5CSEBA5U19C8N - Cyclone V SE SoC FPGA, 85K LE, Dual ARM Cortex-A9 | Intel
Артикул: 5CSEBA5U19C8N ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2.650,00 |
| 100 | $230 | $23.000,00 |
| 250 | $210 | $52.500,00 |
| 500 | $195 | $97.500,00 |
5CSEBA5U19C8N Обзор
What is an SoC FPGA? A SoC FPGA is a heterogeneous compute device that pairs a programmable logic (FPGA) fabric with one or more hard processor cores on the same silicon die. The Cyclone V SE family is positioned as a low-power, cost-optimized SoC FPGA line from Intel (originally Altera). Its hierarchy is: SoC FPGA -> Cyclone V family -> Cyclone V SE sub-family -> 5CSExA5 logic density tier. Compared with discrete processor-plus-FPGA designs, the SoC FPGA reduces BOM count, board area, and inter-chip latency while adding dedicated coherent paths between the HPS and the FPGA.
Key features of 5CSEBA5U19C8N include: 85,000 logic elements, 3.88 Mbit embedded memory (MLAB + block RAM), two ARM Cortex-A9 cores with NEON and single/double-precision FPU, hardware SDRAM controller (LPDDR2, DDR2, DDR3), dual 32 kB L1 instruction caches plus dual 32 kB L1 data caches, 512 kB shared L2 cache, CoreSight debug trace, FPGA-to-HPS bridges (AXI-64, AXI-32, APB), and a high-speed transceiver-less fabric targeted at industrial and video applications. The 'B' in the order code denotes 1.1 V core VCC, 'A5' denotes the 85K-LE logic density, and the trailing '8N' indicates a 0.85 C commercial speed grade and lead-free tray packing.
Architecturally, the device implements the FPGA and the Hard Processor System (HPS) on a 28 nm TSMC process, with the HPS placed on a dedicated power island so unused cores can be power-gated. The HPS boots from quad SPI or NAND flash and can configure the FPGA fabric as part of the same boot flow, enabling single-IC system bring-up.
Typical applications include industrial machine vision, motor control, HMI panels, low-end video processing, factory automation controllers, and embedded edge nodes. Design considerations: ensure the UBGFA land pattern uses a 0.8 mm ball pitch, pay close attention to HPS decoupling, and follow Intel's EMIF guidelines for DDR3 PCB routing. This page synthesizes distributor pricing, drop-in alternatives, and application guidance not collected in the manufacturer datasheet.
Аналоги без доработки для 5CSEBA5U19C8N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с 5CSEBA5U19C8N (тот же форм-фактор и посадочное место) — отличается по Package, Embedded Memory, Logic Elements, DSP Blocks, Speed Grade.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
5CSEBA4U19C8N
✅ Прямая замена✓ В наличии
$54.75 / шт.
Открыть даташит →5CSEBA5U19I7N
✅ Прямая замена✓ В наличии
$119.85 / шт.
Открыть даташит →5CSEBA5U19C7N
✅ Прямая замена✓ В наличии
$99.2 / шт.
Открыть даташит →5CSEBA5U19C6N
✅ Прямая замена✓ В наличии
$118.2 / шт.
Открыть даташит →5CSEBA5U19C7SN
✅ Прямая замена✓ В наличии
$305 / шт.
Открыть даташит →5CSEBA5U19C8N Максимальные параметры и электрические характеристики
| Family | Cyclone V SE (SoC FPGA) |
| Logic Elements | 85,000 LE |
| Adaptive Logic Modules (ALMs) | 32,070 ALM |
| Embedded Memory | 3.88 Mbit |
| Processor Cores | Dual ARM Cortex-A9 MPCore |
| Core Maximum Frequency | 925 MHz (datasheet); 600 MHz commercial speed grade |
| L1 Cache (Instruction) | 2 x 32 kB |
| L1 Cache (Data) | 2 x 32 kB |
| L2 Cache | 512 kB shared |
| FPGA User I/Os | 66 I/O |
| Process Technology | 28 nm TSMC |
| Core Voltage | 1.1 V |
| Тип монтажа | Surface Mount (SMD/SMT) |
| Корпус | 484-UBGA (U19, 19x19 mm) |
| Рабочая температура | 0C to +85C (commercial) |
| Speed Grade | C8 (0.85 ns, commercial) |
| Статус RoHS | Compliant |
Конфигурация выводов 5CSEBA5U19C8N
| Контакт F22 | HPS_DDR_A0 — HPS DDR SDRAM address 0 |
| Контакт F23 | HPS_DDR_A1 — HPS DDR SDRAM address 1 |
