A3PE3000L-FGG896M - 3M-Gate Low-Power Flash FPGA | Microchip
부품 번호: A3PE3000L-FGG896M ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1 | $1.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
A3PE3000L-FGG896M 개요
A field-programmable gate array (FPGA) is a semiconductor device that can be configured by the designer after manufacturing, sitting within the programmable logic hierarchy of FPGA -> programmable logic device -> digital logic IC. Unlike SRAM-based FPGAs, the ProASIC3L family uses a 130-nm, 7-layer-metal (6 copper) flash-based CMOS process, giving it a non-volatile fabric.
Key features include Flash*Freeze technology for near-zero-power standby, live-at-power-up (Level 0) operation for single-chip solutions without an external configuration device, and pin compatibility across the ProASIC3L family (except PQ208). The flash-based fabric eliminates configuration time and configuration-readout security concerns common to SRAM FPGAs.
Technically, the device integrates 75,264 logic cells (DigiKey lists 516,096 block figures for the 896-ball option) on the 1.2 V/1.5 V core architecture. Weak pull-up/pull-down options and Schmitt-trigger inputs on single-ended I/Os (A3PE3000L) improve signal integrity, while IEEE 1149.1 (JTAG) boundary scan supports board-level test. The military ProASIC3/EL variant datasheet confirms the low-power focus of the L-suffix grade.
Typical applications include low-power industrial control, portable and battery-operated instrumentation, military and avionic glue logic consolidation, communications line cards, and single-chip secure boot designs where an external configuration flash would be a liability.
When designing with this device, keep core voltage rails tightly regulated and use the Flash*Freeze mode to exploit its static-power advantage; verify I/O banking rules before fixing the pinout.
This page synthesizes distributor pricing, drop-in alternatives, FAQs, and practical design notes not found in the manufacturer datasheet, with data verified as of 2026-09-02.
드롭인 대체품: A3PE3000L-FGG896M — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000L-FGG896M (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Configuration Memory, Operating Temperature, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000L-FGG896I
✅ 드롭인✓ 재고 있음
$139.9 / 개
데이터시트 보기 →A3PE3000L-1FGG896M
✅ 드롭인✓ 재고 있음
$432 / 개
데이터시트 보기 →A3PE3000L-1FGG896I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-FGG896
✅ 드롭인✓ 재고 있음
$55 / 개
데이터시트 보기 →A3PE3000-FGG896I
✅ 드롭인✓ 재고 있음
$135.2 / 개
데이터시트 보기 →A3PE3000L-FG896I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-FGG896M 최대 정격 & 전기적 특성
| Family | ProASIC3L (Flash-based FPGA) |
| System Gates | 3,000,000 |
| Logic Cells | 75,264 |
| User I/Os | Up to 616 (620 per DigiKey listing) |
| Embedded SRAM | 504 kbits true dual-port |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Voltage | 1.2 V to 1.5 V |
| 공급 전압 | 1.5 V |
| 패키지 | 896-ball FBGA (FGG896), 1 mm pitch |
| Logic Family | CMOS |
| 동작 온도 | 0 to 70 C |
| 실장 유형 | Surface Mount |
| Configuration | Non-volatile flash, live-at-power-up Level 0, single-chip |
| Low-Power Feature | Flash*Freeze technology |
| Boundary Scan | IEEE 1149.1 (JTAG) |
| Input Features | Schmitt trigger option on single-ended inputs; weak pull-up/pull-down |
A3PE3000L-FGG896M 896-ball fbga (fgg896), 1 mm pitch 핀 구성 가이드
A3PE3000L-FGG896M(896-ball fbga (fgg896), 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000L-FGG896M.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000L-FGG896M 적합 용도: 6 애플리케이션s: Low-Power Industrial Control, Military and Avionic Glue Logic, Battery-Powered Portable Instrumentation, Secure Boot and Single-Chip Systems, Communications Line Cards, Test and Measurement Equipment.
Low-Power Industrial Control
Industrial controllers benefit from the A3PE3000L-FGG896M's flash fabric, which boots instantly at power-up (Level 0 live-at-power-up) without an external configuration flash, reducing BOM cost and boot failures in electrically noisy factory environments. With 3,000,000 system gates and up to 616 user I/Os, a single device can consolidate PLC glue logic, motor-control sequencing, and sensor aggregation. The 1.2 V to 1.5 V core on a 130-nm flash CMOS process keeps dynamic power manageable, and IEEE 1149.1 JTAG boundary scan supports in-field board diagnostics. Schmitt-trigger I/O options improve noise margins on long sensor lines.
추천
Military and Avionic Glue Logic
The A3PE3000L belongs to the military ProASIC3/EL low-power flash FPGA family, making the FGG896M grade a natural fit for defense and avionic board designs that consolidate legacy glue logic. The non-volatile flash fabric avoids configuration-readout security concerns of SRAM FPGAs, and Flash*Freeze technology cuts standby power in duty-cycled payloads. The 896-ball FBGA provides 616 user I/Os for interfacing legacy parallel buses, MIL-STD-style discretes, and mixed-voltage banks. Designers should verify temperature grades: the M suffix targets the controlled 0 to 70 C envelope, while I-suffix variants extend the range.
