A3P1000-2FGG144 - ProASIC3 FPGA, 1M Gates, 144-FBGA | Microchip
Référence : A3P1000-2FGG144 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $34 | $3 400,00 |
| 500 | $30.6 | $15 300,00 |
| 1 000 | $27.2 | $27 200,00 |
A3P1000-2FGG144 Présentation
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. Unlike fixed-function ASICs, FPGAs offer in-field reprogrammability, rapid prototyping, and lower non-recurring engineering costs. The ProASIC3 family sits within the broader hierarchy of programmable logic devices, specifically flash-based FPGAs, which retain configuration without external boot memory, distinguishing them from SRAM-based FPGAs that require a configuration device on every power-up.
Key features of the A3P1000-2FGG144 include 1 million system gates, 97 user I/Os, 147,456 bits of flash memory, and support for multiple I/O standards including LVCMOS, LVTTL, and PCI. The device is lead-free and RoHS compliant, and it offers low power consumption with a 1.5V core supply. Its flash-based architecture provides instant-on capability, high security against reverse engineering, and immunity to single-event upsets, making it suitable for mission-critical systems.
Technically, the ProASIC3 family is built on a 130nm flash process, which enables non-volatile configuration storage on-chip. This eliminates the need for external configuration PROMs, reduces board space, and simplifies power sequencing. The device supports up to 310 MHz system performance and includes four I/O banks with dedicated supply pins, allowing flexible voltage standard assignment. The 144-pin FBGA package measures 13x13 mm with a 0.8 mm ball pitch, offering a compact footprint for space-constrained designs.
Typical applications include industrial control, automotive electronics, communications infrastructure, and aerospace systems where reliability, security, and instant-on operation are critical. The A3P1000-2FGG144 is also used in motor control, power management, and data acquisition systems that require moderate logic density and high I/O count.
When designing with this FPGA, ensure proper decoupling of the 1.5V core supply and each VCCIBx bank supply with 0.1uF and 10uF capacitors placed close to the pins. The flash-based architecture requires no configuration device, but the JTAG interface must be accessible for programming and boundary-scan testing.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P1000-2FGG144 in their designs.
Alternatives de remplacement direct pour A3P1000-2FGG144 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3P1000-2FGG144 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Family, RoHS Status, System Gates.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3P1000-2FGG144I
✅ Remplacement direct✓ En stock
$27.2 / unité
Voir la fiche technique →A3P1000-1FGG144T
✅ Remplacement direct✓ En stock
$75 / unité
Voir la fiche technique →A3P1000-FG144T
✅ Remplacement direct✓ En stock
$27.2 / unité
Voir la fiche technique →A3P1000-FGG144I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P1000-FG144
✅ Remplacement direct✓ En stock
$27.2 / unité
Voir la fiche technique →A3P1000-1FGG144T
✅ Remplacement direct✓ En stock
$75 / unité
Voir la fiche technique →A3P1000-2FGG144 Valeurs maximales et caractéristiques électriques
| Family | ProASIC3 |
| System Gates | 1,000,000 |
| User I/Os | 97 |
| Flash Memory Bits | 147,456 |
| Core Voltage | 1.5 V |
| System Performance | 310 MHz |
| Boîtier | 144-FBGA (FGG144) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +85C (commercial) |
| I/O Standards | LVCMOS, LVTTL, PCI |
| Number of I/O Banks | 4 |
| Lead-Free | Yes |
| Statut RoHS | Compliant |
| Technology | 130nm Flash |
| Configuration | Flash-based, non-volatile |
Configuration des broches de A3P1000-2FGG144
| Broche 1 | IO — User I/O (bank-dependent) |
| Broche 2 | IO — User I/O (bank-dependent) |
| Broche 3 | IO — User I/O (bank-dependent) |
| Broche 4 | IO — User I/O (bank-dependent) |
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| Broche 96 | IO — User I/O (bank-dependent) |
| Broche 97 | IO — User I/O (bank-dependent) |
| Broche 98 | VCC — Core power supply (1.5V) |
| Broche 99 | GND — Ground |
| Broche 100 | VCC — Core power supply (1.5V) |
| Broche 101 | GND — Ground |
| Broche 102 | VCC — Core power supply (1.5V) |
| Broche 103 | GND — Ground |
