EP1M350F780C6 - Mercury FPGA 486 I/O 780-FBGA | Intel / Altera
Référence : EP1M350F780C6 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1302.69 | $1 302,69 |
| 10 | $1195 | $11 950,00 |
| 100 | $1080 | $108 000,00 |
| 500 | $985 | $492 500,00 |
| 1 000 | $905 | $905 000,00 |
EP1M350F780C6 Présentation
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines the architecture of gate arrays with field programmability. FPGAs sit above general-purpose processors and fixed-function ASICs in the design hierarchy, offering hardware-level parallelism, configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon for memory, transceivers, and DSP. They are used when time-to-market, design flexibility, or low-to-mid volume production economics matter more than the per-unit cost of a fixed-function ASIC.
Key features of the EP1M350F780C6 include 486 user I/Os, integrated 1.25 Gbps transceivers with CDR support, a 1.8 V core supply (1.71 V - 1.89 V), commercial operating temperature grade (0 C to 85 C TJ), and CMOS logic family construction. The device is part of Altera's Mercury FPGA family (note: Mercury is a legacy Altera family originally oriented toward high-speed serial I/O applications). The 780-FBGA FineLine BGA package provides a high-density, high-bandwidth interconnect suitable for high-pin-count designs.
Architecturally, the Mercury family combines programmable logic elements with hard multi-gigabit transceivers, enabling protocols such as Gigabit Ethernet, SONET, and Fibre Channel to be implemented directly in the FPGA fabric. The on-chip CDR eliminates external clock-recovery components in serial-link designs. Operating temperature is rated 0 C to 85 C (commercial grade), with supply at 1.71 V to 1.89 V (nominal 1.8 V).
Typical applications include high-speed serial backplane interfaces, telecom line cards, data communication switches, and protocol bridge designs where integrated transceivers reduce bill of materials. The wide 486-I/O count supports parallel data-path expansion to external memory and bus interfaces.
Design tip: route the high-speed serial differential pairs with controlled 100-ohm differential impedance and keep lengths matched within the CDR tolerance window. Place decoupling capacitors as close as possible to each power pin group on the BGA.
This page synthesizes distributor pricing, drop-in package-compatible alternatives from the same Altera Mercury family, and practical design guidance - information not consolidated on a single manufacturer page.
Alternatives de remplacement direct pour EP1M350F780C6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1M350F780C6 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Family, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1M350F780C7
✅ Remplacement direct✓ En stock
$162 / unité
Voir la fiche technique →EP1M350F780C5
✅ Remplacement direct✓ En stock
$1303 / unité
Voir la fiche technique →EP1M350F780C5N
✅ Remplacement direct✓ En stock
$115 / unité
Voir la fiche technique →EP1M350B780C6
✅ Remplacement direct✓ En stock
$125 / unité
Voir la fiche technique →EP1M350B780C7
✅ Remplacement direct✓ En stock
$92 / unité
Voir la fiche technique →EP1M350F780C6 Valeurs maximales et caractéristiques électriques
| Manufacturer | Intel (formerly Altera) |
| Series | Mercury FPGA |
| Logic Family | CMOS |
| Number of User I/Os | 486 |
| Total Pins / Balls | 780 |
| Boîtier | 780-FBGA (FineLine BGA), 29 mm x 29 mm |
| Type de montage | Surface Mount |
| Core Supply Voltage | 1.8 V (1.71 V to 1.89 V) |
| Température de fonctionnement | 0 C to 85 C (TJ, commercial grade) |
| Integrated Transceivers | Yes, up to 1.25 Gbps with CDR support |
| Statut RoHS | Non-compliant (per one distributor listing) |
| Package Style | Bulk tray per distributor listings |
| Device Type | FPGA (Field Programmable Gate Array) |
| Programmable Logic Type | In-system programmable |
Guide de configuration des broches du EP1M350F780C6 bulk tray per distributor listings
Configuration des broches du EP1M350F780C6 (boîtier bulk tray per distributor listings). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1M350F780C6.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1M350F780C6 convient pour 6 applications: Gigabit Ethernet Line Card, SONET/SDH Framer Equipment, Fibre Channel Storage Switch, Industrial Backplane Protocol Bridge, Telecom Test and Measurement Equipment, Defense/Aerospace Serial Link Card.
