5CSEBA5U19C8N - Cyclone V SE SoC FPGA, 85K LE, Dual ARM Cortex-A9 | Intel
MPN: 5CSEBA5U19C8N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 100 | $230 | $23,000.00 |
| 250 | $210 | $52,500.00 |
| 500 | $195 | $97,500.00 |
Drop-in alternatives for 5CSEBA5U19C8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CSEBA4U19C8N
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View Datasheet β5CSEBA5U19C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE (SoC FPGA) |
| Logic Elements | 85,000 LE |
| Adaptive Logic Modules (ALMs) | 32,070 ALM |
| Embedded Memory | 3.88 Mbit |
| Processor Cores | Dual ARM Cortex-A9 MPCore |
| Core Maximum Frequency | 925 MHz (datasheet); 600 MHz commercial speed grade |
| L1 Cache (Instruction) | 2 x 32 kB |
| L1 Cache (Data) | 2 x 32 kB |
| L2 Cache | 512 kB shared |
| FPGA User I/Os | 66 I/O |
| Process Technology | 28 nm TSMC |
| Core Voltage | 1.1 V |
| Mounting Type | Surface Mount (SMD/SMT) |
| Package | 484-UBGA (U19, 19x19 mm) |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | C8 (0.85 ns, commercial) |
| RoHS Status | Compliant |
5CSEBA5U19C8N Pin Configuration
| Pin F22 | HPS_DDR_A0 β HPS DDR SDRAM address 0 |
| Pin F23 | HPS_DDR_A1 β HPS DDR SDRAM address 1 |
| Pin G22 | HPS_DDR_A2 β HPS DDR SDRAM address 2 |
| Pin G23 | HPS_DDR_A3 β HPS DDR SDRAM address 3 |
| Pin AA14 | HPS_DDR_DQ0 β HPS DDR data lane 0 |
| Pin AA15 | HPS_DDR_DQ1 β HPS DDR data lane 1 |
| Pin Y14 | HPS_DDR_DQ2 β HPS DDR data lane 2 |
| Pin Y15 | HPS_DDR_DQ3 β HPS DDR data lane 3 |
| Pin Y16 | HPS_DQS0P β HPS DDR data strobe 0 positive |
| Pin Y17 | HPS_DQS0N β HPS DDR data strobe 0 negative |
| Pin AB14 | HPS_EMAC_TX_CLK β HPS Ethernet MAC transmit clock |
| Pin AB15 | HPS_EMAC_RX_CLK β HPS Ethernet MAC receive clock |
| Pin AB16 | HPS_EMAC_TXD0 β HPS Ethernet MAC transmit data 0 |
| Pin AB17 | HPS_EMAC_RXD0 β HPS Ethernet MAC receive data 0 |
| Pin AC14 | HPS_USB_DP0 β HPS USB 2.0 data plus 0 |
| Pin AC15 | HPS_USB_DM0 β HPS USB 2.0 data minus 0 |
| Pin AD14 | HPS_SDMMC_CLK β HPS SD/MMC clock |
| Pin AD15 | HPS_SDMMC_CMD β HPS SD/MMC command |
| Pin AE14 | HPS_SDMMC_D0 β HPS SD/MMC data 0 |
| Pin AE15 | HPS_SDMMC_D1 β HPS SD/MMC data 1 |
| Pin AE16 | HPS_GPIO0 β HPS general-purpose IO bank 0 |
| Pin AE17 | HPS_GPIO1 β HPS general-purpose IO bank 1 |
| Pin AF14 | HPS_OSC_CLK1 β HPS oscillator clock input 1 |
| Pin AF15 | HPS_POR_RSTn β HPS power-on reset (active low) |
| Pin AF16 | HPS_TEST_MODE β HPS test mode pin (tie to GND in production) |
| Pin V22 | FPGA_FB_IO0 β FPGA user I/O bank 0 |
| Pin V23 | FPGA_FB_IO1 β FPGA user I/O bank 1 |
| Pin U22 | FPGA_CONF_DONE β FPGA configuration done signal |
| Pin U23 | FPGA_NCONFIG β FPGA configuration start (active low) |
| Pin T22 | FPGA_TMS β JTAG test mode select |
| Pin T23 | FPGA_TCK β JTAG test clock |
| Pin R22 | FPGA_TDI β JTAG test data in |
| Pin R23 | FPGA_TDO β JTAG test data out |
| Pin P22 | FPGA_GND β FPGA ground (multiple GND balls on package) |
| Pin P23 | FPGA_VCCINT β FPGA core supply (1.1 V) |
| Pin N22 | FPGA_VCCIO_BANK1 β FPGA I/O supply, bank 1 |
| Pin N23 | FPGA_VCCIO_BANK2 β FPGA I/O supply, bank 2 |
| Pin M22 | FPGA_VCCPD β FPGA pre-driver supply (2.5/3.0 V) |
