A3PE3000L-1FGG324I - 3M-Gate Flash FPGA, 324-FBGA | Microchip
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Drop-in alternatives for A3PE3000L-1FGG324I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000L-FGG324I
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A3PE3000L-FG896I
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View Datasheet →A3PE3000L-1FGG324I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L |
| System Gates | 3000000 |
| Logic Elements (Cells) | 75264 |
| Embedded RAM Bits | 516096 |
| User I/O | 221 |
| Core Voltage | 1.2 V (1.2 V to 1.5 V range) |
| Process Technology | 130 nm flash |
| Speed Grade | -1 |
| Package | 324-ball FBGA (FGG), 19 x 19 mm |
| Mounting Type | Surface Mount |
| Programming Technology | Nonvolatile Flash (Instant On, single chip) |
| Low Power Feature | Flash*Freeze Technology |
| Operating Temperature | -40C to +125C (Industrial, I suffix) |
| Number of Logic Blocks (CLBs) | 75264 |
A3PE3000L-1FGG324I 324-ball fbga (fgg), 19 x 19 mm Pin Configuration Guide
Complete pinout information for A3PE3000L-1FGG324I (324-ball fbga (fgg), 19 x 19 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-1FGG324I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-1FGG324I is suitable for 6 applications: Industrial Automation Controllers, Battery-Powered Portable Instrumentation, Medical Monitoring Equipment, Aerospace and Defense Subsystems, Communications Line Cards, Smart Energy and IoT Gateways.
Industrial Automation Controllers
The A3PE3000L-1FGG324I fits industrial PLC and motion-control logic consolidation because its 3 million gates and 75264 logic elements absorb glue logic, sequencers, and interface bridges in one nonvolatile device. The -40C to +125C industrial rating and 221 user I/Os support multi-voltage sensor and actuator interfacing on factory floors. The Instant On flash fabric means the controller is ready before the host CPU boots, enabling deterministic safety interlocks. With 516096 bits of embedded SRAM for FIFO buffering and the 1.2 V core lowering logic power, it reduces total system cost of ownership compared to ASIC approaches in mid-volume industrial equipment.
Recommended
Battery-Powered Portable Instrumentation
Battery-powered test and measurement instruments benefit directly from the L variant's Flash*Freeze technology, which preserves the entire design state while slashing dynamic power during idle periods - a decisive advantage over SRAM FPGAs that must reconfigure or stay fully powered. The 1.2 V core option minimizes logic energy per switching event, and the nonvolatile fabric eliminates the configuration current an external PROM would draw at every power-up. The 324-ball 19x19 mm FBGA fits compact handheld enclosures, while 221 I/Os handle display, touch, sensor, and communication interfaces. Designers typically gate the clock domain and assert Flash*Freeze between measurement cycles to extend battery runtime substantially.
Recommended
Medical Monitoring Equipment
Patient monitors and diagnostic equipment require deterministic, always-ready logic with low electromagnetic and thermal signatures. The A3PE3000L-1FGG324I provides 3 million gates for waveform processing pipelines, display controllers, and communication interfaces, while Flash*Freeze keeps patient-alarm logic alive in a near-zero-power state between acquisition bursts. The nonvolatile, single-chip design supports design security requirements common in medical device programs, and the absence of external configuration memory reduces component count on boards subject to IEC design reviews. Its -1 speed grade comfortably handles monitor-rate signal chains, and the industrial temperature rating covers sterilization-adjacent environments and wide ambient hospital conditions.
Recommended
Aerospace and Defense Subsystems
Secure, Instant-On flash FPGAs are a mainstay in aerospace and defense payloads, and the A3PE3000L family was explicitly qualified for such use in Microsemi's military ProASIC3/EL documentation. The flash fabric resists configuration readback, supporting anti-tamper design goals, and the device is functional immediately at power application - critical for flight-critical sequencers and spacecraft power-switch logic. The -40C to +125C industrial rating covers many avionic ambient requirements, and the 324-ball FGG package offers proven board-level reliability. Designers use the 516096-bit embedded SRAM for telemetry FIFOs and the abundant logic for bus bridging such as MIL-STD interfaces implemented in RTL.
