A3PE3000L-1FGG324 - 3M-Gate Low-Power Flash FPGA | Microchip
Référence : A3PE3000L-1FGG324 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $68.5 | $68,50 |
| 10 | $63.1 | $631,00 |
| 100 | $57.8 | $5 780,00 |
| 500 | $52.4 | $26 200,00 |
| 1 000 | $47.95 | $47 950,00 |
A3PE3000L-1FGG324 Présentation
A field-programmable gate array (FPGA) is a reprogrammable semiconductor device that implements user-defined digital logic through a configurable fabric of logic elements, routing resources, and I/O cells. The ProASIC3L family belongs to the nonvolatile flash FPGA class within the broader power-management and programmable-logic hierarchy: flash FPGA -> FPGA -> programmable logic IC -> digital integrated circuit. Unlike SRAM-based FPGAs, its flash cells are nonvolatile, so the device powers up instantly without an external configuration PROM.
Key features include the ProASIC3L low-power fabric with Flash*Freeze technology for dramatic dynamic power reduction, a 1.2 V to 1.5 V core voltage range, single-chip secure operation, and reprogrammability without boot-time configuration delay. The device targets total-cost-of-ownership-sensitive designs by removing the need for configuration flash and external power-cycling circuitry.
Architecturally, the A3PE3000L uses a 130 nm CMOS flash process with 75264 logic cells organized in VersaTile clusters, allowing each tile to act as a logic function, registered logic, or small memory. The fabric supports high performance while the L-variant leverages low-power process and core operation for portable and power-constrained systems.
Typical applications include industrial automation control, portable and battery-powered instrumentation, secure military and aerospace subsystems, and communications line-card glue logic, where nonvolatile instant-on configuration and low standby power are essential.
Design consideration: the 324-ball FBGA requires careful PCB layout with appropriate via-in-pad or dog-bone fanout, and core voltage selection (1.2 V vs 1.5 V) must match speed-grade requirements.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour A3PE3000L-1FGG324 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE3000L-1FGG324 (même facteur de forme et même empreinte) — différant par Family, Package, Operating Temperature, Configuration Memory, System Gates.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE3000L-1FGG324I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE3000L-FGG324
✅ Remplacement direct✓ En stock
$86.15 / unité
Voir la fiche technique →A3PE3000L-FGG324I
✅ Remplacement direct✓ En stock
$62.65 / unité
Voir la fiche technique →A3PE3000L-1FG324I
✅ Remplacement direct✓ En stock
$135 / unité
Voir la fiche technique →A3PE3000-2FGG324
✅ Remplacement direct✓ En stock
$216 / unité
Voir la fiche technique →A3PE3000-FGG324I
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →A3PE3000L-1FGG324 Valeurs maximales et caractéristiques électriques
| Family | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 |
| Logic Elements | 35K LEs |
| Logic Cells (CLBs) | 75264 |
| User I/O | 221 |
| Core Voltage | 1.2 V to 1.5 V |
| Process Technology | 130 nm CMOS flash |
| Technology | Nonvolatile Flash (Instant On) |
| Boîtier | 324-ball FBGA (FGG324) |
| Type de montage | Surface Mount |
| Speed Grade | -1 |
| Special Features | Flash*Freeze low-power technology |
| Reprogrammability | Yes (in-system reprogrammable flash) |
| Configuration | Single-chip, no external configuration device required |
| Lead Free Status | Lead Free |
| Statut RoHS | RoHS Compliant |
Guide de configuration des broches du A3PE3000L-1FGG324 324-ball fbga (fgg324)
Configuration des broches du A3PE3000L-1FGG324 (boîtier 324-ball fbga (fgg324)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE3000L-1FGG324.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE3000L-1FGG324 convient pour 6 applications: Industrial Automation Control, Portable and Battery-Powered Instruments, Secure Military and Aerospace Subsystems, Communications Line Cards and Networking, Medical and Diagnostic Equipment, Test and Measurement Instrumentation.
Industrial Automation Control
In PLC I/O modules, motor-control interfaces, and factory-floor sensing nodes, the A3PE3000L-1FGG324 provides 3 million gates of glue logic, interface bridging, and sequencing with 221 user I/Os to absorb multiple legacy ASSP functions. Its nonvolatile flash fabric is Instant On, so a line restart after power loss requires no configuration download - critical for equipment uptime. With a 1.2 V core and Flash*Freeze technology, idle cabinets cut dynamic power dramatically between production cycles. Placed between backplane connectors and local controllers, the FPGA terminates parallel buses and translates to modern serial links; the trade-off versus a microcontroller is higher flexibility at the cost of RTL design effort.
Recommandé
Portable and Battery-Powered Instruments
Handheld test instruments, data loggers, and field meters benefit from the A3PE3000L-1FGG324's low-power ProASIC3L fabric: the 1.2 V core minimizes static consumption, and Flash*Freeze mode retains register and SRAM state while the device sleeps, enabling near-instant wake-up between measurement bursts. The 221 user I/Os drive LCD segments, keypads, and sensor interfaces without an external CPLD. Because the flash configuration is on-chip, no boot current is spent loading a bitstream, extending battery budget compared with SRAM FPGAs. Designers should budget I/O banking so active interfaces share banks powered during Flash*Freeze-adjacent operation, and verify wake-up timing against the Microchip datasheet AC tables.
