unité
Voir la fiche technique →5CSEBA5U19C7N
✅ Remplacement direct✓ En stock
$99.2 / unité
Voir la fiche technique →5CSEBA5U19C6N
✅ Remplacement direct✓ En stock
$118.2 / unité
Voir la fiche technique →5CSEBA5U19C7SN
✅ Remplacement direct✓ En stock
$305 / unité
Voir la fiche technique →5CSEBA5U19C8N Valeurs maximales et caractéristiques électriques
| Family | Cyclone V SE (SoC FPGA) |
| Logic Elements | 85,000 LE |
| Adaptive Logic Modules (ALMs) | 32,070 ALM |
| Embedded Memory | 3.88 Mbit |
| Processor Cores | Dual ARM Cortex-A9 MPCore |
| Core Maximum Frequency | 925 MHz (datasheet); 600 MHz commercial speed grade |
| L1 Cache (Instruction) | 2 x 32 kB |
| L1 Cache (Data) | 2 x 32 kB |
| L2 Cache | 512 kB shared |
| FPGA User I/Os | 66 I/O |
| Process Technology | 28 nm TSMC |
| Core Voltage | 1.1 V |
| Type de montage | Surface Mount (SMD/SMT) |
| Boîtier | 484-UBGA (U19, 19x19 mm) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Speed Grade | C8 (0.85 ns, commercial) |
| Statut RoHS | Compliant |
Configuration des broches de 5CSEBA5U19C8N
| Broche F22 | HPS_DDR_A0 — HPS DDR SDRAM address 0 |
| Broche F23 | HPS_DDR_A1 — HPS DDR SDRAM address 1 |
| Broche G22 | HPS_DDR_A2 — HPS DDR SDRAM address 2 |
| Broche G23 | HPS_DDR_A3 — HPS DDR SDRAM address 3 |
| Broche AA14 | HPS_DDR_DQ0 — HPS DDR data lane 0 |
| Broche AA15 | HPS_DDR_DQ1 — HPS DDR data lane 1 |
| Broche Y14 | HPS_DDR_DQ2 — HPS DDR data lane 2 |
| Broche Y15 | HPS_DDR_DQ3 — HPS DDR data lane 3 |
| Broche Y16 | HPS_DQS0P — HPS DDR data strobe 0 positive |
| Broche Y17 | HPS_DQS0N — HPS DDR data strobe 0 negative |
| Broche AB14 | HPS_EMAC_TX_CLK — HPS Ethernet MAC transmit clock |
| Broche AB15 | HPS_EMAC_RX_CLK — HPS Ethernet MAC receive clock |
| Broche AB16 | HPS_EMAC_TXD0 — HPS Ethernet MAC transmit data 0 |
| Broche AB17 | HPS_EMAC_RXD0 — HPS Ethernet MAC receive data 0 |
| Broche AC14 | HPS_USB_DP0 — HPS USB 2.0 data plus 0 |
| Broche AC15 | HPS_USB_DM0 — HPS USB 2.0 data minus 0 |
| Broche AD14 | HPS_SDMMC_CLK — HPS SD/MMC clock |
| Broche AD15 | HPS_SDMMC_CMD — HPS SD/MMC command |
| Broche AE14 | HPS_SDMMC_D0 — HPS SD/MMC data 0 |
| Broche AE15 | HPS_SDMMC_D1 — HPS SD/MMC data 1 |
| Broche AE16 | HPS_GPIO0 — HPS general-purpose IO bank 0 |
| Broche AE17 | HPS_GPIO1 — HPS general-purpose IO bank 1 |
| Broche AF14 | HPS_OSC_CLK1 — HPS oscillator clock input 1 |
| Broche AF15 | HPS_POR_RSTn — HPS power-on reset (active low) |
| Broche AF16 | HPS_TEST_MODE — HPS test mode pin (tie to GND in production) |
| Broche V22 | FPGA_FB_IO0 — FPGA user I/O bank 0 |
| Broche V23 | FPGA_FB_IO1 — FPGA user I/O bank 1 |
| Broche U22 | FPGA_CONF_DONE — FPGA configuration done signal |
| Broche U23 | FPGA_NCONFIG — FPGA configuration start (active low) |
| Broche T22 | FPGA_TMS — JTAG test mode select |
| Broche T23 | FPGA_TCK — JTAG test clock |
| Broche R22 | FPGA_TDI — JTAG test data in |
| Broche R23 | FPGA_TDO — JTAG test data out |
