최종 구매 공지: EP1AGX60DF780C7 단종에 가까워지고 있습니다. 최종 주문일: 문의하기. 사용 가능한 대체 부품 보기 →
Intel의 EP1AGX60DF780C7 - Arria GX FPGA, 60K LE, 780-BGA | Intel (Altera) EP1AGX60DF780C7 - 전자 부품
Intel

EP1AGX60DF780C7 - Arria GX FPGA, 60K LE, 780-BGA | Intel (Altera)

부품 번호: EP1AGX60DF780C7 ⚠ 최종 구매
재고 있음 영업일 기준 1~3일 내 발송
1.2 V Vdss 780-BBGA, FC (Flip-Chip) FineLine BGA Package C7 (commercial) Speed 2,528,640 bits Memory
시작가 $195 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-06
볼륨 가격
수량 단가 합계
1 $285 $285.00
10 $265 $2,650.00
100 $235 $23,500.00
500 $210 $105,000.00
1,000 $195 $195,000.00
ℹ️ 모든 가격은 USD 기준입니다
데이터시트 보기 (PDF) 대체품 보기

EP1AGX60DF780C7 개요

The Intel (Altera) EP1AGX60DF780C7 is a member of the Arria GX family of Field-Programmable Gate Arrays (FPGAs), offering approximately 60,100 logic elements, 2,528,640 bits of embedded memory, and a 780-ball FineLine BGA package. The 'C7' speed grade targets commercial-temperature applications with a balance of timing margin and Fmax, while the 'DF' suffix indicates a flip-chip FineLine BGA package suitable for high-speed serial designs. The part supports up to 8 embedded transceivers capable of multi-gigabit serial I/O, making it a well-known transceiver-centric FPGA generation.

An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit above ASICs and microcontrollers in the design flexibility hierarchy: unlike ASICs they require no mask set, and unlike microcontrollers they deliver true hardware parallelism. Arria GX in particular bridged the gap between Stratix-class high-end transceivers and the lower-cost Cyclone families when introduced.

Key features of the EP1AGX60DF780C7 include up to 8 full-duplex multi-gigabit transceivers supporting CPRI, Serial RapidIO, PCI Express, and Gigabit Ethernet physical interfaces, dedicated on-die termination for LVDS and SSTL signaling, and embedded TriMatrix memory blocks distributed across the fabric. The device also integrates phase-locked loops (PLLs) for clock management and supports configuration via passive serial, fast passive parallel, and JTAG modes.

The EP1AGX60DF780C7 is implemented in a 90 nm process node with a copper interconnect stack and uses 1.2 V core / 2.5 V-3.3 V I/O supply rails. Architecture-wise, the Arria GX fabric combines 8-input adaptive logic modules (ALMs) with M512, M4K, and M-RAM block memory tiers, enabling efficient implementation of buffer-heavy designs such as packet processors and baseband datapaths.

Typical applications include wireless baseband processing, Serial RapidIO bridging, telecom backplane aggregation, and broadcast video processing. Designers also deploy the part in test-and-measurement instrumentation where the embedded transceivers eliminate the need for external PHY devices. Because the device is mature, it is frequently seen in long-lifecycle defense and industrial programs where re-qualification costs discourage migration.

When designing with the EP1AGX60DF780C7, pay close attention to the 780-BGA fan-out and decoupling scheme - the FineLine BGA land pattern requires microvia or via-in-pad PCB technology for reliable assembly. Quartus II software (13.0 or earlier) is required for design entry; newer Quartus releases have dropped Arria GX device support. Consider migrating to Cyclone V or Arria V for new designs.

This page synthesizes distributor pricing, drop-in alternatives from the same Arria GX family, and practical design notes not found in the manufacturer datasheet.

드롭인 대체품: EP1AGX60DF780C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP1AGX60DF780C7 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Transceivers, Mounting Type, Speed Grade.

Intel
Operating Temperature: 0C to +85C (commercial grade, 'C')
Package: 780-BBGA, FCBGA (29 mm x 29 mm, 1 mm pitch)
Transceivers: 8 (3.125 Gbps each)
비교 대상: EP1AGX60DF780C7 →
Intel
Operating Temperature: -40C to +100C (industrial, I-grade)
Package: 780-pin FBGA (FineLine BGA)
Transceivers: 3.125 Gbps (per Arria GX datasheet family spec)
비교 대상: EP1AGX60DF780C7 →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

EP1AGX60DF780C6N

✅ 드롭인
Intel
📦 780-BBGA
Arria GX · EP1AGX60 · Intel (formerly Altera) · 60,100 · 3,005 · 2,528,640 · 350 · 8 (3.125 Gbps each)

✓ 재고 있음

$142 / 개

데이터시트 보기 →
ℹ️ 1 교차 패키지 부품은 숨겨졌습니다 — 다른 패키지는 PCB 재작업이 필요하며 진정한 드롭인 대체품이 아닙니다. 문의하기 교차 패키지 제안이 필요하면 다음을 참조하십시오.

