A3P1000-2FGG144 - ProASIC3 FPGA, 1M Gates, 144-FBGA | Microchip
N.º da peça: A3P1000-2FGG144 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $34 | $3.400,00 |
| 500 | $30.6 | $15.300,00 |
| 1.000 | $27.2 | $27.200,00 |
A3P1000-2FGG144 Visão geral
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. Unlike fixed-function ASICs, FPGAs offer in-field reprogrammability, rapid prototyping, and lower non-recurring engineering costs. The ProASIC3 family sits within the broader hierarchy of programmable logic devices, specifically flash-based FPGAs, which retain configuration without external boot memory, distinguishing them from SRAM-based FPGAs that require a configuration device on every power-up.
Key features of the A3P1000-2FGG144 include 1 million system gates, 97 user I/Os, 147,456 bits of flash memory, and support for multiple I/O standards including LVCMOS, LVTTL, and PCI. The device is lead-free and RoHS compliant, and it offers low power consumption with a 1.5V core supply. Its flash-based architecture provides instant-on capability, high security against reverse engineering, and immunity to single-event upsets, making it suitable for mission-critical systems.
Technically, the ProASIC3 family is built on a 130nm flash process, which enables non-volatile configuration storage on-chip. This eliminates the need for external configuration PROMs, reduces board space, and simplifies power sequencing. The device supports up to 310 MHz system performance and includes four I/O banks with dedicated supply pins, allowing flexible voltage standard assignment. The 144-pin FBGA package measures 13x13 mm with a 0.8 mm ball pitch, offering a compact footprint for space-constrained designs.
Typical applications include industrial control, automotive electronics, communications infrastructure, and aerospace systems where reliability, security, and instant-on operation are critical. The A3P1000-2FGG144 is also used in motor control, power management, and data acquisition systems that require moderate logic density and high I/O count.
When designing with this FPGA, ensure proper decoupling of the 1.5V core supply and each VCCIBx bank supply with 0.1uF and 10uF capacitors placed close to the pins. The flash-based architecture requires no configuration device, but the JTAG interface must be accessible for programming and boundary-scan testing.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P1000-2FGG144 in their designs.
Alternativas drop-in para A3P1000-2FGG144 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P1000-2FGG144 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Family, RoHS Status, System Gates.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P1000-2FGG144I
✅ Drop-In✓ Em estoque
$27.2 / unidade
Ver ficha técnica →A3P1000-1FGG144T
✅ Drop-In✓ Em estoque
$75 / unidade
Ver ficha técnica →A3P1000-FG144T
✅ Drop-In✓ Em estoque
$27.2 / unidade
Ver ficha técnica →A3P1000-FGG144I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P1000-FG144
✅ Drop-In✓ Em estoque
$27.2 / unidade
Ver ficha técnica →A3P1000-1FGG144T
✅ Drop-In✓ Em estoque
$75 / unidade
Ver ficha técnica →A3P1000-2FGG144 Classificações máximas e características elétricas
| Family | ProASIC3 |
| System Gates | 1,000,000 |
| User I/Os | 97 |
| Flash Memory Bits | 147,456 |
| Core Voltage | 1.5 V |
| System Performance | 310 MHz |
| Encapsulamento | 144-FBGA (FGG144) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0C to +85C (commercial) |
| I/O Standards | LVCMOS, LVTTL, PCI |
| Number of I/O Banks | 4 |
| Lead-Free | Yes |
| Status RoHS | Compliant |
| Technology | 130nm Flash |
| Configuration | Flash-based, non-volatile |
Configuração de pinos do A3P1000-2FGG144
| Pino 1 | IO — User I/O (bank-dependent) |
| Pino 2 | IO — User I/O (bank-dependent) |
| Pino 3 | IO — User I/O (bank-dependent) |
| Pino 4 | IO — User I/O (bank-dependent) |
| Pino 5 | IO — User I/O (bank-dependent) |
| Pino 6 | IO — User I/O (bank-dependent) |
| Pino 7 | IO — User I/O (bank-dependent) |
| Pino 8 | IO — User I/O (bank-dependent) |
| Pino 9 | IO — User I/O (bank-dependent) |
| Pino 10 | IO — User I/O (bank-dependent) |
| Pino 11 | IO — User I/O (bank-dependent) |
