A3PE3000L-FGG896M - 3M-Gate Low-Power Flash FPGA | Microchip
MPN: A3PE3000L-FGG896M ✓ Active| Qty | Unit Price | Extended |
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| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for A3PE3000L-FGG896M — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000L-FGG896I
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$139.9 / Unit
View Datasheet →A3PE3000L-1FGG896M
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$432 / Unit
View Datasheet →A3PE3000L-1FGG896I
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View Datasheet →A3PE3000L-FGG896
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$55 / Unit
View Datasheet →A3PE3000-FGG896I
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$135.2 / Unit
View Datasheet →A3PE3000L-FG896I
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View Datasheet →A3PE3000L-FGG896M Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (Flash-based FPGA) |
| System Gates | 3,000,000 |
| Logic Cells | 75,264 |
| User I/Os | Up to 616 (620 per DigiKey listing) |
| Embedded SRAM | 504 kbits true dual-port |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Voltage | 1.2 V to 1.5 V |
| Supply Voltage | 1.5 V |
| Package | 896-ball FBGA (FGG896), 1 mm pitch |
| Logic Family | CMOS |
| Operating Temperature | 0 to 70 C |
| Mounting Type | Surface Mount |
| Configuration | Non-volatile flash, live-at-power-up Level 0, single-chip |
| Low-Power Feature | Flash*Freeze technology |
| Boundary Scan | IEEE 1149.1 (JTAG) |
| Input Features | Schmitt trigger option on single-ended inputs; weak pull-up/pull-down |
A3PE3000L-FGG896M 896-ball fbga (fgg896), 1 mm pitch Pin Configuration Guide
Complete pinout information for A3PE3000L-FGG896M (896-ball fbga (fgg896), 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-FGG896M.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-FGG896M is suitable for 6 applications: Low-Power Industrial Control, Military and Avionic Glue Logic, Battery-Powered Portable Instrumentation, Secure Boot and Single-Chip Systems, Communications Line Cards, Test and Measurement Equipment.
Low-Power Industrial Control
Industrial controllers benefit from the A3PE3000L-FGG896M's flash fabric, which boots instantly at power-up (Level 0 live-at-power-up) without an external configuration flash, reducing BOM cost and boot failures in electrically noisy factory environments. With 3,000,000 system gates and up to 616 user I/Os, a single device can consolidate PLC glue logic, motor-control sequencing, and sensor aggregation. The 1.2 V to 1.5 V core on a 130-nm flash CMOS process keeps dynamic power manageable, and IEEE 1149.1 JTAG boundary scan supports in-field board diagnostics. Schmitt-trigger I/O options improve noise margins on long sensor lines.
Recommended
Military and Avionic Glue Logic
The A3PE3000L belongs to the military ProASIC3/EL low-power flash FPGA family, making the FGG896M grade a natural fit for defense and avionic board designs that consolidate legacy glue logic. The non-volatile flash fabric avoids configuration-readout security concerns of SRAM FPGAs, and Flash*Freeze technology cuts standby power in duty-cycled payloads. The 896-ball FBGA provides 616 user I/Os for interfacing legacy parallel buses, MIL-STD-style discretes, and mixed-voltage banks. Designers should verify temperature grades: the M suffix targets the controlled 0 to 70 C envelope, while I-suffix variants extend the range.
Recommended
Battery-Powered Portable Instrumentation
Portable instruments exploit the A3PE3000L-FGG896M's defining feature: Flash*Freeze technology, which freezes logic and I/O state while cutting static power to near zero and resumes operation instantly. The 1.2 V to 1.5 V core supply on the 130-nm flash CMOS process minimizes dynamic energy per operation, and the single-chip live-at-power-up configuration removes the boot latency and current spike of loading a bitstream from external flash. With 504 kbits of true dual-port SRAM, the device buffers acquisition data locally, and 616 I/Os connect ADCs, displays, and communication transceivers.
