A3PE3000L-1FGG896M - 3M Gate ProASIC3L Low Power FPGA | Microchip
MPN: A3PE3000L-1FGG896M ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $580 | $580.00 |
| 10 | $545 | $5,450.00 |
| 100 | $498 | $49,800.00 |
| 500 | $465 | $232,500.00 |
| 1,000 | $432 | $432,000.00 |
Drop-in alternatives for A3PE3000L-1FGG896M — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE3000L-1FGG896
✅ Drop-In✓ In Stock
$255 / Unit
View Datasheet →A3PE3000L-FGG896M
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →A3PE3000L-1FGG896I
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →A3PE3000L-FGG896
✅ Drop-In✓ In Stock
$55 / Unit
View Datasheet →A3PE3000L-FG896M
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →A3PE3000L-FG896
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →A3PE3000L-1FGG896M Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (Flash FPGA) |
| System Gates | 3000000 |
| Logic Elements | 35 KLEs (per Mouser listing) |
| Number of I/O | 620 |
| Total Memory Bits (DigiKey listing) | 516096 |
| Core Voltage | 1.2 V to 1.5 V |
| Process Technology | 130 nm Flash |
| Configuration Technology | Flash (nonvolatile, single-chip) |
| Low Power Feature | Flash*Freeze technology |
| Package | 896-ball FBGA |
| Mounting Type | Surface Mount |
| Supply Voltage - I/O | as low as 1.2 V (per Microchip product page) |
| Speed Grade | -1 |
A3PE3000L-1FGG896M 896-ball fbga Pin Configuration Guide
Complete pinout information for A3PE3000L-1FGG896M (896-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-1FGG896M.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-1FGG896M is suitable for 6 applications: Battery-Powered Portable Instrumentation, Industrial Automation Controllers, Military and Aerospace Secure Designs, Communications Line Cards, Test and Measurement Equipment, Medical Diagnostic Devices.
Battery-Powered Portable Instrumentation
The A3PE3000L-1FGG896M fits portable instruments where battery runtime is the primary constraint. Its flash configuration removes SRAM standby leakage paths, and per the Microchip datasheet the ProASIC3L family cuts dynamic power by 40% and static power by 50% versus the equivalent ProASIC3 device. In use, the FPGA implements glue logic, data acquisition sequencing, and display interfacing, with Flash*Freeze mode asserted whenever the user pauses measurements, dropping core power to microamp-class levels while retaining all register and SRAM state for instant resume. I/O rails can run as low as 1.2 V to interface with modern low-voltage sensors and ADCs. The trade-off is that the 896-ball FBGA is a large, fine-pitch package, so it suits instruments with adequate board area rather than ultra-compact wearables.
Recommended
Industrial Automation Controllers
In industrial PLCs and motion-control I/O modules, the A3PE3000L-1FGG896M provides deterministic programmable logic with 620 user I/Os, enough to integrate encoder interfaces, fieldbus transceivers glue, and safety interlock logic on one chip. Its single-chip flash configuration means the controller powers up functional immediately, meeting factory uptime expectations without a configuration-boot sequence. The 1.2 V to 1.5 V core operation reduces controller heat dissipation in sealed cabinets, and Flash*Freeze lets standby modules idle at low power while preserving state so production resumes instantly. Designers should validate I/O standards and voltage levels against the ProASIC3L datasheet I/O bank structure, and observe the 130 nm device's timing derating at elevated cabinet temperatures. The 896-FBGA footprint also allows a common PCB to serve multiple density points in the family.
Recommended
Military and Aerospace Secure Designs
The ProASIC3L flash fabric is a traditional choice for defense and aerospace programmable logic because nonvolatile flash configuration cells are inherently resistant to bitstream-readout attacks compared to SRAM FPGAs that load configuration from an external device at every power-up. The A3PE3000L-1FGG896M's 3M gates and 620 I/Os accommodate sensor-interface, bus-bridge, and signal-conditioning functions in avionics LRUs and secure communications hardware. Its low static power benefits conduction-cooled or battery-backed platforms, and Flash*Freeze supports duty-cycled operation in unattended sensors. Design teams should apply Microchip's programming-security features and verify the device grade (standard versus I-suffix industrial temperature) against the program's environmental specification. The mature 130 nm process also simplifies radiation and reliability assessments relative to leading-edge nodes.