| Pino 12 | IO — User I/O (bank-dependent) |
| Pino 13 | IO — User I/O (bank-dependent) |
| Pino 14 | IO — User I/O (bank-dependent) |
| Pino 15 | IO — User I/O (bank-dependent) |
| Pino 16 | IO — User I/O (bank-dependent) |
| Pino 17 | IO — User I/O (bank-dependent) |
| Pino 18 | IO — User I/O (bank-dependent) |
| Pino 19 | IO — User I/O (bank-dependent) |
| Pino 20 | IO — User I/O (bank-dependent) |
| Pino 21 | IO — User I/O (bank-dependent) |
| Pino 22 | IO — User I/O (bank-dependent) |
| Pino 23 | IO — User I/O (bank-dependent) |
| Pino 24 | IO — User I/O (bank-dependent) |
| Pino 25 | IO — User I/O (bank-dependent) |
| Pino 26 | IO — User I/O (bank-dependent) |
| Pino 27 | IO — User I/O (bank-dependent) |
| Pino 28 | IO — User I/O (bank-dependent) |
| Pino 29 | IO — User I/O (bank-dependent) |
| Pino 30 | IO — User I/O (bank-dependent) |
| Pino 31 | IO — User I/O (bank-dependent) |
| Pino 32 | IO — User I/O (bank-dependent) |
| Pino 33 | IO — User I/O (bank-dependent) |
| Pino 34 | IO — User I/O (bank-dependent) |
| Pino 35 | IO — User I/O (bank-dependent) |
| Pino 36 | IO — User I/O (bank-dependent) |
| Pino 37 | IO — User I/O (bank-dependent) |
| Pino 38 | IO — User I/O (bank-dependent) |
| Pino 39 | IO — User I/O (bank-dependent) |
| Pino 40 | IO — User I/O (bank-dependent) |
| Pino 41 | IO — User I/O (bank-dependent) |
| Pino 42 | IO — User I/O (bank-dependent) |
| Pino 43 | IO — User I/O (bank-dependent) |
| Pino 44 | IO — User I/O (bank-dependent) |
| Pino 45 | IO — User I/O (bank-dependent) |
| Pino 46 | IO — User I/O (bank-dependent) |
| Pino 47 | IO — User I/O (bank-dependent) |
| Pino 48 | IO — User I/O (bank-dependent) |
| Pino 49 | IO — User I/O (bank-dependent) |
| Pino 50 | IO — User I/O (bank-dependent) |
| Pino 51 | IO — User I/O (bank-dependent) |
| Pino 52 | IO — User I/O (bank-dependent) |
| Pino 53 | IO — User I/O (bank-dependent) |
| Pino 54 | IO — User I/O (bank-dependent) |
| Pino 55 | IO — User I/O (bank-dependent) |
| Pino 56 | IO — User I/O (bank-dependent) |
| Pino 57 | IO — User I/O (bank-dependent) |
| Pino 58 | IO — User I/O (bank-dependent) |
| Pino 59 | IO — User I/O (bank-dependent) |
| Pino 60 | IO — User I/O (bank-dependent) |
| Pino 61 | IO — User I/O (bank-dependent) |
| Pino 62 | IO — User I/O (bank-dependent) |
| Pino 63 | IO — User I/O (bank-dependent) |
| Pino 64 | IO — User I/O (bank-dependent) |
| Pino 65 | IO — User I/O (bank-dependent) |
| Pino 66 | IO — User I/O (bank-dependent) |
| Pino 67 | IO — User I/O (bank-dependent) |
| Pino 68 | IO — User I/O (bank-dependent) |
| Pino 69 | IO — User I/O (bank-dependent) |
| Pino 70 | IO — User I/O (bank-dependent) |
| Pino 71 | IO — User I/O (bank-dependent) |
| Pino 72 | IO — User I/O (bank-dependent) |
| Pino 73 | IO — User I/O (bank-dependent) |
| Pino 74 | IO — User I/O (bank-dependent) |
| Pino 75 | IO — User I/O (bank-dependent) |
| Pino 76 | IO — User I/O (bank-dependent) |
| Pino 77 | IO — User I/O (bank-dependent) |
| Pino 78 | IO — User I/O (bank-dependent) |
| Pino 79 | IO — User I/O (bank-dependent) |
| Pino 80 | IO — User I/O (bank-dependent) |
| Pino 81 | IO — User I/O (bank-dependent) |
| Pino 82 | IO — User I/O (bank-dependent) |
| Pino 83 | IO — User I/O (bank-dependent) |
| Pino 84 | IO — User I/O (bank-dependent) |
| Pino 85 | IO — User I/O (bank-dependent) |
| Pino 86 | IO — User I/O (bank-dependent) |
| Pino 87 | IO — User I/O (bank-dependent) |
| Pino 88 | IO — User I/O (bank-dependent) |
| Pino 89 | IO — User I/O (bank-dependent) |
| Pino 90 | IO — User I/O (bank-dependent) |
| Pino 91 | IO — User I/O (bank-dependent) |
| Pino 92 | IO — User I/O (bank-dependent) |
| Pino 93 | IO — User I/O (bank-dependent) |
| Pino 94 | IO — User I/O (bank-dependent) |
| Pino 95 | IO — User I/O (bank-dependent) |
| Pino 96 | IO — User I/O (bank-dependent) |
| Pino 97 | IO — User I/O (bank-dependent) |
| Pino 98 | VCC — Core power supply (1.5V) |
| Pino 99 | GND — Ground |
| Pino 100 | VCC — Core power supply (1.5V) |
| Pino 101 | GND — Ground |
| Pino 102 | VCC — Core power supply (1.5V) |
| Pino 103 | GND — Ground |
| Pino 104 | VCC — Core power supply (1.5V) |
| Pino 105 | GND — Ground |
| Pino 106 | VCC — Core power supply (1.5V) |