| Контакт G22 | HPS_DDR_A2 — HPS DDR SDRAM address 2 |
| Контакт G23 | HPS_DDR_A3 — HPS DDR SDRAM address 3 |
| Контакт AA14 | HPS_DDR_DQ0 — HPS DDR data lane 0 |
| Контакт AA15 | HPS_DDR_DQ1 — HPS DDR data lane 1 |
| Контакт Y14 | HPS_DDR_DQ2 — HPS DDR data lane 2 |
| Контакт Y15 | HPS_DDR_DQ3 — HPS DDR data lane 3 |
| Контакт Y16 | HPS_DQS0P — HPS DDR data strobe 0 positive |
| Контакт Y17 | HPS_DQS0N — HPS DDR data strobe 0 negative |
| Контакт AB14 | HPS_EMAC_TX_CLK — HPS Ethernet MAC transmit clock |
| Контакт AB15 | HPS_EMAC_RX_CLK — HPS Ethernet MAC receive clock |
| Контакт AB16 | HPS_EMAC_TXD0 — HPS Ethernet MAC transmit data 0 |
| Контакт AB17 | HPS_EMAC_RXD0 — HPS Ethernet MAC receive data 0 |
| Контакт AC14 | HPS_USB_DP0 — HPS USB 2.0 data plus 0 |
| Контакт AC15 | HPS_USB_DM0 — HPS USB 2.0 data minus 0 |
| Контакт AD14 | HPS_SDMMC_CLK — HPS SD/MMC clock |
| Контакт AD15 | HPS_SDMMC_CMD — HPS SD/MMC command |
| Контакт AE14 | HPS_SDMMC_D0 — HPS SD/MMC data 0 |
| Контакт AE15 | HPS_SDMMC_D1 — HPS SD/MMC data 1 |
| Контакт AE16 | HPS_GPIO0 — HPS general-purpose IO bank 0 |
| Контакт AE17 | HPS_GPIO1 — HPS general-purpose IO bank 1 |
| Контакт AF14 | HPS_OSC_CLK1 — HPS oscillator clock input 1 |
| Контакт AF15 | HPS_POR_RSTn — HPS power-on reset (active low) |
| Контакт AF16 | HPS_TEST_MODE — HPS test mode pin (tie to GND in production) |
| Контакт V22 | FPGA_FB_IO0 — FPGA user I/O bank 0 |
| Контакт V23 | FPGA_FB_IO1 — FPGA user I/O bank 1 |
| Контакт U22 | FPGA_CONF_DONE — FPGA configuration done signal |
| Контакт U23 | FPGA_NCONFIG — FPGA configuration start (active low) |
| Контакт T22 | FPGA_TMS — JTAG test mode select |
| Контакт T23 | FPGA_TCK — JTAG test clock |
| Контакт R22 | FPGA_TDI — JTAG test data in |
| Контакт R23 | FPGA_TDO — JTAG test data out |
| Контакт P22 | FPGA_GND — FPGA ground (multiple GND balls on package) |
| Контакт P23 | FPGA_VCCINT — FPGA core supply (1.1 V) |
| Контакт N22 | FPGA_VCCIO_BANK1 — FPGA I/O supply, bank 1 |
| Контакт N23 | FPGA_VCCIO_BANK2 — FPGA I/O supply, bank 2 |
| Контакт M22 | FPGA_VCCPD — FPGA pre-driver supply (2.5/3.0 V) |
| Контакт M23 | FPGA_VCCAUX — FPGA auxiliary supply (2.5 V) |
| Контакт L22 | FPGA_VCCBAT — FPGA battery-backed supply (security key) |
| Контакт L23 | FPGA_VREFP_ADC — FPGA ADC reference positive |
Типичное применение
5CSEBA5U19C8N подходит для 6 применениеs: Industrial Machine Vision, Motor Control and Industrial Drives, Human-Machine Interface (HMI) Panels, Video Processing and Surveillance, Factory Automation Controllers, Embedded Edge Computing Nodes.
Industrial Machine Vision
The 5CSEBA5U19C8N is well suited to industrial machine vision systems because its 85,000 logic elements and 3.88 Mbit embedded memory deliver enough fabric for real-time Bayer-to-RGB conversion and object recognition, while the dual ARM Cortex-A9 MPCore runs the vision software stack (OpenCV, Linux). At a C8 commercial speed grade with a 600 MHz HPS clock, the part sustains Camera Link or GigE Vision frame rates at moderate resolutions. Placed on a 484-UBGFA footprint with a 0.8 mm ball pitch, it offers 66 user I/Os for sensor parallel interfaces plus hard EMAC/USB for host networking.
Рекомендуется
Motor Control and Industrial Drives
The 5CSEBA5U19C8N's hard Cortex-A9 MPCore plus FPGA fabric is ideal for field-oriented control (FOC) of three-phase motors, where the HPS executes the control-loop math and the FPGA fabric implements PWM generation, encoder decoding, and sigma-delta filter glue. The 32,070 ALMs provide headroom for custom acceleration, and the HPS's built-in EMAC enables Ethernet/IP or EtherCAT industrial protocols. Designers should leverage the HPS-based PWM timers and the FPGA fabric's high-resolution timing for sub-microsecond torque-loop bandwidth.