Gigabit Ethernet Line Card
The EP1M350F780C6's integrated 1.25 Gbps transceivers with on-chip CDR make it well-suited for Gigabit Ethernet line cards in switches and routers. The 486 user I/Os provide ample parallel bandwidth to a network processor or ASIC host, while the 780-FBGA package supports the high-density routing required for backplane interfaces. Designers can implement MAC, PCS, and SERDES functions in a single device, eliminating external PHY chips. The 1.8 V core supply integrates cleanly with standard 1.8 V ASIC host rails. Compared with later-generation transceivers (>10 Gbps), the 1.25 Gbps links target GbE and OC-12 SONET deployments rather than 10G/40G/100G aggregation.
Recommandé
SONET/SDH Framer Equipment
Telecom SONET/SDH framer equipment benefits from the EP1M350F780C6's 1.25 Gbps transceivers for OC-12 (STM-4) optical interfaces. The on-chip CDR simplifies clock-recovery circuits, while the 486 I/Os enable parallel connection to mapper ASICs and network processors. The Mercury family's serial-link optimization directly targets STS/STM framing applications. Operating at 1.71 V to 1.89 V core supply with commercial 0 C to 85 C temperature, the device suits central-office deployment. The 780-ball FBGA package accommodates the necessary power and ground balls for clean analog supply isolation.
Recommandé
Fibre Channel Storage Switch
Fibre Channel switches at 1G FC (1.0625 Gbps) leverage the EP1M350F780C6's transceiver rates for storage-area-network port aggregation. The 486 I/Os enable high-density FC port counts per device, and the integrated CDR reduces BOM cost versus external SERDES designs. Commercial 0 C to 85 C operation fits storage-switch chassis thermal envelopes. The Mercury family's CMOS logic implementation provides deterministic latency required for storage protocols. Compared with purpose-built FC switch ASICs, the FPGA approach allows late-binding protocol updates and field reconfiguration.
Recommandé
Industrial Backplane Protocol Bridge
Industrial backplane protocol bridges converting between legacy serial protocols (V.35, RS-530, etc.) and modern Ethernet benefit from the EP1M350F780C6's flexible transceiver rates and 486 I/O count. The BGA package supports the high pin density needed for both serial and parallel interfaces on a single board. With 1.8 V core supply and CMOS construction, the device integrates with industrial 3.3 V/1.8 V power trees. For -40 C to 85 C industrial deployment, the EP1M350B780C6 industrial variant is the drop-in replacement. Designers can implement multiple protocol channels per FPGA, reducing bridge card count.
Recommandé
Telecom Test and Measurement Equipment
Telecom test equipment such as BERT (Bit Error Rate Tester) and protocol analyzers leverage the EP1M350F780C6's CDR transceivers for multi-rate signal generation and analysis at 1.25 Gbps. The 486 I/Os enable parallel capture and stimulus routing for production test racks. Field programmability allows test vendors to update protocol support without board respin. The 780-FBGA package provides ample GND balls for shielding sensitive analog test paths. Per the Mercury family datasheet, the device supports the loopback and pattern-generation features common to FPGA-based test platforms.