| Pino 107 | GND — Ground |
| Pino 108 | VCC — Core power supply (1.5V) |
| Pino 109 | GND — Ground |
| Pino 110 | VCC — Core power supply (1.5V) |
| Pino 111 | GND — Ground |
| Pino 112 | VCC — Core power supply (1.5V) |
| Pino 113 | GND — Ground |
| Pino 114 | VCC — Core power supply (1.5V) |
| Pino 115 | GND — Ground |
| Pino 116 | VCC — Core power supply (1.5V) |
| Pino 117 | GND — Ground |
| Pino 118 | VCC — Core power supply (1.5V) |
| Pino 119 | GND — Ground |
| Pino 120 | VCC — Core power supply (1.5V) |
| Pino 121 | GND — Ground |
| Pino 122 | VCC — Core power supply (1.5V) |
| Pino 123 | GND — Ground |
| Pino 124 | VCC — Core power supply (1.5V) |
| Pino 125 | GND — Ground |
| Pino 126 | VCC — Core power supply (1.5V) |
| Pino 127 | GND — Ground |
| Pino 128 | VCC — Core power supply (1.5V) |
| Pino 129 | GND — Ground |
| Pino 130 | VCC — Core power supply (1.5V) |
| Pino 131 | GND — Ground |
| Pino 132 | VCC — Core power supply (1.5V) |
| Pino 133 | GND — Ground |
| Pino 134 | VCC — Core power supply (1.5V) |
| Pino 135 | GND — Ground |
| Pino 136 | VCC — Core power supply (1.5V) |
| Pino 137 | GND — Ground |
| Pino 138 | VCC — Core power supply (1.5V) |
| Pino 139 | GND — Ground |
| Pino 140 | VCC — Core power supply (1.5V) |
| Pino 141 | GND — Ground |
| Pino 142 | VCC — Core power supply (1.5V) |
| Pino 143 | GND — Ground |
| Pino 144 | VCC — Core power supply (1.5V) |
Aplicações típicas
A3P1000-2FGG144 é adequado para 6 aplicaçãos: Industrial Control, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Medical Electronics, Data Acquisition and Test Equipment.
Industrial Control
The A3P1000-2FGG144 is ideal for industrial control systems such as PLCs, motor control, and factory automation. Its 1 million system gates and 97 I/Os provide ample logic resources for implementing custom control algorithms, communication interfaces, and sensor processing. The flash-based architecture ensures instant-on operation and high reliability in harsh industrial environments, with no external configuration memory required. The 1.5V core voltage and low power consumption make it suitable for power-sensitive applications. Its 310 MHz system performance supports real-time control loops and high-speed data acquisition. The device's security features protect intellectual property from reverse engineering, which is critical in competitive industrial markets.
Recomendado
Automotive Electronics
The A3P1000-2FGG144 is used in automotive electronics for applications such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). Its flash-based FPGA provides high reliability and immunity to single-event upsets, which is essential for safety-critical automotive functions. The device's 1 million gates and 97 I/Os enable integration of multiple functions like CAN bus interfaces, sensor fusion, and display control. The 1.5V core voltage and low power consumption help meet stringent automotive power budgets. The commercial temperature range (0C to +85C) is suitable for many automotive applications, but for under-hood environments, the industrial temperature variant (A3P1000-2FGG144I) is recommended. The device's instant-on capability ensures immediate operation upon power-up, which is critical for safety systems.
Recomendado
Communications Infrastructure
The A3P1000-2FGG144 is well-suited for communications infrastructure including network routers, switches, and base stations. Its 1 million system gates and 97 I/Os allow implementation of protocol processing, packet buffering, and interface bridging. The device supports multiple I/O standards such as LVCMOS, LVTTL, and PCI, enabling direct connection to various communication interfaces. The 310 MHz system performance handles high-speed data paths, while the flash-based architecture provides secure configuration storage, protecting against unauthorized access. The 1.5V core voltage and low power consumption are advantageous for densely populated line cards. The 144-FBGA package's compact footprint saves board space in space-constrained networking equipment. The device's reliability and long-term availability make it suitable for infrastructure deployments with extended lifecycles.