Рекомендуется
Human-Machine Interface (HMI) Panels
The 5CSEBA5U19C8N drives mid-resolution TFT-LCD HMI panels with capacitive touch by combining the dual Cortex-A9 cores (running a Qt/Linux HMI stack) with the FPGA fabric, which handles LVDS timing and pixel clock generation. The 3.88 Mbit embedded memory is sufficient for frame buffering at 800x480 resolution. Compared with a discrete MCU + FPGA approach, the SoC FPGA reduces BOM count and lets the FPGA fabric accelerate graphics primitives without CPU intervention.
Рекомендуется
Video Processing and Surveillance
In networked surveillance and video processing applications, the 5CSEBA5U19C8N offers a hard H.264 / motion-detection acceleration path inside the FPGA fabric while the Cortex-A9 cores handle ONVIF/streaming stacks. The 484-UBGFA U19 package provides 66 FPGA I/Os for camera-link serializers and DDR3 storage for compressed buffers. With the I7 industrial speed grade variant (5CSEBA5U19I7N), the part operates from -40C to +100C for outdoor PoE cameras.
Рекомендуется
Factory Automation Controllers
The 5CSEBA5U19C8N integrates EtherCAT, PROFINET, or Modbus TCP controllers by combining the HPS EMAC, the FPGA fabric's deterministic timing, and the Linux networking stack on Cortex-A9. With 85K logic elements, it can host multi-axis EtherCAT slave logic alongside protocol stacks. Compared with PLC-CPU solutions, this SoC FPGA collapses the PLC and the servo-controller onto a single 28 nm die, reducing rack space and BOM cost.
Рекомендуется
Embedded Edge Computing Nodes
The 5CSEBA5U19C8N delivers low-power edge inference in industrial IoT nodes: the dual ARM Cortex-A9 MPCore runs TensorFlow Lite or similar ML frameworks while the FPGA fabric pre-processes sensor data. At 600 MHz commercial C8 grade, the HPS provides sufficient throughput for inferencing at the edge, while the 28 nm low-power process keeps thermal dissipation manageable in sealed enclosures. The integrated DDR3 controller with ECC support is a clear advantage over microcontrollers for memory-bound ML workloads.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для 5CSEBA5U19C8N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | 5CSEBA4U19C8N | 5CSEBA5U19I7N | 5CSEBA5U19C7N | 5CSEBA5U19C6N | 5CSEBA5U19C7SN |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-UBGA (U19, 19x19 mm) | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same |
| Logic Elements | 85,000 LE | 40,000 LE (-53%) | 85,000 LE (same) | 85,000 LE (same) | 85,000 LE (same) | 85,000 LE (same) |
| Speed Grade | C8 (0.85 ns, commercial) | C8 (0.85 ns, commercial) | I7 (1.04 ns, industrial) | C7 (0.77 ns, commercial) | C6 (0.69 ns, commercial) | C7S (industrial tape-and-reel) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Processor | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process Technology | 28 nm TSMC | 28 nm TSMC | 28 nm TSMC | 28 nm TSMC | 28 nm TSMC | 28 nm TSMC |
Ключевые отличия
- Higher logic density than A4 tier with same footprint (против 5CSEBA4U19C8N)
- Commercial temperature grade with C8 speed grade (против 5CSEBA5U19I7N)
- Hard dual-core ARM Cortex-A9 vs soft-core alternatives (против Discreet MCU + FPGA)
Заметки по проектированию
The 484-UBGFA U19 package uses a 0.8 mm ball pitch, which requires ENIG finish on the PCB for reliable assembly. According to Intel's Cyclone V device handbook, designers should use a 6+6+ stack-up with a dedicated ground plane beneath the HPS_DDR balls to meet DDR3 SI requirements. Via-in-pad (VIPPO) is recommended for the HPS_DDR signal balls to minimize stub length; non-signal balls should use dog-bone fan-out. Decoupling follows Intel's PDN guidelines: 0.1 uF X7R per power pin within 50 mil of the package.
Estimated: under typical industrial SoC FPGA workloads (Linux plus 50% FPGA utilization at 600 MHz), the 5CSEBA5U19C8N dissipates around 3-5 W. The UBGFA package's theta_JA is approximately 14 C/W with a 4-layer JEDEC test board, which yields a 42-70 C junction rise over ambient. A solid ground plane beneath the package and 8 thermal vias per quadrant are required; the C8 commercial speed grade parts are rated up to 0C-85C and may need airflow above 70C ambient. For -40C to +100C industrial applications, use the I7 speed grade variant instead.
Three common pitfalls: (1) Boot mode pins MSEL[4:0] must be set correctly - the HPS boots first and then optionally configures the FPGA; mis-configured MSEL causes silent boot failures. (2) HPS reset topology requires a watchdog-aware power-on sequence; tying HPS_COLD_RSTn directly to the system POR without sequencing the FPGA nCONFIG can deadlock the boot. (3) The 1.1 V VCCINT must ramp monotonically in <100 ms; failure to do so triggers POR but may also degrade the FPGA fabric over time.
Информация о соответствии
Lead-free per the trailing 'N' order-code suffix and Intel product page. Commercial C8 grade is not AEC-Q100 qualified - choose the I7 industrial grade variant for automotive-adjacent applications. RoHS and conflict-minerals status confirmed on the official Intel product page.