| Broche 104 | VCC — Core power supply (1.5V) |
| Broche 105 | GND — Ground |
| Broche 106 | VCC — Core power supply (1.5V) |
| Broche 107 | GND — Ground |
| Broche 108 | VCC — Core power supply (1.5V) |
| Broche 109 | GND — Ground |
| Broche 110 | VCC — Core power supply (1.5V) |
| Broche 111 | GND — Ground |
| Broche 112 | VCC — Core power supply (1.5V) |
| Broche 113 | GND — Ground |
| Broche 114 | VCC — Core power supply (1.5V) |
| Broche 115 | GND — Ground |
| Broche 116 | VCC — Core power supply (1.5V) |
| Broche 117 | GND — Ground |
| Broche 118 | VCC — Core power supply (1.5V) |
| Broche 119 | GND — Ground |
| Broche 120 | VCC — Core power supply (1.5V) |
| Broche 121 | GND — Ground |
| Broche 122 | VCC — Core power supply (1.5V) |
| Broche 123 | GND — Ground |
| Broche 124 | VCC — Core power supply (1.5V) |
| Broche 125 | GND — Ground |
| Broche 126 | VCC — Core power supply (1.5V) |
| Broche 127 | GND — Ground |
| Broche 128 | VCC — Core power supply (1.5V) |
| Broche 129 | GND — Ground |
| Broche 130 | VCC — Core power supply (1.5V) |
| Broche 131 | GND — Ground |
| Broche 132 | VCC — Core power supply (1.5V) |
| Broche 133 | GND — Ground |
| Broche 134 | VCC — Core power supply (1.5V) |
| Broche 135 | GND — Ground |
| Broche 136 | VCC — Core power supply (1.5V) |
| Broche 137 | GND — Ground |
| Broche 138 | VCC — Core power supply (1.5V) |
| Broche 139 | GND — Ground |
| Broche 140 | VCC — Core power supply (1.5V) |
| Broche 141 | GND — Ground |
| Broche 142 | VCC — Core power supply (1.5V) |
| Broche 143 | GND — Ground |
| Broche 144 | VCC — Core power supply (1.5V) |
Applications typiques
A3P1000-2FGG144 convient pour 6 applications: Industrial Control, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Medical Electronics, Data Acquisition and Test Equipment.
Industrial Control
The A3P1000-2FGG144 is ideal for industrial control systems such as PLCs, motor control, and factory automation. Its 1 million system gates and 97 I/Os provide ample logic resources for implementing custom control algorithms, communication interfaces, and sensor processing. The flash-based architecture ensures instant-on operation and high reliability in harsh industrial environments, with no external configuration memory required. The 1.5V core voltage and low power consumption make it suitable for power-sensitive applications. Its 310 MHz system performance supports real-time control loops and high-speed data acquisition. The device's security features protect intellectual property from reverse engineering, which is critical in competitive industrial markets.
Recommandé
Automotive Electronics
The A3P1000-2FGG144 is used in automotive electronics for applications such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). Its flash-based FPGA provides high reliability and immunity to single-event upsets, which is essential for safety-critical automotive functions. The device's 1 million gates and 97 I/Os enable integration of multiple functions like CAN bus interfaces, sensor fusion, and display control. The 1.5V core voltage and low power consumption help meet stringent automotive power budgets. The commercial temperature range (0C to +85C) is suitable for many automotive applications, but for under-hood environments, the industrial temperature variant (A3P1000-2FGG144I) is recommended. The device's instant-on capability ensures immediate operation upon power-up, which is critical for safety systems.
Recommandé
Communications Infrastructure
The A3P1000-2FGG144 is well-suited for communications infrastructure including network routers, switches, and base stations. Its 1 million system gates and 97 I/Os allow implementation of protocol processing, packet buffering, and interface bridging. The device supports multiple I/O standards such as LVCMOS, LVTTL, and PCI, enabling direct connection to various communication interfaces. The 310 MHz system performance handles high-speed data paths, while the flash-based architecture provides secure configuration storage, protecting against unauthorized access. The 1.5V core voltage and low power consumption are advantageous for densely populated line cards. The 144-FBGA package's compact footprint saves board space in space-constrained networking equipment. The device's reliability and long-term availability make it suitable for infrastructure deployments with extended lifecycles.