Recomendado
Aerospace and Defense
The A3P1000-2FGG144 is used in aerospace and defense systems such as avionics, satellite payloads, and radar processing. Its flash-based FPGA offers high reliability, radiation tolerance, and security against reverse engineering, which are critical for defense applications. The 1 million system gates and 97 I/Os provide sufficient resources for implementing complex signal processing, telemetry, and control functions. The device's instant-on capability ensures immediate operation in mission-critical scenarios. The 1.5V core voltage and low power consumption are essential for power-constrained satellite and UAV platforms. The commercial temperature range may be limiting for some aerospace applications, so the industrial temperature variant (A3P1000-2FGG144I) is often preferred. The device's non-volatile configuration eliminates the need for external boot memory, reducing system complexity and improving reliability.
Recomendado
Medical Electronics
The A3P1000-2FGG144 is suitable for medical electronics such as patient monitoring systems, diagnostic imaging, and portable medical devices. Its 1 million system gates and 97 I/Os enable implementation of signal processing, data acquisition, and user interface control. The flash-based architecture provides high reliability and secure configuration, which is important for medical devices that must meet stringent regulatory requirements. The 1.5V core voltage and low power consumption are beneficial for battery-powered portable devices. The device's instant-on capability ensures immediate readiness in critical medical situations. The 144-FBGA package's small footprint is ideal for compact medical devices. The commercial temperature range is typically sufficient for indoor medical environments. The device's long-term availability and reliability make it a trusted choice for medical equipment manufacturers.
Recomendado
Data Acquisition and Test Equipment
The A3P1000-2FGG144 is ideal for data acquisition systems and test equipment such as oscilloscopes, logic analyzers, and data loggers. Its 1 million system gates and 97 I/Os allow implementation of high-speed data capture, triggering, and processing logic. The device supports multiple I/O standards, enabling interface with various sensors and ADCs. The 310 MHz system performance handles high-bandwidth data streams, while the flash-based architecture provides secure and reliable configuration. The 1.5V core voltage and low power consumption are advantageous for portable test instruments. The 144-FBGA package's compact size fits well in benchtop and handheld equipment. The device's reprogrammability allows firmware updates and feature enhancements in the field, extending product lifespan. The commercial temperature range is suitable for typical lab environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P1000-2FGG144 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P1000-2FGG144I | A3P1000-1FGG144T | A3P1000-FG144T | A3P1000-FGG144I | A3P1000-FG144 |
|---|---|---|---|---|---|---|
| Package | 144-FBGA (FGG144) | 144-FBGA (FGG144) - same | 144-FBGA (FGG144) - same | 144-FBGA (FGG144) - same | 144-FBGA (FGG144) - same | 144-FBGA (FGG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| User I/Os | 97 | 97 | 97 | 97 | 97 | 97 |
| Speed Grade | -2 | -2 | -1 | Standard | Standard | Standard |
| Temperature Range | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C |
| Packaging | Tray | Tray | Tape & Reel | Tape & Reel | Tray | Tray |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
Principais diferenciais
- Flash-based non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- 1 million system gates in a 144-FBGA package (vs A3P600-2FGG144)
- Speed grade -2 for higher performance (vs A3P1000-FG144 (standard speed))
Notas de projeto
The A3P1000-2FGG144 requires a 1.5V core supply and separate I/O bank supplies (VCCIBx). Decouple each supply pin with a 0.1uF ceramic capacitor placed as close to the pin as possible, and add a 10uF bulk capacitor per supply rail. Estimated: For a design with 50% I/O toggling at 100 MHz, core current can reach approximately 150 mA, so ensure the regulator can supply at least 200 mA with margin. Refer to the Microchip ProASIC3 power estimation spreadsheet for accurate calculations.
For the 144-FBGA package, use a 4-layer PCB minimum with dedicated power and ground planes. Route high-speed I/Os with controlled impedance (e.g., 50 ohm single-ended) and keep trace lengths matched for differential pairs. Place decoupling capacitors on the bottom side directly under the FPGA to minimize loop inductance. Follow the layout guidelines in the ProASIC3 FPGA Layout Guidelines application note for optimal signal integrity.
A common pitfall is forgetting to connect all VCC and GND pins, which can cause erratic behavior or damage. Ensure all power pins are connected to the correct voltage levels and that no I/O is left floating unless intended. Also, the flash-based FPGA does not require external configuration, but the JTAG pins must be accessible for programming. Do not apply I/O voltages before the core supply is stable to avoid latch-up.
Informações de conformidade
Lead-free and RoHS compliant per distributor listings. AEC-Q100 qualification not specified for this part.