| Pin M23 | FPGA_VCCAUX β FPGA auxiliary supply (2.5 V) |
| Pin L22 | FPGA_VCCBAT β FPGA battery-backed supply (security key) |
| Pin L23 | FPGA_VREFP_ADC β FPGA ADC reference positive |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA5U19C8N is suitable for 6 applications: Industrial Machine Vision, Motor Control and Industrial Drives, Human-Machine Interface (HMI) Panels, Video Processing and Surveillance, Factory Automation Controllers, Embedded Edge Computing Nodes.
Industrial Machine Vision
The 5CSEBA5U19C8N is well suited to industrial machine vision systems because its 85,000 logic elements and 3.88 Mbit embedded memory deliver enough fabric for real-time Bayer-to-RGB conversion and object recognition, while the dual ARM Cortex-A9 MPCore runs the vision software stack (OpenCV, Linux). At a C8 commercial speed grade with a 600 MHz HPS clock, the part sustains Camera Link or GigE Vision frame rates at moderate resolutions. Placed on a 484-UBGFA footprint with a 0.8 mm ball pitch, it offers 66 user I/Os for sensor parallel interfaces plus hard EMAC/USB for host networking.
Recommended
Motor Control and Industrial Drives
The 5CSEBA5U19C8N's hard Cortex-A9 MPCore plus FPGA fabric is ideal for field-oriented control (FOC) of three-phase motors, where the HPS executes the control-loop math and the FPGA fabric implements PWM generation, encoder decoding, and sigma-delta filter glue. The 32,070 ALMs provide headroom for custom acceleration, and the HPS's built-in EMAC enables Ethernet/IP or EtherCAT industrial protocols. Designers should leverage the HPS-based PWM timers and the FPGA fabric's high-resolution timing for sub-microsecond torque-loop bandwidth.
Recommended
Human-Machine Interface (HMI) Panels
The 5CSEBA5U19C8N drives mid-resolution TFT-LCD HMI panels with capacitive touch by combining the dual Cortex-A9 cores (running a Qt/Linux HMI stack) with the FPGA fabric, which handles LVDS timing and pixel clock generation. The 3.88 Mbit embedded memory is sufficient for frame buffering at 800x480 resolution. Compared with a discrete MCU + FPGA approach, the SoC FPGA reduces BOM count and lets the FPGA fabric accelerate graphics primitives without CPU intervention.
Recommended
Video Processing and Surveillance
In networked surveillance and video processing applications, the 5CSEBA5U19C8N offers a hard H.264 / motion-detection acceleration path inside the FPGA fabric while the Cortex-A9 cores handle ONVIF/streaming stacks. The 484-UBGFA U19 package provides 66 FPGA I/Os for camera-link serializers and DDR3 storage for compressed buffers. With the I7 industrial speed grade variant (5CSEBA5U19I7N), the part operates from -40C to +100C for outdoor PoE cameras.
Recommended
Factory Automation Controllers
The 5CSEBA5U19C8N integrates EtherCAT, PROFINET, or Modbus TCP controllers by combining the HPS EMAC, the FPGA fabric's deterministic timing, and the Linux networking stack on Cortex-A9. With 85K logic elements, it can host multi-axis EtherCAT slave logic alongside protocol stacks. Compared with PLC-CPU solutions, this SoC FPGA collapses the PLC and the servo-controller onto a single 28 nm die, reducing rack space and BOM cost.