Recommandé
Aerospace and Defense
The A3P1000-2FGG144 is used in aerospace and defense systems such as avionics, satellite payloads, and radar processing. Its flash-based FPGA offers high reliability, radiation tolerance, and security against reverse engineering, which are critical for defense applications. The 1 million system gates and 97 I/Os provide sufficient resources for implementing complex signal processing, telemetry, and control functions. The device's instant-on capability ensures immediate operation in mission-critical scenarios. The 1.5V core voltage and low power consumption are essential for power-constrained satellite and UAV platforms. The commercial temperature range may be limiting for some aerospace applications, so the industrial temperature variant (A3P1000-2FGG144I) is often preferred. The device's non-volatile configuration eliminates the need for external boot memory, reducing system complexity and improving reliability.
Recommandé
Medical Electronics
The A3P1000-2FGG144 is suitable for medical electronics such as patient monitoring systems, diagnostic imaging, and portable medical devices. Its 1 million system gates and 97 I/Os enable implementation of signal processing, data acquisition, and user interface control. The flash-based architecture provides high reliability and secure configuration, which is important for medical devices that must meet stringent regulatory requirements. The 1.5V core voltage and low power consumption are beneficial for battery-powered portable devices. The device's instant-on capability ensures immediate readiness in critical medical situations. The 144-FBGA package's small footprint is ideal for compact medical devices. The commercial temperature range is typically sufficient for indoor medical environments. The device's long-term availability and reliability make it a trusted choice for medical equipment manufacturers.
Recommandé
Data Acquisition and Test Equipment
The A3P1000-2FGG144 is ideal for data acquisition systems and test equipment such as oscilloscopes, logic analyzers, and data loggers. Its 1 million system gates and 97 I/Os allow implementation of high-speed data capture, triggering, and processing logic. The device supports multiple I/O standards, enabling interface with various sensors and ADCs. The 310 MHz system performance handles high-bandwidth data streams, while the flash-based architecture provides secure and reliable configuration. The 1.5V core voltage and low power consumption are advantageous for portable test instruments. The 144-FBGA package's compact size fits well in benchtop and handheld equipment. The device's reprogrammability allows firmware updates and feature enhancements in the field, extending product lifespan. The commercial temperature range is suitable for typical lab environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3P1000-2FGG144 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3P1000-2FGG144I | A3P1000-1FGG144T | A3P1000-FG144T | A3P1000-FGG144I | A3P1000-FG144 |
|---|---|---|---|---|---|---|
| Package | 144-FBGA (FGG144) | 144-FBGA (FGG144) - same | 144-FBGA (FGG144) - same | 144-FBGA (FGG144) - same | 144-FBGA (FGG144) - same | 144-FBGA (FGG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| User I/Os | 97 | 97 | 97 | 97 | 97 | 97 |
| Speed Grade | -2 | -2 | -1 | Standard | Standard | Standard |
| Temperature Range | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C |
| Packaging | Tray | Tray | Tape & Reel | Tape & Reel | Tray | Tray |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
Principaux différenciateurs
- Flash-based non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- 1 million system gates in a 144-FBGA package (vs A3P600-2FGG144)
- Speed grade -2 for higher performance (vs A3P1000-FG144 (standard speed))
Notes de conception
The A3P1000-2FGG144 requires a 1.5V core supply and separate I/O bank supplies (VCCIBx). Decouple each supply pin with a 0.1uF ceramic capacitor placed as close to the pin as possible, and add a 10uF bulk capacitor per supply rail. Estimated: For a design with 50% I/O toggling at 100 MHz, core current can reach approximately 150 mA, so ensure the regulator can supply at least 200 mA with margin. Refer to the Microchip ProASIC3 power estimation spreadsheet for accurate calculations.
For the 144-FBGA package, use a 4-layer PCB minimum with dedicated power and ground planes. Route high-speed I/Os with controlled impedance (e.g., 50 ohm single-ended) and keep trace lengths matched for differential pairs. Place decoupling capacitors on the bottom side directly under the FPGA to minimize loop inductance. Follow the layout guidelines in the ProASIC3 FPGA Layout Guidelines application note for optimal signal integrity.
A common pitfall is forgetting to connect all VCC and GND pins, which can cause erratic behavior or damage. Ensure all power pins are connected to the correct voltage levels and that no I/O is left floating unless intended. Also, the flash-based FPGA does not require external configuration, but the JTAG pins must be accessible for programming. Do not apply I/O voltages before the core supply is stable to avoid latch-up.
Informations de conformité
Lead-free and RoHS compliant per distributor listings. AEC-Q100 qualification not specified for this part.
