EP1AGX60DF780C7 - Arria GX FPGA, 60K LE, 780-BGA | Intel (Altera)
Référence : EP1AGX60DF780C7 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2 650,00 |
| 100 | $235 | $23 500,00 |
| 500 | $210 | $105 000,00 |
| 1 000 | $195 | $195 000,00 |
EP1AGX60DF780C7 Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit above ASICs and microcontrollers in the design flexibility hierarchy: unlike ASICs they require no mask set, and unlike microcontrollers they deliver true hardware parallelism. Arria GX in particular bridged the gap between Stratix-class high-end transceivers and the lower-cost Cyclone families when introduced.
Key features of the EP1AGX60DF780C7 include up to 8 full-duplex multi-gigabit transceivers supporting CPRI, Serial RapidIO, PCI Express, and Gigabit Ethernet physical interfaces, dedicated on-die termination for LVDS and SSTL signaling, and embedded TriMatrix memory blocks distributed across the fabric. The device also integrates phase-locked loops (PLLs) for clock management and supports configuration via passive serial, fast passive parallel, and JTAG modes.
The EP1AGX60DF780C7 is implemented in a 90 nm process node with a copper interconnect stack and uses 1.2 V core / 2.5 V-3.3 V I/O supply rails. Architecture-wise, the Arria GX fabric combines 8-input adaptive logic modules (ALMs) with M512, M4K, and M-RAM block memory tiers, enabling efficient implementation of buffer-heavy designs such as packet processors and baseband datapaths.
Typical applications include wireless baseband processing, Serial RapidIO bridging, telecom backplane aggregation, and broadcast video processing. Designers also deploy the part in test-and-measurement instrumentation where the embedded transceivers eliminate the need for external PHY devices. Because the device is mature, it is frequently seen in long-lifecycle defense and industrial programs where re-qualification costs discourage migration.
When designing with the EP1AGX60DF780C7, pay close attention to the 780-BGA fan-out and decoupling scheme - the FineLine BGA land pattern requires microvia or via-in-pad PCB technology for reliable assembly. Quartus II software (13.0 or earlier) is required for design entry; newer Quartus releases have dropped Arria GX device support. Consider migrating to Cyclone V or Arria V for new designs.
This page synthesizes distributor pricing, drop-in alternatives from the same Arria GX family, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EP1AGX60DF780C7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1AGX60DF780C7 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Transceivers, Mounting Type, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1AGX60DF780C6N
✅ Remplacement direct✓ En stock
$142 / unité
Voir la fiche technique →EP1AGX60DF780C7 Valeurs maximales et caractéristiques électriques
| Series | Arria GX |
| Logic Elements | 60,100 |
| Embedded Memory | 2,528,640 bits |
| Total Block Memory Bits | 2,528,640 |
| Transceivers | Up to 8 multi-gigabit transceivers |
| Boîtier | 780-BBGA, FC (Flip-Chip) FineLine BGA |
| Speed Grade | C7 (commercial) |
| Process Node | 90 nm |
| Core Voltage | 1.2 V |
| I/O Voltage | 2.5 V / 3.3 V (LVTTL/LVCMOS/LVDS/SSTL) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du EP1AGX60DF780C7 780-bbga, fc (flip-chip) fineline bga
Configuration des broches du EP1AGX60DF780C7 (boîtier 780-bbga, fc (flip-chip) fineline bga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1AGX60DF780C7.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1AGX60DF780C7 convient pour 6 applications: Wireless Baseband Processing, Serial RapidIO Bridging, Telecom Backplane Aggregation, Broadcast Video Processing, Test and Measurement Instrumentation, Defense and Industrial Long-Lifecycle Systems.
Wireless Baseband Processing
The EP1AGX60DF780C7's 60,100 logic elements and 2,528,640 bits of embedded TriMatrix memory make it well-suited for wireless baseband signal processing in remote radio heads and small-cell base stations. Its up to 8 multi-gigabit transceivers support CPRI and OBSAI fronthaul links to the baseband unit at line rates up to 3.125 Gbps per lane, while the DSP blocks and M4K/M-RAM memory tiers handle chip-rate processing, scrambling, and channel estimation. Designers typically implement the FPGA alongside RF front-end converters, using the embedded PLLs to derive sample clocks and the LVDS I/O to interface parallel ADC/DAC data. Compared with an ASIC, the Arria GX allows late-stage algorithm changes critical to evolving 3G/4G standards.
Recommandé
Serial RapidIO Bridging
With up to 8 embedded multi-gigabit transceivers and dedicated on-die termination, the EP1AGX60DF780C7 is a strong fit for Serial RapidIO (SRIO) bridging between DSP clusters, network processors, and switch fabrics. The transceivers natively support 1.25 Gbps, 2.5 Gbps, and 3.125 Gbps SRIO physical layers without external PHY devices, simplifying board layout and reducing BOM cost. The 60K logic elements and 2.5 Mbit memory pool are sufficient to implement transaction-layer packet assembly, DMA engines, and error-handling state machines concurrently. Designers typically pair the FPGA with a Tsi578 or CPS-1432 SRIO switch for full-mesh DSP aggregation in radar or imaging systems.