Recommended
Embedded Edge Computing Nodes
The 5CSEBA5U19C8N delivers low-power edge inference in industrial IoT nodes: the dual ARM Cortex-A9 MPCore runs TensorFlow Lite or similar ML frameworks while the FPGA fabric pre-processes sensor data. At 600 MHz commercial C8 grade, the HPS provides sufficient throughput for inferencing at the edge, while the 28 nm low-power process keeps thermal dissipation manageable in sealed enclosures. The integrated DDR3 controller with ECC support is a clear advantage over microcontrollers for memory-bound ML workloads.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA5U19C8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA4U19C8N | 5CSEBA5U19I7N | 5CSEBA5U19C7N | 5CSEBA5U19C6N | 5CSEBA5U19C7SN |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-UBGA (U19, 19x19 mm) | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same |
| Logic Elements | 85,000 LE | 40,000 LE (-53%) | 85,000 LE (same) | 85,000 LE (same) | 85,000 LE (same) | 85,000 LE (same) |
| Speed Grade | C8 (0.85 ns, commercial) | C8 (0.85 ns, commercial) | I7 (1.04 ns, industrial) | C7 (0.77 ns, commercial) | C6 (0.69 ns, commercial) | C7S (industrial tape-and-reel) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Processor | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Embedded Memory | 3.88 Mbit | [DATA_NEEDED] | 3.88 Mbit | 3.88 Mbit | 3.88 Mbit | 3.88 Mbit |
| FPGA User I/Os | 66 I/O | [DATA_NEEDED] | 66 I/O | 66 I/O | 66 I/O | 66 I/O |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process Technology | 28 nm TSMC | 28 nm TSMC | 28 nm TSMC | 28 nm TSMC | 28 nm TSMC | 28 nm TSMC |
Key Differentiators
- Higher logic density than A4 tier with same footprint (vs 5CSEBA4U19C8N)
- Commercial temperature grade with C8 speed grade (vs 5CSEBA5U19I7N)
- Hard dual-core ARM Cortex-A9 vs soft-core alternatives (vs Discreet MCU + FPGA)
Design Notes
The 484-UBGFA U19 package uses a 0.8 mm ball pitch, which requires ENIG finish on the PCB for reliable assembly. According to Intel's Cyclone V device handbook, designers should use a 6+6+ stack-up with a dedicated ground plane beneath the HPS_DDR balls to meet DDR3 SI requirements. Via-in-pad (VIPPO) is recommended for the HPS_DDR signal balls to minimize stub length; non-signal balls should use dog-bone fan-out. Decoupling follows Intel's PDN guidelines: 0.1 uF X7R per power pin within 50 mil of the package.
Estimated: under typical industrial SoC FPGA workloads (Linux plus 50% FPGA utilization at 600 MHz), the 5CSEBA5U19C8N dissipates around 3-5 W. The UBGFA package's theta_JA is approximately 14 C/W with a 4-layer JEDEC test board, which yields a 42-70 C junction rise over ambient. A solid ground plane beneath the package and 8 thermal vias per quadrant are required; the C8 commercial speed grade parts are rated up to 0C-85C and may need airflow above 70C ambient. For -40C to +100C industrial applications, use the I7 speed grade variant instead.
Three common pitfalls: (1) Boot mode pins MSEL[4:0] must be set correctly - the HPS boots first and then optionally configures the FPGA; mis-configured MSEL causes silent boot failures. (2) HPS reset topology requires a watchdog-aware power-on sequence; tying HPS_COLD_RSTn directly to the system POR without sequencing the FPGA nCONFIG can deadlock the boot. (3) The 1.1 V VCCINT must ramp monotonically in <100 ms; failure to do so triggers POR but may also degrade the FPGA fabric over time.
Compliance Information
Lead-free per the trailing 'N' order-code suffix and Intel product page. Commercial C8 grade is not AEC-Q100 qualified - choose the I7 industrial grade variant for automotive-adjacent applications. RoHS and conflict-minerals status confirmed on the official Intel product page.