Recommended
Communications Line Cards
Telecom and datacom line cards use the A3PE3000L-1FGG324I for framing, policing, and backplane interface logic. The 221 user I/Os support multiple bank voltages for connecting to PHYs and framers, and 3 million gates implement channelized processing without an external ASIC. The Flash*Freeze feature allows idle line-card slices to drop dynamic power during low-traffic periods, improving rack-level energy efficiency, while Instant On behavior ensures the card meets carrier boot-time requirements without waiting for configuration loading. The 19x19 mm FGG package conserves line-card real estate, and the embedded SRAM handles per-channel jitter buffers and statistics counters.
Recommended
Smart Energy and IoT Gateways
Smart-grid concentrators and IoT edge gateways combine the A3PE3000L-1FGG324I's deterministic logic with its low-power personality. The FPGA preprocesses metering pulses, protocols, and security offload while the host processor sleeps; Flash*Freeze then parks the fabric between events. The 1.2 V core reduces standby conversion losses, and the single-chip nonvolatile configuration survives field power interruptions without reconfiguration hardware - an important reliability attribute for unattended outdoor cabinets. The 324-ball FGG footprint fits standard gateway main boards, and industrial temperature compliance covers -40C cold starts typical of pole-mounted and substation equipment deployments.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-1FGG324I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-FGG324I | A3PE3000L-1FG324 | A3PE3000-FGG324I | A3PE3000-1FGG324I |
|---|---|---|---|---|---|
| Package | 324-ball FBGA (FGG) | 324-ball FBGA (FGG) - same | 324-ball FBGA (FG) - same count, FG metallurgy | 324-ball FBGA (FGG) - same | 324-ball FBGA (FGG) - same |
| Brand | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) |
| System Gates | 3 M | 3 M | 3 M | 3 M | 3 M |
| Embedded RAM (bits) | 516096 | 516096 | 516096 | 516096 | 516096 |
| User I/O | 221 | 221 | 221 | 221 | 221 |
| Flash*Freeze Low Power | Yes | Yes | Yes | No (standard ProASIC3) | No (standard ProASIC3) |
| Speed Grade | -1 | [DATA_NEEDED] | -1 | [DATA_NEEDED] | -1 |
| Operating Temperature | -40C to +125C (I) | [DATA_NEEDED] | Commercial (no I suffix) | -40C to +125C (I) | -40C to +125C (I) |
Key Differentiators
- Flash*Freeze idle power reduction (vs A3PE3000-1FGG324I)
- Industrial temperature rating (vs A3PE3000L-1FG324)
- Same-die, same-footprint speed-grade flexibility (vs A3PE3000L-FGG324I)
Design Notes
Plan three supply domains per the ProASIC3L datasheet: VCC (1.2 V core, 1.2 V to 1.5 V range), VCCI per I/O bank, and VPT/VJTAG auxiliaries. Because the fabric is flash-based, inrush at power-up is far lower than SRAM FPGAs, simplifying the power supply design; however, obey the datasheet power-rail sequencing recommendations to avoid I/O latch-up during multi-rail start. Estimated: budget core current using Microchip's SmartPower tool with your post-place-and-route netlist rather than worst-case family tables, since dynamic power scales strongly with toggling activity.
The 324-ball FGG package uses a 1.0 mm ball pitch in a 19x19 mm body; follow the datasheet land-pattern appendix for pad geometry and use solder-mask-defined or non-solder-mask-defined pads consistently with your assembler's capability. Distribute decoupling capacitors (at least one 0.1 uF per supply pin cluster plus bulk capacitance) on the bottom side directly under the package to minimize loop inductance. Vias-in-pad with fill are acceptable for BGA escape routing on 8+ layer boards typical for this device class.
Do not confuse package suffixes: FGG and FG 324-ball packages share ball count but differ in ball metallurgy and land-pattern requirements - verify against the datasheet package drawing before qualifying a substitution. Also confirm the I temperature suffix (-40C to +125C) when substituting commercial-grade variants. Finally, when migrating between ProASIC3L and standard ProASIC3 parts, remember Flash*Freeze pins change function; RTL and pin constraints must be revalidated even though the footprint matches.
Compliance Information
Compliance status was not stated in the retrieved verified web data; consult the Microchip product page environmental datasheet for RoHS/REACH certificates for A3PE3000L-1FGG324I.