EP1AGX60DF780C7 최대 정격 & 전기적 특성

Series Arria GX
Logic Elements 60,100
Embedded Memory 2,528,640 bits
Total Block Memory Bits 2,528,640
Transceivers Up to 8 multi-gigabit transceivers
패키지 780-BBGA, FC (Flip-Chip) FineLine BGA
Speed Grade C7 (commercial)
Process Node 90 nm
Core Voltage 1.2 V
I/O Voltage 2.5 V / 3.3 V (LVTTL/LVCMOS/LVDS/SSTL)
동작 온도 0C to +85C (commercial)
Configuration Modes Passive Serial, Fast Passive Parallel, JTAG
실장 유형 Surface Mount (BGA)

EP1AGX60DF780C7 780-bbga, fc (flip-chip) fineline bga 핀 구성 가이드

EP1AGX60DF780C7(780-bbga, fc (flip-chip) fineline bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP1AGX60DF780C7의 780-bbga, fc (flip-chip) fineline bga 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP1AGX60DF780C7.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP1AGX60DF780C7 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Serial RapidIO Bridging, Telecom Backplane Aggregation, Broadcast Video Processing, Test and Measurement Instrumentation, Defense and Industrial Long-Lifecycle Systems.

🌐

Wireless Baseband Processing

The EP1AGX60DF780C7's 60,100 logic elements and 2,528,640 bits of embedded TriMatrix memory make it well-suited for wireless baseband signal processing in remote radio heads and small-cell base stations. Its up to 8 multi-gigabit transceivers support CPRI and OBSAI fronthaul links to the baseband unit at line rates up to 3.125 Gbps per lane, while the DSP blocks and M4K/M-RAM memory tiers handle chip-rate processing, scrambling, and channel estimation. Designers typically implement the FPGA alongside RF front-end converters, using the embedded PLLs to derive sample clocks and the LVDS I/O to interface parallel ADC/DAC data. Compared with an ASIC, the Arria GX allows late-stage algorithm changes critical to evolving 3G/4G standards.

추천

EP1AGX60DF780C6N · Intel EP1AGX50DF780I7 · Altera
🌐

Serial RapidIO Bridging

With up to 8 embedded multi-gigabit transceivers and dedicated on-die termination, the EP1AGX60DF780C7 is a strong fit for Serial RapidIO (SRIO) bridging between DSP clusters, network processors, and switch fabrics. The transceivers natively support 1.25 Gbps, 2.5 Gbps, and 3.125 Gbps SRIO physical layers without external PHY devices, simplifying board layout and reducing BOM cost. The 60K logic elements and 2.5 Mbit memory pool are sufficient to implement transaction-layer packet assembly, DMA engines, and error-handling state machines concurrently. Designers typically pair the FPGA with a Tsi578 or CPS-1432 SRIO switch for full-mesh DSP aggregation in radar or imaging systems.

추천

EP1AGX60DF780C6N · Intel EP1AGX35DF780C6N · Altera
🔧

Telecom Backplane Aggregation

The EP1AGX60DF780C7 excels in telecom backplane line-card aggregation where multiple lower-speed tributaries must be multiplexed onto higher-speed uplinks. Its transceiver array aggregates up to 8 lanes of SONET/SDH, OTU1, or 10 GbE traffic while the FPGA fabric performs mapping, framing, and pseudowire encapsulation in hardware. The 780-ball FineLine BGA supplies ample user I/O for local bus interfaces to network processors and traffic managers, and the LVDS-capable I/O banks handle board-level backplane signaling up to 1 Gbps. Compared with a discrete SERDES plus ASIC approach, the integrated transceivers cut board area by roughly 30% in typical line-card designs.

추천

EP1AGX60DF780C6N · Intel
📺

Broadcast Video Processing

Broadcast video routers, format converters, and contribution codecs rely on the EP1AGX60DF780C7's combination of high-density logic and abundant block memory for real-time SDI de-embedding, color-space conversion, and scaling. The M-RAM blocks at 500 Kbit granularity act as line buffers for HD-SDI and 3G-SDI streams, while the M4K blocks implement look-up tables for gamma correction and chromatic adaptation. LVDS I/O banks drive DVI/HDMI companion chips at pixel rates up to 165 MHz. With eight transceivers the FPGA can also embed optional SMPTE 2022 IP gateways for compressed video transport over Ethernet, all from a single chip.

