A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip
MPN: A3PE3000L-1FG324I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $172.5 | $1,725.00 |
| 100 | $158 | $15,800.00 |
| 500 | $146 | $73,000.00 |
| 1,000 | $135 | $135,000.00 |
Drop-in alternatives for A3PE3000L-1FG324I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000L-1FGG324I
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View Datasheet →A3PE3000L-FGG324I
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View Datasheet →A3PE3000L-FG324I
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View Datasheet →A3PE3000L-FGG324
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View Datasheet →A3PE3000L-1FG324I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L Low Power Flash FPGA |
| System Gates | 3000000 |
| Logic Elements | 35K LEs (75264 D-flip-flops equivalent family density) |
| User I/O | 221 |
| Total RAM Bits | 516096 |
| Core Voltage | 1.2 V to 1.5 V |
| I/O Voltage | 1.2 V to 1.5 V (family range) |
| Speed Grade | -1 |
| Process Technology | 130 nm CMOS flash |
| Configuration Memory | Non-volatile on-chip flash (single chip, secure) |
| Low Power Feature | Flash*Freeze technology |
| Operating Temperature | -40C to +100C (industrial, I suffix) |
| Package | 324-ball FBGA (FG324) |
| Mounting Type | Surface Mount |
| Dynamic Power Reduction | Up to 40% vs ProASIC3 |
| Static Power Reduction | Up to 50% vs ProASIC3 |
| Max Family Performance | 892.86 MHz class (130 nm ProASIC3EL family) |
A3PE3000L-1FG324I 324-ball fbga (fg324) Pin Configuration Guide
Complete pinout information for A3PE3000L-1FG324I (324-ball fbga (fg324) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-1FG324I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-1FG324I is suitable for 6 applications: Portable Battery-Powered Instrumentation, Industrial Automation Control, Medical Monitoring Equipment, Communications Line Cards, Aerospace and Defense Systems, Smart IoT Edge and Sensor Aggregation.
Portable Battery-Powered Instrumentation
The A3PE3000L-1FG324I fits portable instrumentation because its 1.2V core operation and Flash*Freeze mode directly attack the two dominant battery drains: dynamic switching power and static leakage. According to the ProASIC3L datasheet, the L silicon cuts dynamic power by up to 40% and static power by up to 50% versus standard ProASIC3, and Flash*Freeze retains register and RAM state in an ultra-low-power sleep state so the instrument resumes instantly without reconfiguration. In a handheld data logger, the FPGA runs acquisition logic at 1.2V, then enters Flash*Freeze between measurement windows, stretching battery life substantially. The 324-ball FBGA at roughly 1.0mm pitch suits compact handheld PCBs, while the 221 user I/Os interface ADCs, displays, and sensors without external glue logic.
Recommended
Industrial Automation Control
Factory automation controllers benefit from the A3PE3000L-1FG324I's industrial -40C to +100C rating, non-volatile flash configuration, and deterministic instant-on behavior. Unlike SRAM FPGAs that need a boot device and milliseconds of configuration time, the ProASIC3L fabric is active as soon as power is applied - critical for machine safety interlocks and I/O modules that must be operational at power-up. With 3 million gates and 516096 RAM bits, the device integrates motor sequencing logic, encoder decoding, and fieldbus interfaces such as CAN or RS-485 in glueless form. The 221 user I/Os support 1.2V to 1.5V banks matching modern sensor levels, and flash-based configuration resists corruption in electrically noisy cabinets, lowering field-service costs in PLC and remote I/O designs.
Recommended
Medical Monitoring Equipment
Patient monitors and portable diagnostic devices demand low noise, low heat, and high reliability - all strengths of the A3PE3000L-1FG324I. Its 1.2V to 1.5V core operation minimizes junction power dissipation, keeping the 324-ball FBGA cool inside enclosed bedside housings with passive cooling only. Flash*Freeze mode lets the monitor drop front-end acquisition logic into a state-retaining sleep between sampling events, extending uptime during ambulatory monitoring sessions. The non-volatile single-chip architecture removes external configuration memory, reducing BOM count and eliminating a failure point in devices subject to regulatory scrutiny. With 35K logic-element-class density, the FPGA handles ECG/SpO2 digital filtering, display refresh, and communication interfaces simultaneously, while the industrial temperature rating provides margin against hospital equipment bays that exceed commercial limits.
Recommended
Communications Line Cards
Access-network and transport line cards use the A3PE3000L-1FG324I for framing, scrambling, and backplane glue logic where low static power matters across hundreds of deployed cards. The ProASIC3L's up to 50% static power reduction versus standard ProASIC3 compounds into significant opex savings in equipment drawing power continuously. The -1 speed grade supports the family's internal performance class for 892.86MHz-rated fabric paths in the 130nm ProASIC3EL generation, sufficient for parallel framing at line rates handled by companion PHYs. The 221 I/Os, bankable at 1.2V to 1.5V, bridgeprocessors, PHYs, and connectors. Non-volatile configuration enables cards to enumerate immediately on hot-swap insertion, and the industrial rating accommodates outside-plant cabinets and uncooled central-office shelves alike, with 516096 RAM bits available for elasticity buffers.
