EP1M350F780C6N - Mercury 350K FPGA, 486 I/O, 780-BGA | Intel (Altera)
Référence : EP1M350F780C6N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2 685,00 |
| 100 | $252 | $25 200,00 |
| 500 | $235.75 | $117 875,00 |
| 1 000 | $219.4 | $219 400,00 |
EP1M350F780C6N Présentation
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that an engineer can rewire after manufacturing. FPGAs sit within the broader taxonomy: programmable logic -> logic IC -> integrated circuit -> semiconductor. The Mercury family is an SRAM-based LUT architecture optimized for high-speed serial I/O and short-latency datapaths, and the EP1M350 represents the mid-density tier of that family.
Key features include 350K system gates, 14,400 logic cells, 486 user I/O pins, integrated CDR-capable transceivers to 1.25 Gbps, JTAG-based in-system configuration via the IEEE 1149.1 boundary-scan port, and a 1.8 V core supply with multi-voltage I/O support. The 780-ball FC-FBGA package exposes the full I/O count while keeping the board footprint reasonable for backplane and line-card designs.
The architecture is LUT-based, with dedicated routing resources for the embedded transceivers and PLLs that synthesize the high-speed serial clocks. By integrating CDR up to 1.25 Gbps, the EP1M350 reduces BOM cost in systems that would otherwise require a separate gigabit transceiver chip, and the LUT fabric keeps logic utilization efficient for glue logic, state machines, and low-latency datapaths.
Typical applications include telecom line cards (SONET/SDH aggregation, TDM-to-packet bridges), industrial imaging and video pipeline preprocessing, military/aerospace signal processing, serial backplane bridging (SPI-4.2, RapidIO-lite, custom LVDS links), and legacy ASIC prototyping. Designers typically choose this part when they need a dense, transceiver-rich programmable fabric without migrating to a newer FPGA generation.
When laying out a board for the EP1M350F780C6N, follow the FC-FBGA fanout pattern recommended in the Mercury Family Data Sheet and use matched-impedance routing for the 1.25 Gbps serial links. Decouple each transceiver bank locally and keep the 1.8 V core plane uninterrupted beneath the BGA.
This page synthesizes distributor pricing, same-package drop-in alternatives from the Mercury family, and design guidance not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP1M350F780C6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1M350F780C6N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, RoHS Status, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1M350F780C6
✅ Remplacement direct✓ En stock
$905 / unité
Voir la fiche technique →EP1M350F780C5N
✅ Remplacement direct✓ En stock
$115 / unité
Voir la fiche technique →EP1M350F780C5ES
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$142 / unité
Voir la fiche technique →EP1M350F780C5
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1303 / unité
Voir la fiche technique →EP1M350F78016
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$155 / unité
Voir la fiche technique →EP1M350B780C6
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$125 / unité
Voir la fiche technique →EP1M350F780C6N Valeurs maximales et caractéristiques électriques
| Family | Mercury (EP1M350) |
| Device Type | Loadable Programmable Logic Device (PLD) / FPGA |
| Logic Family | CMOS, SRAM-based LUT |
| System Gates | 350,000 |
| Logic Cells / Elements | 14,400 |
| User I/Os | 486 |
| Integrated Transceivers | Yes, with CDR up to 1.25 Gbps |
| Core Supply Voltage | 1.8 V |
| Boîtier | 780-ball FC-FBGA (FINE LINE BGA-780) |
| Terminal Form | Ball |
| Package Code (JEDEC) | S-PBGA-B780 |
| Température de fonctionnement | 0 C to 85 C |
| Configuration Interface | JTAG (IEEE 1149.1) / passive serial |
| Architecture | Look-up table (LUT)-based, optimized for high-speed serial I/O |
| Total Package Pins / Balls | 780 |
Guide de configuration des broches du EP1M350F780C6N 780
Configuration des broches du EP1M350F780C6N (boîtier 780). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1M350F780C6N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1M350F780C6N convient pour 6 applications: Telecom Line Card Aggregation, High-Speed Serial Backplane Bridging, Industrial Imaging and Video Preprocessing, Legacy ASIC and ASSP Prototyping, Military and Aerospace Signal Processing, Test and Measurement Instrumentation Front-End.
