A3PE3000L-FGG896M - 3M-Gate Low-Power Flash FPGA | Microchip
Référence : A3PE3000L-FGG896M ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1 | $1,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
A3PE3000L-FGG896M Présentation
A field-programmable gate array (FPGA) is a semiconductor device that can be configured by the designer after manufacturing, sitting within the programmable logic hierarchy of FPGA -> programmable logic device -> digital logic IC. Unlike SRAM-based FPGAs, the ProASIC3L family uses a 130-nm, 7-layer-metal (6 copper) flash-based CMOS process, giving it a non-volatile fabric.
Key features include Flash*Freeze technology for near-zero-power standby, live-at-power-up (Level 0) operation for single-chip solutions without an external configuration device, and pin compatibility across the ProASIC3L family (except PQ208). The flash-based fabric eliminates configuration time and configuration-readout security concerns common to SRAM FPGAs.
Technically, the device integrates 75,264 logic cells (DigiKey lists 516,096 block figures for the 896-ball option) on the 1.2 V/1.5 V core architecture. Weak pull-up/pull-down options and Schmitt-trigger inputs on single-ended I/Os (A3PE3000L) improve signal integrity, while IEEE 1149.1 (JTAG) boundary scan supports board-level test. The military ProASIC3/EL variant datasheet confirms the low-power focus of the L-suffix grade.
Typical applications include low-power industrial control, portable and battery-operated instrumentation, military and avionic glue logic consolidation, communications line cards, and single-chip secure boot designs where an external configuration flash would be a liability.
When designing with this device, keep core voltage rails tightly regulated and use the Flash*Freeze mode to exploit its static-power advantage; verify I/O banking rules before fixing the pinout.
This page synthesizes distributor pricing, drop-in alternatives, FAQs, and practical design notes not found in the manufacturer datasheet, with data verified as of 2026-09-02.
Alternatives de remplacement direct pour A3PE3000L-FGG896M — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE3000L-FGG896M (même facteur de forme et même empreinte) — différant par Package, Family, Configuration Memory, Operating Temperature, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE3000L-FGG896I
✅ Remplacement direct✓ En stock
$139.9 / unité
Voir la fiche technique →A3PE3000L-1FGG896M
✅ Remplacement direct✓ En stock
$432 / unité
Voir la fiche technique →A3PE3000L-1FGG896I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE3000L-FGG896
✅ Remplacement direct✓ En stock
$55 / unité
Voir la fiche technique →A3PE3000-FGG896I
✅ Remplacement direct✓ En stock
$135.2 / unité
Voir la fiche technique →A3PE3000L-FG896I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE3000L-FGG896M Valeurs maximales et caractéristiques électriques
| Family | ProASIC3L (Flash-based FPGA) |
| System Gates | 3,000,000 |
| Logic Cells | 75,264 |
| User I/Os | Up to 616 (620 per DigiKey listing) |
| Embedded SRAM | 504 kbits true dual-port |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Voltage | 1.2 V to 1.5 V |
| Tension d'alimentation | 1.5 V |
| Boîtier | 896-ball FBGA (FGG896), 1 mm pitch |
| Logic Family | CMOS |
| Température de fonctionnement | 0 to 70 C |
| Type de montage | Surface Mount |
| Configuration | Non-volatile flash, live-at-power-up Level 0, single-chip |
| Low-Power Feature | Flash*Freeze technology |
| Boundary Scan | IEEE 1149.1 (JTAG) |
| Input Features | Schmitt trigger option on single-ended inputs; weak pull-up/pull-down |
Guide de configuration des broches du A3PE3000L-FGG896M 896-ball fbga (fgg896), 1 mm pitch
Configuration des broches du A3PE3000L-FGG896M (boîtier 896-ball fbga (fgg896), 1 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE3000L-FGG896M.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE3000L-FGG896M convient pour 6 applications: Low-Power Industrial Control, Military and Avionic Glue Logic, Battery-Powered Portable Instrumentation, Secure Boot and Single-Chip Systems, Communications Line Cards, Test and Measurement Equipment.
Low-Power Industrial Control
Industrial controllers benefit from the A3PE3000L-FGG896M's flash fabric, which boots instantly at power-up (Level 0 live-at-power-up) without an external configuration flash, reducing BOM cost and boot failures in electrically noisy factory environments. With 3,000,000 system gates and up to 616 user I/Os, a single device can consolidate PLC glue logic, motor-control sequencing, and sensor aggregation. The 1.2 V to 1.5 V core on a 130-nm flash CMOS process keeps dynamic power manageable, and IEEE 1149.1 JTAG boundary scan supports in-field board diagnostics. Schmitt-trigger I/O options improve noise margins on long sensor lines.
Recommandé
Military and Avionic Glue Logic
The A3PE3000L belongs to the military ProASIC3/EL low-power flash FPGA family, making the FGG896M grade a natural fit for defense and avionic board designs that consolidate legacy glue logic. The non-volatile flash fabric avoids configuration-readout security concerns of SRAM FPGAs, and Flash*Freeze technology cuts standby power in duty-cycled payloads. The 896-ball FBGA provides 616 user I/Os for interfacing legacy parallel buses, MIL-STD-style discretes, and mixed-voltage banks. Designers should verify temperature grades: the M suffix targets the controlled 0 to 70 C envelope, while I-suffix variants extend the range.