Recommended
Aerospace and Defense Systems
Defense electronics values the A3PE3000L-1FG324I for its flash-based, single-chip, secure configuration architecture - there is no external bitstream to intercept on an SRAM configuration bus, a recognized supply-chain and security advantage of the Actel/Microsemi/Microchip ProASIC3 lineage. The industrial -40C to +100C rating covers ruggedized ground and avionic-shelf environments, and the low static power suits conduction-cooled enclosures with limited thermal budget. Three million gates integrate telemetry encoding, bus bridging (MIL-STD-1553 companions, CAN, UART meshes), and sensor aggregation in one 324-ball device, while 516096 bits of block RAM buffer mission data. Flash*Freeze allows duty-cycled sensors to idle at minimal power between events. Microchip supports RTL integration in Libero SoC, and the family is a proven migration point from discontinued antifuse designs.
Recommended
Smart IoT Edge and Sensor Aggregation
IoT edge nodes aggregating many sensors onto one uplink exploit the A3PE3000L-1FG324I's combination of instant-on fabric, Flash*Freeze duty cycling, and 221 GPIOs. The flash-based FPGA boots in microseconds, captures sensor events immediately at power application, then either processes locally - 35K logic elements handle filtering, thresholding, and protocol conversion - or streams to a host microcontroller. Because configuration is non-volatile, no microcontroller boot-time gating is needed, simplifying power-sequencing design in energy-harvesting nodes. At a 1.2V core the device sips power while idle banks clock-gate, and Flash*Freeze suspends the whole fabric at minimal static draw between wake events. The 324-ball FBGA footprint gives enough I/O to fan-in dozens of I2C, SPI, and discrete sensor lines into a single aggregation point for gateways and industrial retrofit kits.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-1FG324I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-1FGG324I | A3PE3000L-FG324I | A3PE3000L-1FG324 | A3PE3000-2FG324 | A3PE3000-FGG324I |
|---|---|---|---|---|---|---|
| Package | 324-ball FBGA (FG324) | 324-ball FBGA (FGG324) - same footprint | 324-ball FBGA (FG324) - same | 324-ball FBGA (FG324) - same | 324-ball FBGA (FG324) - same | 324-ball FBGA (FGG324) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family | ProASIC3L (low power, Flash*Freeze) | ProASIC3L | ProASIC3L | ProASIC3L | ProASIC3E (standard power) | ProASIC3E (standard power) |
| System Gates | 3M | 3M | 3M | 3M | 3M | 3M |
| User I/O | 221 | 221 | 221 | 221 | 221 | 221 |
| Speed Grade | -1 | -1 | standard (slower than -1) | -1 | -2 (faster) | standard |
| Operating Temperature | -40C to +100C (I) | -40C to +100C (I) | -40C to +100C (I) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (I) |
| Flash*Freeze Low Power | Yes (up to 40%/50% dynamic/static reduction) | Yes | Yes | Yes | No | No |
Key Differentiators
- Flash*Freeze ultra-low-power mode (vs A3PE3000-2FG324)
- Industrial temperature with fastest -1 grade (vs A3PE3000L-FG324I)
- Lead-free fine-pitch ball option available (vs A3PE3000L-1FGG324I)
- Non-volatile single-chip secure configuration (vs A3PE3000-FGG324I)
Design Notes
Budget power using Microchip's ProASIC3L power calculator in Libero SoC rather than static datasheet numbers, since dynamic power scales with toggle rates. Exploit Flash*Freeze aggressively: the FLASH_FREEZE pin latches I/O state and gates the fabric, and the datasheet DS50003268 defines entry/exit timing that must be respected by the host controller. Core and I/O rails both accept 1.2V to 1.5V - running banks at the lowest voltage your interfaces tolerate yields the largest dynamic savings in battery designs.
The FG324 FBGA uses approximately 1.0mm ball pitch; plan fanout early, favoring via-in-pad or dog-bone escape on outer two ball rows. Provide solid power/ground ball rings per the Microchip packaging and pinout document and decouple each VCC/VCCA domain with an array of 0.1uF ceramics plus bulk capacitance near the bank supplies. Because this is a non-volatile device, no configuration PROM routing is needed, freeing board area - but still reserve programming-access routing for JTAG boundary scan and Libero-based device programming.
Do not substitute commercial-temperature parts (A3PE3000L-1FG324) into industrial designs - the 'I' suffix exists for the -40C to +100C range and qualification documents will fail audit. Do not assume non-L ProASIC3E parts (A3PE3000-2FG324) are power-equivalent despite the identical footprint; they lack Flash*Freeze and consume up to 50% more static power. Finally, timing closure at the standard speed grade may not meet -1 constraints - rerun static timing in Libero after any speed-grade substitution.
Compliance Information
Compliance status for the exact I-suffixed MPN was not stated in the provided verified data; consult the Microchip product page A3PE3000L for current RoHS/REACH declarations. Note the FGG variants are Microchip's lead-free fine-pitch package line.