Recommended
Communications Line Cards
Telecom and datacom line cards spend most of their life lightly loaded, making static power the dominant energy cost. The A3PE3000L-1FGG896M addresses this directly: per the Microchip datasheet the ProASIC3L family delivers 50% lower static power than equivalent ProASIC3 devices, and Flash*Freeze mode cuts core power further during quiet periods between traffic bursts. The device implements framers' glue logic, backplane interfacing, and counter/statistics aggregation across its 620 I/Os, with 516,096 bits of embedded memory per the DigiKey listing for FIFOs and buffers. Instant-on flash configuration shortens card bring-up during hot-swap events. Designers must budget the multiple core/I/O rails and validate signal integrity on the fine-pitch 896-ball BGA escape routing at card speeds.
Recommended
Test and Measurement Equipment
Bench and modular instruments benefit from the A3PE3000L-1FGG896M's combination of instant-on flash configuration and 620 flexible I/Os for driving multiplexers, relays, ADC front ends, and trigger buses. The 3M-gate capacity hosts channel state machines, calibration engines, and USB/LAN bridge logic in a single chip, reducing the BOM versus discrete glue. Flash*Freeze allows the instrument to keep measurement context in low-power standby between scans, extending battery life in handheld analyzers while enabling sub-microsecond resume when the user restarts acquisition. Embedded memory of 516,096 bits (per DigiKey) supports capture FIFOs. Because the 896-ball FBGA requires controlled-impedance breakout, allocate inner layers for signal escape and follow Microchip's package layout guidelines in the ProASIC3L datasheet.
Recommended
Medical Diagnostic Devices
Portable and benchtop medical diagnostics, such as blood analyzers and portable imaging front ends, need deterministic logic with very low standby drain between patient measurements. The A3PE3000L-1FGG896M's flash fabric draws roughly half the static power of the equivalent ProASIC3 per Microchip's datasheet, and Flash*Freeze retains acquisition state during idle intervals, so results and calibration context survive power-cycling of analog sections. Its 620 I/Os integrate sensor arrays, motor controls for fluidics, and host communication interfaces, while 1.2 V-capable I/O banks interface with modern low-voltage converters. The single-chip flash configuration also removes an external PROM that would otherwise need cleanliness and reliability qualification. Verify the device temperature grade and apply Microchip's power-sequencing guidance for multi-rail medical designs.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-1FGG896M — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-1FGG896 | A3PE3000L-1FGG896I | A3PE3000L-FGG896M | A3PE3000L-FG896M |
|---|---|---|---|---|---|
| Package | 896-ball FBGA | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 620 | 620 | 620 | 620 | 620 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Speed Grade | -1 | -1 | -1 | [DATA_NEEDED] | [DATA_NEEDED] |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | Yes | Yes |
| Configuration Type | On-chip flash (single-chip, no boot PROM) | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Key Differentiators
- Flash*Freeze ultra-low-power idle mode with state retention (vs A3PE3000-FGG896I (standard ProASIC3))
- Single-chip flash configuration removes external boot device (vs SRAM-based competitor FPGAs (not drop-in))
- Lowest-speed-grade (-1) variants trade performance for the best power figure (vs A3PE3000L-FGG896M / A3PE3000L-FG896M (speed grade unspecified in code))
Design Notes
Plan the power tree early: the A3PE3000L requires 1.2 V to 1.5 V core, separate I/O bank rails down to 1.2 V, and auxiliary rails, with correct sequencing per the ProASIC3L datasheet power-up requirements. Estimated: with 40% lower dynamic and 50% lower static power than the equivalent ProASIC3 (per Microchip datasheet DS50003268), a typical mid-activity design sees substantial rail-current reduction, but verify with Libero SoC power analysis using your actual utilization and toggle rates rather than datasheet typicals. Decouple each power ball cluster with bulk plus high-frequency ceramics close to the BGA via field.
The 896-ball FBGA demands disciplined breakout. Use via-in-pad or dogbone escapes with microvias where stack-up allows, dedicate at least two inner layers to BGA fanout, and keep power/ground plane voids away from high-speed signal escapes. Follow Microchip's package and PCB layout guidelines in the ProASIC3L datasheet for ball-map-specific escape patterns. For rework, confirm your contract manufacturer can handle a 1.0 mm-pitch-class BGA of this ball count, and honor the moisture sensitivity level by baking per the MSL label before reflow.
Do not leave the Flash*Freeze pin floating - drive it from controlled logic and validate entry/exit timing in-system, since peripherals clocked from the fabric stall while frozen. Second, the M suffix in the ordering code relates to Microchip moisture/packing flow control; mixing suffixes across a build can change packing quantity and MSL handling, so qualify the exact code you will buy in volume. Third, confirm the -1 speed grade timing closure in Libero at your worst temperature corner rather than assuming family typical values.
Compliance Information
The G in the FGG ordering code conventionally indicates lead-free ball metallurgy per Microchip naming conventions, but explicit RoHS/REACH declarations were not present in the provided web data - obtain the compliance certificate from Microchip or your distributor.