Telecom Line Card Aggregation
The EP1M350F780C6N fits telecom line-card aggregation designs because it integrates CDR-capable transceivers up to 1.25 Gbps alongside 14,400 LUT-based logic cells and 486 user I/Os in a single 780-ball FC-FBGA. Its 1.8 V core supply and multi-voltage I/O simplify interface to SONET/SDH framers and TDM-to-packet bridges, while the 0 C to 85 C commercial grade covers central-office ambient conditions. Designers typically glue the FPGA to a network processor or framer, using the LUT fabric for cell/packet delineation, queuing, and OAM (Operations, Administration and Maintenance) acceleration. The trade-off versus newer Cyclone or Agilex devices is raw logic density and absence of hard PCIe/IP cores, but the Mercury transceiver macros are mature and well-characterized at 1.25 Gbps for backplane reach.
Recommandé
High-Speed Serial Backplane Bridging
For SPI-4.2, RapidIO-lite, or custom LVDS backplane bridging, the EP1M350F780C6N delivers up to 1.25 Gbps per integrated transceiver channel with on-chip CDR, removing the need for an external PHY and shrinking BOM cost. The 780-ball FC-FBGA package exposes enough high-speed pairs plus 486 general-purpose user I/Os to break out multiple serial links and a parallel sideband bus simultaneously. Pair the FPGA with a line-card ASIC or switch fabric, and use the LUT fabric for protocol adaptation, lane alignment, and link-training state machines. Compared with a discrete CDR + CPLD approach, this part reduces board area and simplifies timing closure because the transceiver-to-LUT path is co-designed.
Recommandé
Industrial Imaging and Video Preprocessing
The EP1M350F780C6N suits industrial imaging pipelines where Camera Link, LVDS, or parallel CMOS sensors must be deserialized, Bayer-processed, and repacked before forwarding to a host. With 14,400 LUT cells and 486 user I/Os, it can host pipelined taps for histogram equalization, gamma correction, and region-of-interest extraction in real time at typical line rates. The 1.8 V core and commercial 0 C to 85 C range cover most factory-floor enclosures without derating. Designers should budget 30-40% of the LUTs for image-line buffers in BRAM and reserve transceiver channels for any GigE-Vision uplink. The Mercury toolchain (Quartus II legacy support) keeps bitstream generation deterministic for production flashing.
Recommandé
Legacy ASIC and ASSP Prototyping
Engineers use the EP1M350F780C6N as a prototyping vehicle for mid-complexity ASICs and ASSPs because the 14,400-cell LUT fabric plus 486 I/Os comfortably emulates 200K-300K gates of random logic with room for emulation-specific debug logic. JTAG-based configuration per IEEE 1149.1 enables rapid in-system bitstream swap and runtime instrumentation. The 780-ball FC-FBGA ball pattern mirrors typical mid-density ASIC BGAs, so the prototype board can later accept the ASIC with minimal PCB rework. For timing emulation accuracy, pick the C6 speed grade (this part) over C5 to widen the fMAX margin against synthesis surprises.
Recommandé
Military and Aerospace Signal Processing
Although the EP1M350F780C6N is graded for 0 C to 85 C commercial operation, it is widely used in ruggedized military and aerospace subsystems where a sealed enclosure controls ambient temperature. The integrated 1.25 Gbps transceivers support protected MIL-STD-1553 or custom serial datalinks, and the 14,400-cell LUT fabric runs encryption, encoding, and signal-conditioning state machines. The 780-ball FC-FBGA package offers excellent mechanical robustness on locked-down PCB stack-ups. For programs that need -40 C to +100 C operation, the Mercury family industrial/extended variants (e.g., EP1M350B780I6) are the proper choice; the commercial-grade EP1M350F780C6N itself should not be specified for unaugmented field deployment.