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Battery-Powered Portable Instrumentation
Portable instruments exploit the A3PE3000L-FGG896M's defining feature: Flash*Freeze technology, which freezes logic and I/O state while cutting static power to near zero and resumes operation instantly. The 1.2 V to 1.5 V core supply on the 130-nm flash CMOS process minimizes dynamic energy per operation, and the single-chip live-at-power-up configuration removes the boot latency and current spike of loading a bitstream from external flash. With 504 kbits of true dual-port SRAM, the device buffers acquisition data locally, and 616 I/Os connect ADCs, displays, and communication transceivers.
추천
Secure Boot and Single-Chip Systems
Flash-based ProASIC3L devices support secure, single-chip designs: the bitstream lives in non-volatile flash on the die, so no external configuration memory can be read or substituted, and Level 0 live-at-power-up logic is active before the system processor starts. The A3PE3000L-FGG896M's 3M gates implement power-on sequencing, supply supervisors, and bus firewalls around a host CPU. Weak pull-up/pull-down options simplify board bring-up, and the JTAG boundary-scan chain supports manufacturing test. Compared with SRAM FPGAs needing encrypted bitstreams and external key storage, this fabric simplifies the security architecture.
추천
Communications Line Cards
Line-card designs use the A3PE3000L-FGG896M to bridge backplane interfaces, aggregate framer/PHY control signals, and implement state machines between high-speed SERDES devices. The 616 user I/O capacity of the FGG896 package handles wide parallel buses across multiple I/O banks, with Schmitt-trigger inputs improving tolerance of backplane ringing. True dual-port SRAM (504 kbits) implements FIFOs between clock domains, a common line-card requirement. The flash fabric's instant-on behavior simplifies hot-swap sequencing, and the -1 speed grade variant (A3PE3000L-1FGG896M) is available when timing paths are aggressive.
추천
Test and Measurement Equipment
Bench and rack instruments use the A3PE3000L-FGG896M as instant-on control logic that is ready before the host CPU boots, handling trigger distribution, relay switching matrices, and front-panel interfaces. The 75,264 logic cells and 504 kbits of dual-port SRAM support timestamping and capture buffers, while 616 I/Os interface multiple measurement channels through the dense 896-ball FBGA. IEEE 1149.1 boundary scan enables in-system board test, reducing production cost. Flash*Freeze keeps standby draw low between measurements, extending rack-level thermal and energy budgets.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE3000L-FGG896M — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000L-FGG896I | A3PE3000L-1FGG896M | A3PE3000L-1FGG896I | A3PE3000-FGG896I |
|---|---|---|---|---|---|
| Package | 896-ball FBGA (FGG896), 1 mm pitch | 896-ball FBGA (FGG896) - same | 896-ball FBGA (FGG896) - same | 896-ball FBGA (FGG896) - same | 896-ball FBGA (FGG896) - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/Os | 616 (620 per DigiKey listing) | 616 | 620 | 620 | 616 |
| Embedded SRAM | 504 kbits true dual-port | 504 kbits | 504 kbits | 504 kbits | 504 kbits |
| Flash*Freeze Technology | Yes | Yes | Yes | Yes | No (non-L die) |
| Speed Grade | Standard | Standard | -1 (faster) | -1 (faster) | Standard |
| Operating Temperature | 0 to 70 C | Industrial (extended) | 0 to 70 C | Industrial (extended) | Industrial (extended) |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
주요 차별점
- Flash*Freeze low-power standby (vs A3PE3000-FGG896I)
- Non-volatile single-chip configuration (vs A3PE3000L-1FGG896M)
- High I/O density in one footprint (vs A3PE600L-FGG484M)
설계 노트
The A3PE3000L uses separate 1.2 V core and 1.5 V/3.3 V I/O-class rails on a 1.2 V-1.5 V core architecture; sequence the core rail per the ProASIC3L datasheet power-up requirements and exploit Level 0 live-at-power-up so configuration-free logic is active immediately. Use Flash*Freeze aggressively in duty-cycled systems - it freezes state and cuts static power to near zero without losing registers, unlike SRAM FPGAs that would need reconfiguration on wake.
The 896-ball FGG package with 1 mm ball pitch requires careful fanout planning; use via-in-pad or dog-bone escape on outer rows and verify BGA land pattern per Microchip package drawing. Allocate solid ground planes under the ball field for the 616 user I/O banks, and keep bank voltage rails per the I/O banking rules before fixing the pinout - bank violations are the most common re-spin cause on FGG896 ProASIC3 designs.
Enable the Schmitt-trigger option on single-ended inputs (available on A3PE3000L) for slow or noisy edges, and use the weak pull-up/pull-down options instead of external resistors to save BOM. Route JTAG (IEEE 1149.1) as a short daisy chain with series termination; the boundary-scan chain also aids board-level manufacturing test across the 896-ball package.
규정 준수 정보
The Mouser listing for the related A3PE3000L-FGG896 identifies it as LEAD FREE; full RoHS/REACH status per the manufacturer product page was not captured in the verified data.