Recommandé
Telecom Backplane Aggregation
The EP1AGX60DF780C7 excels in telecom backplane line-card aggregation where multiple lower-speed tributaries must be multiplexed onto higher-speed uplinks. Its transceiver array aggregates up to 8 lanes of SONET/SDH, OTU1, or 10 GbE traffic while the FPGA fabric performs mapping, framing, and pseudowire encapsulation in hardware. The 780-ball FineLine BGA supplies ample user I/O for local bus interfaces to network processors and traffic managers, and the LVDS-capable I/O banks handle board-level backplane signaling up to 1 Gbps. Compared with a discrete SERDES plus ASIC approach, the integrated transceivers cut board area by roughly 30% in typical line-card designs.
Recommandé
Broadcast Video Processing
Broadcast video routers, format converters, and contribution codecs rely on the EP1AGX60DF780C7's combination of high-density logic and abundant block memory for real-time SDI de-embedding, color-space conversion, and scaling. The M-RAM blocks at 500 Kbit granularity act as line buffers for HD-SDI and 3G-SDI streams, while the M4K blocks implement look-up tables for gamma correction and chromatic adaptation. LVDS I/O banks drive DVI/HDMI companion chips at pixel rates up to 165 MHz. With eight transceivers the FPGA can also embed optional SMPTE 2022 IP gateways for compressed video transport over Ethernet, all from a single chip.
Recommandé
Test and Measurement Instrumentation
Test-and-measurement platforms such as logic analyzers, protocol exercisers, and bit-error-rate testers leverage the EP1AGX60DF780C7's 8 transceivers for native stimulus/response at speeds up to 3.125 Gbps, eliminating external PHY chips that would add jitter and calibration complexity. The 60K logic elements support deep state machines and pattern generators, while the 2.5 Mbit memory pool stores captured waveforms for post-processing. Designers typically combine the FPGA with high-speed ADCs and DACs via LVDS interfaces, using the embedded PLLs to generate multiple phase-aligned sample clocks. The 780-FBGA package also provides the thermal headroom required for sustained 100% duty-cycle capture workloads.
Recommandé
Defense and Industrial Long-Lifecycle Systems
The EP1AGX60DF780C7 remains a popular choice for defense and industrial programs that were designed against the Arria GX family and cannot afford PCB re-spins for new FPGA generations. The mature 90 nm silicon is well-characterized for radiation-tolerant lot screening, and Altera/Intel typically honors long-term supply agreements for military customers. The 780-FBGA package has stable thermal-mechanical characteristics suitable for -40C to +85C industrial-grade operation when paired with the I-speed-grade variants EP1AGX60DF780I7 or EP1AGX50DF780I7. Engineers should still monitor Intel product change notifications and qualify a modern alternative such as Cyclone V GT for future design refreshes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1AGX60DF780C7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1AGX60DF780C6N |
|---|---|---|
| Package | 780-BBGA (FineLine BGA, flip-chip) | 780-BBGA (FineLine BGA, flip-chip) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) - same |
| Logic Elements | 60,100 | 60,100 |
| Embedded Memory | 2,528,640 bits | 2,528,640 bits |
| Transceivers | Up to 8 multi-gigabit | Up to 8 multi-gigabit |
| Speed Grade | C7 | C6 (faster Fmax) |
| Lead-Free (N) Suffix | No | Yes (N suffix) |
| Process Node | 90 nm | 90 nm |
| Approx. Unit Price (qty 1) | $285 USD | $280 USD |
Principaux différenciateurs
- Same-footprint, higher-speed drop-in alternative with lead-free finish (vs EP1AGX60DF780C6N)
- Last Time Buy status with broader transceiver bandwidth than Cyclone III (vs Cyclone III EP3C80F780C7)
Notes de conception
The 780-ball FineLine BGA uses flip-chip interconnect, so PCB design must employ microvia or via-in-pad technology to break out the 1.0 mm pitch ball array without violating manufacturing rules. Recommended stackup: 8-layer FR4-370HR with high-Tg laminate to match the package's CTE of 6 ppm/C. Place at least one 0.1 uF X7R 0402 decoupling capacitor per power pin pair, and use 4 oz copper on outer layers for transceiver supply rails to keep DC IR drop below 25 mV at peak current transients.
Estimated: with all 8 transceivers active at 3.125 Gbps PRBS-31 patterns and logic utilization near 80%, the EP1AGX60DF780C7 can dissipate 6-8 W at commercial temperature. The FineLine BGA's theta_JA of approximately 12 C/W (with 4-layer JEDEC test board) yields a 72-96 C junction temperature rise above ambient. For sustained full-load operation, attach a 15x15 mm copper heat spreader or small heatsink to the top of the package and ensure at least 400 LFM of airflow to stay within the 0C to +85C commercial junction limit.
Newer Quartus Prime releases (14.0 and later) have dropped Arria GX device support, so attempting to compile a design against Quartus Prime 18.x or 20.x will fail with 'device not supported' errors. Pin your toolchain to Quartus II 13.0 or earlier SP releases and archive the license file with the project. Also, do not mix industrial-temperature (I-grade) and commercial-temperature (C-grade) speed bins on the same PCB without re-validating timing closure - the I-grade parts have additional guard-banding that can flip setup/hold slack.
Informations de conformité
RoHS, REACH, lead-free, and halogen-free status for EP1AGX60DF780C7 are not stated in the verified web snippets provided. For C6N speed-grade variants the N suffix indicates lead-free compliance; the C7 part without N suffix may be SnPb-terminated. AEC-Q100 is not applicable to FPGAs.