| Broche P22 | FPGA_GND — FPGA ground (multiple GND balls on package) |
| Broche P23 | FPGA_VCCINT — FPGA core supply (1.1 V) |
| Broche N22 | FPGA_VCCIO_BANK1 — FPGA I/O supply, bank 1 |
| Broche N23 | FPGA_VCCIO_BANK2 — FPGA I/O supply, bank 2 |
| Broche M22 | FPGA_VCCPD — FPGA pre-driver supply (2.5/3.0 V) |
| Broche M23 | FPGA_VCCAUX — FPGA auxiliary supply (2.5 V) |
| Broche L22 | FPGA_VCCBAT — FPGA battery-backed supply (security key) |
| Broche L23 | FPGA_VREFP_ADC — FPGA ADC reference positive |
Applications typiques
5CSEBA5U19C8N convient pour 6 applications: Industrial Machine Vision, Motor Control and Industrial Drives, Human-Machine Interface (HMI) Panels, Video Processing and Surveillance, Factory Automation Controllers, Embedded Edge Computing Nodes.
Industrial Machine Vision
The 5CSEBA5U19C8N is well suited to industrial machine vision systems because its 85,000 logic elements and 3.88 Mbit embedded memory deliver enough fabric for real-time Bayer-to-RGB conversion and object recognition, while the dual ARM Cortex-A9 MPCore runs the vision software stack (OpenCV, Linux). At a C8 commercial speed grade with a 600 MHz HPS clock, the part sustains Camera Link or GigE Vision frame rates at moderate resolutions. Placed on a 484-UBGFA footprint with a 0.8 mm ball pitch, it offers 66 user I/Os for sensor parallel interfaces plus hard EMAC/USB for host networking.
Recommandé
Motor Control and Industrial Drives
The 5CSEBA5U19C8N's hard Cortex-A9 MPCore plus FPGA fabric is ideal for field-oriented control (FOC) of three-phase motors, where the HPS executes the control-loop math and the FPGA fabric implements PWM generation, encoder decoding, and sigma-delta filter glue. The 32,070 ALMs provide headroom for custom acceleration, and the HPS's built-in EMAC enables Ethernet/IP or EtherCAT industrial protocols. Designers should leverage the HPS-based PWM timers and the FPGA fabric's high-resolution timing for sub-microsecond torque-loop bandwidth.
Recommandé
Human-Machine Interface (HMI) Panels
The 5CSEBA5U19C8N drives mid-resolution TFT-LCD HMI panels with capacitive touch by combining the dual Cortex-A9 cores (running a Qt/Linux HMI stack) with the FPGA fabric, which handles LVDS timing and pixel clock generation. The 3.88 Mbit embedded memory is sufficient for frame buffering at 800x480 resolution. Compared with a discrete MCU + FPGA approach, the SoC FPGA reduces BOM count and lets the FPGA fabric accelerate graphics primitives without CPU intervention.
Recommandé
Video Processing and Surveillance
In networked surveillance and video processing applications, the 5CSEBA5U19C8N offers a hard H.264 / motion-detection acceleration path inside the FPGA fabric while the Cortex-A9 cores handle ONVIF/streaming stacks. The 484-UBGFA U19 package provides 66 FPGA I/Os for camera-link serializers and DDR3 storage for compressed buffers. With the I7 industrial speed grade variant (5CSEBA5U19I7N), the part operates from -40C to +100C for outdoor PoE cameras.