Recommandé
Defense/Aerospace Serial Link Card
Defense and aerospace serial-link applications use the EP1M350F780C6 for MIL-STD-1553 bridges, ARINC 429 aggregation, and high-speed serial sensor interfaces. The 486 I/Os support multiple redundant channels, and the integrated CDR simplifies radiation-tolerant link designs. For rugged temperature deployment, the EP1M350B780I6 industrial variant extends operating range. The 780-FBGA package, while requiring careful PCB layout, supports the dense routing required for multi-channel avionic systems. Compared with newer radiation-hardened FPGAs, Mercury provides a cost-effective COTS option for non-rad-hard deployments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1M350F780C6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1M350F780C7 | EP1M350F780C5 | EP1M350F780C5N | EP1M350B780C6 | EP1M350B780C7 |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (FineLine BGA), 29x29 mm | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | C6 (speed grade 6, commercial) | C7 (faster) | C5 (slower) | C5N | B6 (industrial temp, speed 6) | B7 (industrial temp, speed 7) |
| Temperature Grade | Commercial, 0 C to 85 C | Commercial, 0 C to 85 C | Commercial, 0 C to 85 C | Commercial, 0 C to 85 C | Industrial, -40 C to 85 C | Industrial, -40 C to 85 C |
| User I/Os | 486 | 486 | 486 | 486 | 486 | 486 |
| Core Supply | 1.8 V (1.71 V to 1.89 V) | 1.8 V (1.71 V to 1.89 V) | 1.8 V (1.71 V to 1.89 V) | 1.8 V (1.71 V to 1.89 V) | 1.8 V (1.71 V to 1.89 V) | 1.8 V (1.71 V to 1.89 V) |
| Transceivers | Up to 1.25 Gbps with CDR | Up to 1.25 Gbps with CDR | Up to 1.25 Gbps with CDR | Up to 1.25 Gbps with CDR | Up to 1.25 Gbps with CDR | Up to 1.25 Gbps with CDR |
| Lifecycle Status | NRNR (Not Recommended for New Designs) | NRNR | NRNR | NRNR | NRNR | NRNR |
Principaux différenciateurs
- Speed grade 6 within Mercury family (vs EP1M350F780C7)
- Integrated 1.25 Gbps CDR transceivers (vs Non-Mercury Altera FPGAs)
- FineLine 780-FBGA package with 486 user I/Os (vs EP1M120F484C6)
Notes de conception
The 780-ball FineLine BGA requires a multilayer PCB (typically 8-12 layers) with microvia or via-in-pad construction to fan out the dense 1.27 mm pitch ball array. Use a controlled-impedance stack-up with 100-ohm differential impedance for the high-speed transceiver pairs and 50-ohm single-ended for LVCMOS I/Os. Place GND balls on inner layers as stitched planes with at least one stitching via within 100 mil of every signal transition via to control return-path inductance.
Route the 1.25 Gbps transceiver differential pairs with 100-ohm differential impedance and intra-pair length matching within 5 mil to meet the on-chip CDR tolerance. Avoid crossing reference-plane splits; maintain a continuous GND reference under the entire transceiver channel. Use AC-coupling capacitors (0.01 uF to 0.1 uF) at the transmitter output, per the Mercury family datasheet reference design. The receiver inputs typically require external 100-ohm differential termination.
Do not assume Mercury FPGAs are 5 V tolerant - the LVCMOS I/Os operate at 1.5 V to 3.3 V depending on bank configuration. Mixing 3.3 V and 1.8 V signals requires careful bank-voltage planning. Also note that the Mercury family is NRNR (Not Recommended for New Designs); for new designs, evaluate Cyclone III/IV or Stratix equivalents unless a long-term supply agreement exists. Verify pinout against the Mercury family datasheet - the FBGA ball map differs from package outline dimensions and must be matched exactly.
Estimated: at typical Mercury utilization (~50% logic, all transceivers active), core current draw is in the 1.5 A to 3 A range from the 1.8 V supply. Place a 100 uF bulk capacitor plus 0.1 uF and 0.01 uF ceramic decoupling on every power pin group, with the 0.01 uF within 50 mil of the BGA ball. Transceiver analog supplies (if separate) should be filtered with ferrite beads to isolate PLL noise from the digital core.
Informations de conformité
RoHS non-compliant per alterachips.com distributor listing; other compliance fields not confirmed in public data.