Recommandé
Test and Measurement Instrumentation Front-End
Test and measurement platforms benefit from the EP1M350F780C6N's combination of fast transceiver macros (1.25 Gbps CDR) and a generous LUT budget for real-time DSP glue logic, protocol decoding, and trigger sequencing. The 486 user I/Os are enough to parallel-sample multiple channels and route them into the FPGA for packetization before forwarding over a serial uplink. The 1.8 V core supply keeps power budgets reasonable for portable or rack-mounted instruments. Compared with newer Intel Cyclone devices, the EP1M350F780C6N offers a more mature transceiver macro that many legacy protocol analyzers rely on; switching to a newer family would require re-qualifying the entire measurement chain.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1M350F780C6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1M350F780C6 | EP1M350F780C5N | EP1M350F780C5ES | EP1M350F780C5 | EP1M350F78016 | EP1M350B780C6 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| System Gates | 350,000 | 350,000 | 350,000 | 350,000 | 350,000 | 350,000 | 350,000 |
| Logic Cells | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 |
| User I/Os | 486 | 486 | 486 | 486 | 486 | 486 | 486 |
| Transceiver Data Rate | Up to 1.25 Gbps with CDR | Up to 1.25 Gbps with CDR | Up to 1.25 Gbps with CDR | Up to 1.25 Gbps with CDR | Up to 1.25 Gbps with CDR | Up to 1.25 Gbps with CDR | Up to 1.25 Gbps with CDR |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Principaux différenciateurs
- Integrated CDR-capable transceivers at 1.25 Gbps (vs EP1M350F780C6)
- C6 speed grade for tighter timing closure (vs EP1M350F780C5N)
- Mid-density 14,400-cell LUT fabric in 780-ball FC-FBGA (vs EP1M350B780C6)
- Last-time-buy availability vs. design risk (vs EP1M350F780C5ES)
Notes de conception
The 780-ball FC-FBGA requires a 0.8 mm or 1.0 mm pitch fanout; follow the Mercury Family Data Sheet (DS-MERCURY-2.0) package chapter for the exact ball map. Estimated: with a 4-layer FR-4 stack-up, 8 mil via-in-pad with filled-and-capped plating is recommended to keep the breakout under the BGA. Provide at least 4 square inches of unbroken 1.8 V core plane directly under the package for thermal spreading; the FC-FBGA exposes the die through the top for heatsink attach if needed.
Route the 1.25 Gbps CDR transceiver channels as 100 ohm differential pairs with continuous reference planes on adjacent layers; keep total length under 8 inches for backplane applications to stay within the CDR lock range. Use AC-coupling caps (0.01 uF) at the FPGA ball for each transmit pair per the Mercury transceiver macro guidelines in AN-224. Do not split the reference plane beneath high-speed pairs; serpentine only within the same channel to avoid crosstalk.
Do not assume a newer Intel Quartus version supports the EP1M350 - the Mercury family is maintained on legacy Quartus II (typically Quartus II 9.x or earlier). Loading the bitstream with Quartus Prime will fail. Also: the JTAG configuration pins (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) must each have the pull-up/pull-down values specified in the datasheet or the device will not enter configuration mode reliably on cold boot.
Estimated: with all 486 user I/Os at moderate toggle rate and the transceiver channels active, the EP1M350F780C6N draws roughly 1.5 to 2.5 A from the 1.8 V core rail. Use at least four 0.1 uF + two 10 uF ceramic decoupling capacitors distributed under the BGA, plus a bulk 220 uF polymer cap on the 1.8 V plane. Sequence the I/O voltage (typically 3.3 V or 2.5 V) before or simultaneously with the 1.8 V core to avoid I/O latch-up during power-up.
Estimated: at ambient 25 C and typical telecom workload, the EP1M350F780C6N junction temperature rises roughly 15-25 C above ambient with the recommended 4 sq in copper pour; this gives 35 C-45 C margin to the 85 C commercial limit. For enclosed chassis without airflow, add a small clip-on heatsink on top of the FC-FBGA lid. Always validate with a thermal probe on a representative production board before signing off the mechanical design.
Informations de conformité
RoHS, REACH, lead-free, halogen-free, and conflict-mineral status were not stated in the verified distributor data and are marked unknown. AEC-Q100 is not_applicable because this is an FPGA/PLD, not an automotive-grade qualified IC. The Mercury family predates widespread RoHS harmonization; check Intel FPGA product compliance documentation for the specific finish code.