Recommandé
Secure Military and Aerospace Subsystems
ProASIC3L flash FPGAs are widely deployed in defense electronics because the single-chip, nonvolatile configuration eliminates the bitstream theft risk of external configuration PROMs, and the 130 nm flash process supports Microchip's security features for design protection. The A3PE3000L-1FGG324's 3M gates implement protocol engines, bus interfaces (MIL-STD-style parallel buses, UART/SPI bridges), and system controllers in one device, while the industrial-temperature A3PE3000L-1FGG324I variant covers extended environments. Instant-On behavior suits turret controllers and avionics LRUs that must be ready at power application. Designers should use Libero SoC security tooling and follow Microchip's defense application notes for reliable design flow.
Recommandé
Communications Line Cards and Networking
In telecom and enterprise-network line cards, the A3PE3000L-1FGG324 handles backplane glue logic, LED/PHY supervision, hot-swap sequencing, and low-speed protocol conversion. The 3M-gate fabric absorbs CAM-control interfaces, I2C/SPI masters, and board-management state machines, while 221 I/Os connect to connectors, transceivers, and status planes. Flash*Freeze lets standby line cards drop dynamic power while retaining link state, easing chassis thermal budgets; the 1.2 V core reduces switching losses versus 1.5 V operation. Because the fabric is nonvolatile, a rebooted card resumes operation instantly without a configuration controller. Timing closure at speed grade -1 is straightforward for these sub-100 MHz state-machine workloads.
Recommandé
Medical and Diagnostic Equipment
Portable diagnostics, patient monitors, and bench-top analyzers use the A3PE3000L-1FGG324 to interface sensor front ends, drive displays, and sequence measurement engines. The low-power fabric supports battery and cart-based operation, while the single-chip flash configuration avoids external memory that would otherwise add a failure point in regulated medical devices. Flash*Freeze keeps patient data latched between sampling windows, and Instant-On start-up shortens the time from power switch to ready screen - a user-experience and emergency-response benefit. The 3M-gate capacity implements DSP-lite preprocessing (filters, thresholds) ahead of the host processor. Verify I/O ESD and isolation requirements against IEC-60601 system-level goals during design.
Recommandé
Test and Measurement Instrumentation
Bench instruments, automated test equipment (ATE), and protocol analyzers rely on the A3PE3000L-1FGG324 for timing generators, trigger matrices, and bus emulation across its 221 I/Os. The 3M-gate VersaTile fabric implements deep counters, pattern generators, and per-channel delay lines with deterministic, Instant-On startup - useful for calibration routines that run before an OS boots. Flash*Freeze maintains instrument state during idle periods on portable analyzers, and the 1.2 V core keeps shelf-mode current low. Compared with an MCU + CPLD stack, the single FPGA reduces BOM spread and yields deterministic timing skew. Route high-fanout clocks with balanced trees and verify setup/hold with Libero timing reports.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE3000L-1FGG324 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE3000L-1FGG324I | A3PE3000L-FGG324 | A3PE3000L-1FG324I | A3PE3000-2FGG324 |
|---|---|---|---|---|---|
| Package | 324-ball FBGA (FGG324) | 324-ball FBGA (FGG324) - same | 324-ball FBGA (FGG324) - same | 324-ball FBGA (FG324) - same footprint, lead-finish variant | 324-ball FBGA (FGG324) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family | ProASIC3L (low power) | ProASIC3L | ProASIC3L | ProASIC3L | ProASIC3E (performance) |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 221 | 221 | 221 | 221 | 221 |
| Speed Grade | -1 | -1 | standard (faster) | -1 | -2 (faster) |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | Yes | No |
| Temperature Grade | Commercial | Industrial | Commercial | Industrial | Commercial |
| RoHS / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free |
Principaux différenciateurs
- Flash*Freeze ultra-low-power mode with state retention (vs A3PE3000-2FGG324)
- Lowest dynamic power via -1 speed grade at 1.2 V core (vs A3PE3000L-FGG324)
- Extended-temperature availability in identical footprint (vs A3PE3000L-1FGG324I)
Notes de conception
The 324-ball FBGA (1.0 mm ball pitch class) demands a disciplined fanout strategy: use via-in-pad for power/ground balls or dog-bone escapes on perimeter signal balls, and define a 4+ layer stackup with dedicated core/GND planes. Escape routing density limits outer two rows to conventional traces; inner rows must escape through vias. Follow the Microchip ProASIC3L datasheet (DS50003268) package section and Microchip FPGA PCB layout application notes for ball map, keepouts, and land-pattern dimensions before finalizing the footprint.
Power the A3PE3000L core at 1.2 V for lowest dynamic power or up to 1.5 V for higher performance; the -1 speed grade typically permits 1.2 V core operation, but confirm the DC characteristics table in the datasheet for your grade. Provide separate regulated rails for core, I/O banks (VCCI), and the programming/Flash*Freeze supplies (VPT), with 10 uF bulk plus 0.1 uF high-frequency decoupling per bank. Sequencing requirements for multi-rail flash FPGAs are relaxed versus SRAM FPGAs, but verify the datasheet power-up specification to avoid configuration errors.
Do not confuse the FG vs FGG suffix: FGG324 uses a lead-free ball finish required for RoHS lines, while FG324 shares the same footprint but different ball metallurgy - verify solder-profile compatibility with your lead-free reflow profile. Also, instantiating Flash*Freeze requires the FLASH_FREEZE pin to be connected and the feature enabled in Libero SoC; leaving it unconnected forfeits the flagship low-power benefit. Finally, designs written for ProASIC3E (A3PE3000) must be re-verified before targeting the L variant.
Informations de conformité
RoHS compliant and lead free per distributor listings (DigChip, Mouser, DigiKey). REACH, halogen-free, and conflict-minerals status not stated in provided data - request manufacturer declarations.