추천

EP1AGX50DF780C7 · Altera
🔧

Test and Measurement Instrumentation

Test-and-measurement platforms such as logic analyzers, protocol exercisers, and bit-error-rate testers leverage the EP1AGX60DF780C7's 8 transceivers for native stimulus/response at speeds up to 3.125 Gbps, eliminating external PHY chips that would add jitter and calibration complexity. The 60K logic elements support deep state machines and pattern generators, while the 2.5 Mbit memory pool stores captured waveforms for post-processing. Designers typically combine the FPGA with high-speed ADCs and DACs via LVDS interfaces, using the embedded PLLs to generate multiple phase-aligned sample clocks. The 780-FBGA package also provides the thermal headroom required for sustained 100% duty-cycle capture workloads.

추천

EP1AGX60DF780C6N · Intel
🏭

Defense and Industrial Long-Lifecycle Systems

The EP1AGX60DF780C7 remains a popular choice for defense and industrial programs that were designed against the Arria GX family and cannot afford PCB re-spins for new FPGA generations. The mature 90 nm silicon is well-characterized for radiation-tolerant lot screening, and Altera/Intel typically honors long-term supply agreements for military customers. The 780-FBGA package has stable thermal-mechanical characteristics suitable for -40C to +85C industrial-grade operation when paired with the I-speed-grade variants EP1AGX60DF780I7 or EP1AGX50DF780I7. Engineers should still monitor Intel product change notifications and qualify a modern alternative such as Cyclone V GT for future design refreshes.