Recommended
Secure Boot and Single-Chip Systems
Flash-based ProASIC3L devices support secure, single-chip designs: the bitstream lives in non-volatile flash on the die, so no external configuration memory can be read or substituted, and Level 0 live-at-power-up logic is active before the system processor starts. The A3PE3000L-FGG896M's 3M gates implement power-on sequencing, supply supervisors, and bus firewalls around a host CPU. Weak pull-up/pull-down options simplify board bring-up, and the JTAG boundary-scan chain supports manufacturing test. Compared with SRAM FPGAs needing encrypted bitstreams and external key storage, this fabric simplifies the security architecture.
Recommended
Communications Line Cards
Line-card designs use the A3PE3000L-FGG896M to bridge backplane interfaces, aggregate framer/PHY control signals, and implement state machines between high-speed SERDES devices. The 616 user I/O capacity of the FGG896 package handles wide parallel buses across multiple I/O banks, with Schmitt-trigger inputs improving tolerance of backplane ringing. True dual-port SRAM (504 kbits) implements FIFOs between clock domains, a common line-card requirement. The flash fabric's instant-on behavior simplifies hot-swap sequencing, and the -1 speed grade variant (A3PE3000L-1FGG896M) is available when timing paths are aggressive.
Recommended
Test and Measurement Equipment
Bench and rack instruments use the A3PE3000L-FGG896M as instant-on control logic that is ready before the host CPU boots, handling trigger distribution, relay switching matrices, and front-panel interfaces. The 75,264 logic cells and 504 kbits of dual-port SRAM support timestamping and capture buffers, while 616 I/Os interface multiple measurement channels through the dense 896-ball FBGA. IEEE 1149.1 boundary scan enables in-system board test, reducing production cost. Flash*Freeze keeps standby draw low between measurements, extending rack-level thermal and energy budgets.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-FGG896M — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-FGG896I | A3PE3000L-1FGG896M | A3PE3000L-1FGG896I | A3PE3000-FGG896I |
|---|---|---|---|---|---|
| Package | 896-ball FBGA (FGG896), 1 mm pitch | 896-ball FBGA (FGG896) - same | 896-ball FBGA (FGG896) - same | 896-ball FBGA (FGG896) - same | 896-ball FBGA (FGG896) - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/Os | 616 (620 per DigiKey listing) | 616 | 620 | 620 | 616 |
| Embedded SRAM | 504 kbits true dual-port | 504 kbits | 504 kbits | 504 kbits | 504 kbits |
| Flash*Freeze Technology | Yes | Yes | Yes | Yes | No (non-L die) |
| Speed Grade | Standard | Standard | -1 (faster) | -1 (faster) | Standard |
| Operating Temperature | 0 to 70 C | Industrial (extended) | 0 to 70 C | Industrial (extended) | Industrial (extended) |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
Key Differentiators
- Flash*Freeze low-power standby (vs A3PE3000-FGG896I)
- Non-volatile single-chip configuration (vs A3PE3000L-1FGG896M)
- High I/O density in one footprint (vs A3PE600L-FGG484M)
Design Notes
The A3PE3000L uses separate 1.2 V core and 1.5 V/3.3 V I/O-class rails on a 1.2 V-1.5 V core architecture; sequence the core rail per the ProASIC3L datasheet power-up requirements and exploit Level 0 live-at-power-up so configuration-free logic is active immediately. Use Flash*Freeze aggressively in duty-cycled systems - it freezes state and cuts static power to near zero without losing registers, unlike SRAM FPGAs that would need reconfiguration on wake.
The 896-ball FGG package with 1 mm ball pitch requires careful fanout planning; use via-in-pad or dog-bone escape on outer rows and verify BGA land pattern per Microchip package drawing. Allocate solid ground planes under the ball field for the 616 user I/O banks, and keep bank voltage rails per the I/O banking rules before fixing the pinout - bank violations are the most common re-spin cause on FGG896 ProASIC3 designs.
Enable the Schmitt-trigger option on single-ended inputs (available on A3PE3000L) for slow or noisy edges, and use the weak pull-up/pull-down options instead of external resistors to save BOM. Route JTAG (IEEE 1149.1) as a short daisy chain with series termination; the boundary-scan chain also aids board-level manufacturing test across the 896-ball package.
Compliance Information
The Mouser listing for the related A3PE3000L-FGG896 identifies it as LEAD FREE; full RoHS/REACH status per the manufacturer product page was not captured in the verified data.