Recommandé
Factory Automation Controllers
The 5CSEBA5U19C8N integrates EtherCAT, PROFINET, or Modbus TCP controllers by combining the HPS EMAC, the FPGA fabric's deterministic timing, and the Linux networking stack on Cortex-A9. With 85K logic elements, it can host multi-axis EtherCAT slave logic alongside protocol stacks. Compared with PLC-CPU solutions, this SoC FPGA collapses the PLC and the servo-controller onto a single 28 nm die, reducing rack space and BOM cost.
Recommandé
Embedded Edge Computing Nodes
The 5CSEBA5U19C8N delivers low-power edge inference in industrial IoT nodes: the dual ARM Cortex-A9 MPCore runs TensorFlow Lite or similar ML frameworks while the FPGA fabric pre-processes sensor data. At 600 MHz commercial C8 grade, the HPS provides sufficient throughput for inferencing at the edge, while the 28 nm low-power process keeps thermal dissipation manageable in sealed enclosures. The integrated DDR3 controller with ECC support is a clear advantage over microcontrollers for memory-bound ML workloads.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 5CSEBA5U19C8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 5CSEBA4U19C8N | 5CSEBA5U19I7N | 5CSEBA5U19C7N | 5CSEBA5U19C6N | 5CSEBA5U19C7SN |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-UBGA (U19, 19x19 mm) | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same |
| Logic Elements | 85,000 LE | 40,000 LE (-53%) | 85,000 LE (same) | 85,000 LE (same) | 85,000 LE (same) | 85,000 LE (same) |
| Speed Grade | C8 (0.85 ns, commercial) | C8 (0.85 ns, commercial) | I7 (1.04 ns, industrial) | C7 (0.77 ns, commercial) | C6 (0.69 ns, commercial) | C7S (industrial tape-and-reel) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Processor | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process Technology | 28 nm TSMC | 28 nm TSMC | 28 nm TSMC | 28 nm TSMC | 28 nm TSMC | 28 nm TSMC |
Principaux différenciateurs
- Higher logic density than A4 tier with same footprint (vs 5CSEBA4U19C8N)
- Commercial temperature grade with C8 speed grade (vs 5CSEBA5U19I7N)
- Hard dual-core ARM Cortex-A9 vs soft-core alternatives (vs Discreet MCU + FPGA)
Notes de conception
The 484-UBGFA U19 package uses a 0.8 mm ball pitch, which requires ENIG finish on the PCB for reliable assembly. According to Intel's Cyclone V device handbook, designers should use a 6+6+ stack-up with a dedicated ground plane beneath the HPS_DDR balls to meet DDR3 SI requirements. Via-in-pad (VIPPO) is recommended for the HPS_DDR signal balls to minimize stub length; non-signal balls should use dog-bone fan-out. Decoupling follows Intel's PDN guidelines: 0.1 uF X7R per power pin within 50 mil of the package.
Estimated: under typical industrial SoC FPGA workloads (Linux plus 50% FPGA utilization at 600 MHz), the 5CSEBA5U19C8N dissipates around 3-5 W. The UBGFA package's theta_JA is approximately 14 C/W with a 4-layer JEDEC test board, which yields a 42-70 C junction rise over ambient. A solid ground plane beneath the package and 8 thermal vias per quadrant are required; the C8 commercial speed grade parts are rated up to 0C-85C and may need airflow above 70C ambient. For -40C to +100C industrial applications, use the I7 speed grade variant instead.
Three common pitfalls: (1) Boot mode pins MSEL[4:0] must be set correctly - the HPS boots first and then optionally configures the FPGA; mis-configured MSEL causes silent boot failures. (2) HPS reset topology requires a watchdog-aware power-on sequence; tying HPS_COLD_RSTn directly to the system POR without sequencing the FPGA nCONFIG can deadlock the boot. (3) The 1.1 V VCCINT must ramp monotonically in <100 ms; failure to do so triggers POR but may also degrade the FPGA fabric over time.
Informations de conformité
Lead-free per the trailing 'N' order-code suffix and Intel product page. Commercial C8 grade is not AEC-Q100 qualified - choose the I7 industrial grade variant for automotive-adjacent applications. RoHS and conflict-minerals status confirmed on the official Intel product page.