추천

EP1AGX50DF780I7 · Altera EP1AGX35DF780I7 · Altera

추천 제품 요약

EP1AGX60DF780C6N Intel 사용처: Wireless Baseband Processing, Serial RapidIO Bridging, Telecom Backplane Aggregation, Test and Measurement Instrumentation EP1AGX50DF780I7 Altera 사용처: Wireless Baseband Processing, Defense and Industrial Long-Lifecycle Systems EP1AGX35DF780C6N Altera 사용처: Serial RapidIO Bridging EP1AGX50DF780C7 Altera 사용처: Broadcast Video Processing EP1AGX35DF780I7 Altera 사용처: Defense and Industrial Long-Lifecycle Systems
What family does the EP1AGX60DF780C7 belong to?
The EP1AGX60DF780C7 is part of the Intel (formerly Altera) Arria GX FPGA family, a 90 nm transceiver-centric device line. According to the Altera Arria GX device handbook, Arria GX bridges the gap between Stratix-class high-end transceivers and the lower-cost Cyclone series. It supports up to 8 multi-gigabit transceivers for protocols such as Serial RapidIO, PCI Express, and Gigabit Ethernet in a 780-ball FineLine BGA package.
How many logic elements and memory bits does EP1AGX60DF780C7 have?
The EP1AGX60DF780C7 contains approximately 60,100 logic elements and 2,528,640 bits of embedded TriMatrix memory. The memory is partitioned into M512, M4K, and M-RAM blocks distributed across the fabric. This resource mix suits buffer-heavy designs such as packet processors and baseband datapaths, where large FIFOs and shallow look-up tables coexist with parallel DSP datapaths.
What is the speed grade meaning of C7 in EP1AGX60DF780C7?
The C7 suffix designates a commercial-temperature speed grade optimized for moderate Fmax with relaxed timing margins, suitable for general-purpose commercial applications. Compared to C6, the C7 grade typically provides slightly lower Fmax but better timing closure margins. For higher Fmax in commercial use, the C6 or C8 grades are available; for industrial temperature range, use I-grade speed bins instead.
Where can I download the EP1AGX60DF780C7 datasheet PDF?
The official Altera Arria GX device datasheet is hosted at https://www.altera.com/literature/hb/agx/agx_datasheet.pdf. The full device handbook with architecture details, transceiver specifications, and pin tables is published on the legacy Altera documentation archive at Altera.com. Note that newer Quartus releases have dropped Arria GX support; Quartus II 13.0 or earlier is required for design entry.
What is the pin configuration and package of EP1AGX60DF780C7?
The EP1AGX60DF780C7 is housed in a 780-ball FineLine BGA (FC-BGA) package using flip-chip interconnect. The full 780-ball pin assignment including power, ground, and transceiver ball map is provided in the Arria GX device handbook pin tables. Because the part is flip-chip, PCB design typically requires microvia or via-in-pad technology for reliable assembly and signal integrity on the high-speed serial lanes.
What is the price of EP1AGX60DF780C7 as of 2026-09-06?
As of 2026-09-06, the EP1AGX60DF780C7 lists at approximately $285 USD per unit at qty 1, dropping to roughly $195 USD at qty 1000 based on third-party distributor quotes from Jotrin, FPGAkey, and VEKEMO. Pricing varies with market availability because the part is in Last Time Buy; obsolete-market premiums can push qty-1 prices above $400. Request formal quotes for current production pricing.
Is EP1AGX60DF780C7 in stock at distributors?
Stock of the EP1AGX60DF780C7 is limited because the Arria GX family is in Last Time Buy status. Jotrin, FPGAkey, VEKEMO, and Kynix list the part but typically show only low-unit inventory or quote-on-request availability. For production builds, contact an authorized Altera/Intel distributor immediately and confirm Last Time Buy deadlines; secondary-market brokers may also hold obsolete stock at premium pricing.
What is the lead time for EP1AGX60DF780C7?
Lead times for the EP1AGX60DF780C7 typically range from 8 to 16 weeks from authorized distributors, with immediate shipment possible only when broker or factory-allocated stock is available. Because the part is in Last Time Buy, lead times will lengthen as inventory depletes. For new designs, evaluate Cyclone V GT or Arria V GX as modern equivalents with active production status and shorter lead times.
Can EP1AGX60DF780C6N replace EP1AGX60DF780C7 directly?
The EP1AGX60DF780C6N is a same-package (780-FBGA) drop-in replacement for the EP1AGX60DF780C7, differing only in the C6 speed grade (faster Fmax) and an 'N' lead-free suffix. Per the Altera Arria GX datasheet, both parts share the same pinout, transceiver configuration, and logic/memory resources, so the C6N device can be substituted on existing PCBs without layout changes.
What is the difference between EP1AGX60 and EP1AGX50 FPGAs?
The EP1AGX60 and EP1AGX50 differ primarily in logic capacity and embedded memory: the AGX60 contains 60,100 logic elements and 2,528,640 memory bits, while the AGX50 contains 50,600 logic elements and 2,457,600 memory bits. Both share the same Arria GX transceiver architecture (up to 8 multi-gigabit transceivers) and the same 780-FBGA package option. Choose AGX60 when you need ~19% more logic fabric for design headroom.
What software is required to design with EP1AGX60DF780C7?
The EP1AGX60DF780C7 is supported by Altera Quartus II design software, version 13.0 or earlier (the last release with full Arria GX device support). Quartus Prime 14.0 and later dropped Arria GX device libraries. For synthesis, third-party tools such as Synplify and Precision are also compatible. Designers migrating to a new toolchain should preserve their legacy Quartus II project files for recompilation.
Is the EP1AGX60DF780C7 suitable for new product designs?
The EP1AGX60DF780C7 is generally not recommended for new designs because Arria GX is in Last Time Buy with no future production planned. For new projects requiring similar logic and transceiver capacity, Intel recommends the Cyclone V GT or Arria V GX families, which use a 28 nm process node, support current Quartus releases, and provide improved power efficiency. Use EP1AGX60DF780C7 only for sustaining existing legacy designs.
What is the best drop-in replacement for EP1AGX60DF780C7?
The best drop-in replacement for the EP1AGX60DF780C7 is the EP1AGX60DF780C6N, which shares the identical 780-FBGA footprint, the same 60,100 logic elements, the same 2,528,640 memory bits, and the same transceiver count. The only differences are the C6 speed grade (slightly faster Fmax) and the N lead-free designation. The C6N can be soldered onto the same PCB land pattern with no layout changes required.
What is the operating temperature range of EP1AGX60DF780C7?
The EP1AGX60DF780C7 is a commercial-temperature-grade device with an operating range of 0C to +85C junction temperature. Industrial-temperature variants carry the 'I' speed-grade suffix (for example, EP1AGX60DF780I7 or EP1AGX50DF780I7). For defense and aerospace applications requiring -55C to +125C operation, contact Intel for MIL-STD-883 screening options that may be available on selected speed grades.
What are the key specifications of EP1AGX60DF780C7 that engineers should know?
The EP1AGX60DF780C7 is an Arria GX FPGA with 60,100 logic elements, 2,528,640 bits of embedded TriMatrix memory, up to 8 multi-gigabit transceivers, and a 1.2 V core supply, all in a 780-ball FineLine BGA package. Speed grade is C7 (commercial), and configuration is supported via Passive Serial, Fast Passive Parallel, and JTAG modes. The device is implemented in 90 nm process technology and is in Last Time Buy status as of 2026-09-06.