Recommandé
Battery-Powered Portable Instrumentation
Portable instruments exploit the A3PE3000L-FGG896M's defining feature: Flash*Freeze technology, which freezes logic and I/O state while cutting static power to near zero and resumes operation instantly. The 1.2 V to 1.5 V core supply on the 130-nm flash CMOS process minimizes dynamic energy per operation, and the single-chip live-at-power-up configuration removes the boot latency and current spike of loading a bitstream from external flash. With 504 kbits of true dual-port SRAM, the device buffers acquisition data locally, and 616 I/Os connect ADCs, displays, and communication transceivers.
Recommandé
Secure Boot and Single-Chip Systems
Flash-based ProASIC3L devices support secure, single-chip designs: the bitstream lives in non-volatile flash on the die, so no external configuration memory can be read or substituted, and Level 0 live-at-power-up logic is active before the system processor starts. The A3PE3000L-FGG896M's 3M gates implement power-on sequencing, supply supervisors, and bus firewalls around a host CPU. Weak pull-up/pull-down options simplify board bring-up, and the JTAG boundary-scan chain supports manufacturing test. Compared with SRAM FPGAs needing encrypted bitstreams and external key storage, this fabric simplifies the security architecture.
Recommandé
Communications Line Cards
Line-card designs use the A3PE3000L-FGG896M to bridge backplane interfaces, aggregate framer/PHY control signals, and implement state machines between high-speed SERDES devices. The 616 user I/O capacity of the FGG896 package handles wide parallel buses across multiple I/O banks, with Schmitt-trigger inputs improving tolerance of backplane ringing. True dual-port SRAM (504 kbits) implements FIFOs between clock domains, a common line-card requirement. The flash fabric's instant-on behavior simplifies hot-swap sequencing, and the -1 speed grade variant (A3PE3000L-1FGG896M) is available when timing paths are aggressive.
Recommandé
Test and Measurement Equipment
Bench and rack instruments use the A3PE3000L-FGG896M as instant-on control logic that is ready before the host CPU boots, handling trigger distribution, relay switching matrices, and front-panel interfaces. The 75,264 logic cells and 504 kbits of dual-port SRAM support timestamping and capture buffers, while 616 I/Os interface multiple measurement channels through the dense 896-ball FBGA. IEEE 1149.1 boundary scan enables in-system board test, reducing production cost. Flash*Freeze keeps standby draw low between measurements, extending rack-level thermal and energy budgets.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE3000L-FGG896M — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE3000L-FGG896I | A3PE3000L-1FGG896M | A3PE3000L-1FGG896I | A3PE3000-FGG896I |
|---|---|---|---|---|---|
| Package | 896-ball FBGA (FGG896), 1 mm pitch | 896-ball FBGA (FGG896) - same | 896-ball FBGA (FGG896) - same | 896-ball FBGA (FGG896) - same | 896-ball FBGA (FGG896) - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/Os | 616 (620 per DigiKey listing) | 616 | 620 | 620 | 616 |
| Embedded SRAM | 504 kbits true dual-port | 504 kbits | 504 kbits | 504 kbits | 504 kbits |
| Flash*Freeze Technology | Yes | Yes | Yes | Yes | No (non-L die) |
| Speed Grade | Standard | Standard | -1 (faster) | -1 (faster) | Standard |
| Operating Temperature | 0 to 70 C | Industrial (extended) | 0 to 70 C | Industrial (extended) | Industrial (extended) |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
Principaux différenciateurs
- Flash*Freeze low-power standby (vs A3PE3000-FGG896I)
- Non-volatile single-chip configuration (vs A3PE3000L-1FGG896M)
- High I/O density in one footprint (vs A3PE600L-FGG484M)
Notes de conception
The A3PE3000L uses separate 1.2 V core and 1.5 V/3.3 V I/O-class rails on a 1.2 V-1.5 V core architecture; sequence the core rail per the ProASIC3L datasheet power-up requirements and exploit Level 0 live-at-power-up so configuration-free logic is active immediately. Use Flash*Freeze aggressively in duty-cycled systems - it freezes state and cuts static power to near zero without losing registers, unlike SRAM FPGAs that would need reconfiguration on wake.
The 896-ball FGG package with 1 mm ball pitch requires careful fanout planning; use via-in-pad or dog-bone escape on outer rows and verify BGA land pattern per Microchip package drawing. Allocate solid ground planes under the ball field for the 616 user I/O banks, and keep bank voltage rails per the I/O banking rules before fixing the pinout - bank violations are the most common re-spin cause on FGG896 ProASIC3 designs.
Enable the Schmitt-trigger option on single-ended inputs (available on A3PE3000L) for slow or noisy edges, and use the weak pull-up/pull-down options instead of external resistors to save BOM. Route JTAG (IEEE 1149.1) as a short daisy chain with series termination; the boundary-scan chain also aids board-level manufacturing test across the 896-ball package.
Informations de conformité
The Mouser listing for the related A3PE3000L-FGG896 identifies it as LEAD FREE; full RoHS/REACH status per the manufacturer product page was not captured in the verified data.