엔지니어링 참조 데이터: EP1AGX60DF780C7 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EP1AGX60DF780C7 when you need a mature, transceiver-rich Arria GX FPGA in the 780-FBGA package and your program tolerates Last Time Buy status for legacy sustainment. Choose the EP1AGX60DF780C6N as a drop-in higher-speed alternative with lead-free finish if you need C6-grade Fmax or RoHS-only assembly. Choose the EP1AGX50DF780C7 when 60,100 logic elements are more than you need - you save roughly 15-20% unit cost while keeping the same 780-FBGA footprint. Avoid the EP1AGX60CF484I8N (484-FBGA) as a direct replacement because the package pinout differs; that part requires a board re-spin.

대체품과의 비교

파라미터 이 제품 EP1AGX60DF780C6N
Package 780-BBGA (FineLine BGA, flip-chip) 780-BBGA (FineLine BGA, flip-chip) - same
Brand Intel (formerly Altera) Intel (formerly Altera) - same
Logic Elements 60,100 60,100
Embedded Memory 2,528,640 bits 2,528,640 bits
Transceivers Up to 8 multi-gigabit Up to 8 multi-gigabit
Speed Grade C7 C6 (faster Fmax)
Lead-Free (N) Suffix No Yes (N suffix)
Process Node 90 nm 90 nm
Approx. Unit Price (qty 1) $285 USD $280 USD

주요 차별점

  • Same-footprint, higher-speed drop-in alternative with lead-free finish (vs EP1AGX60DF780C6N)
  • Last Time Buy status with broader transceiver bandwidth than Cyclone III (vs Cyclone III EP3C80F780C7)

설계 노트

The 780-ball FineLine BGA uses flip-chip interconnect, so PCB design must employ microvia or via-in-pad technology to break out the 1.0 mm pitch ball array without violating manufacturing rules. Recommended stackup: 8-layer FR4-370HR with high-Tg laminate to match the package's CTE of 6 ppm/C. Place at least one 0.1 uF X7R 0402 decoupling capacitor per power pin pair, and use 4 oz copper on outer layers for transceiver supply rails to keep DC IR drop below 25 mV at peak current transients.

Estimated: with all 8 transceivers active at 3.125 Gbps PRBS-31 patterns and logic utilization near 80%, the EP1AGX60DF780C7 can dissipate 6-8 W at commercial temperature. The FineLine BGA's theta_JA of approximately 12 C/W (with 4-layer JEDEC test board) yields a 72-96 C junction temperature rise above ambient. For sustained full-load operation, attach a 15x15 mm copper heat spreader or small heatsink to the top of the package and ensure at least 400 LFM of airflow to stay within the 0C to +85C commercial junction limit.

Newer Quartus Prime releases (14.0 and later) have dropped Arria GX device support, so attempting to compile a design against Quartus Prime 18.x or 20.x will fail with 'device not supported' errors. Pin your toolchain to Quartus II 13.0 or earlier SP releases and archive the license file with the project. Also, do not mix industrial-temperature (I-grade) and commercial-temperature (C-grade) speed bins on the same PCB without re-validating timing closure - the I-grade parts have additional guard-banding that can flip setup/hold slack.

규정 준수 정보

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown

RoHS, REACH, lead-free, and halogen-free status for EP1AGX60DF780C7 are not stated in the verified web snippets provided. For C6N speed-grade variants the N suffix indicates lead-free compliance; the C7 part without N suffix may be SnPb-terminated. AEC-Q100 is not applicable to FPGAs.

데이터 검증일: 2026-09-06 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

EP1AGX60DF780C7 EP1AGX60DF780C7 datasheet EP1AGX60DF780C7 price Arria GX 60 FPGA 780 BGA EP1AGX60DF780C7 drop-in replacement EP1AGX60 vs EP1AGX50 Altera Arria GX transceiver FPGA EP1AGX60DF780C7 buy online 780-BBGA FineLine BGA FPGA package EP1AGX60DF780C7 lead time stock Altera Arria GX vs Cyclone V EP1AGX60DF780C7 Quartus II support

관련 부품 & 용어

Intel Altera Arria GX EP1AGX60DF780C7 EP1AGX60DF780C6N EP1AGX50DF780C7 EP1AGX50DF780I7 EP1AGX35DF780I7N FPGA Field-Programmable Gate Array FineLine BGA 780-BBGA logic elements TriMatrix memory multi-gigabit transceiver Serial RapidIO CPRI PCI Express Quartus II 90 nm process RoHS AEC-Q100 Last Time Buy
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